Applications

APPLICATIONS ARTICLES



Rice U. researchers unveil Internet of Things security feature

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

ESI receives significant Asia order for flex PCB laser via drilling solution

02/19/2019  Electro Scientific Industries (ESI), a division of MKS Instruments, Inc. and an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced an order for its recently-released CapStone laser drilling solution for processing flexible printed circuits (FPC).

UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing

02/15/2019  Addresses complex multicore systems for automotive, storage, at-scale computing.

Sensor accuracy: Critical metric in automotive, industrial, consumer markets

02/13/2019  As group vice president of the Analog & MEMS Group and general manager of the MEMS Sensor division at STMicroelectronics, Andrea Onetti brings nearly three decades of experience in MEMS, sensors and audio systems to his leadership role at one of the world’s most successful electronics and semiconductor manufacturers.

STMicroelectronics reveals motion sensor with machine learning for high-accuracy, battery-friendly activity tracking

02/11/2019  STMicroelectronics has integrated machine-learning technology into its advanced inertial sensors to improve activity-tracking performance and battery life in mobiles and wearables.

IDT and Telink Semiconductor announce partnership on integrated sensor platforms

02/08/2019  Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology, Inc. (IDT) and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications.

ePaper 2.0: Color and video come to electronic paper

02/08/2019  With over 25 years of experience in the technology industry, Sri Peruvemba, CMO of CLEARink Displays, is a longtime advocate of electronic display technology.

STMicroelectronics to acquire majority stake in silicon carbide wafer manufacturer Norstel AB

02/07/2019  STMicroelectronics today announced it has signed an agreement to acquire a majority stake in Swedish silicon carbide (SiC) wafer manufacturer Norstel AB.

CEA-Leti combines integrated optics and holography in novel, lens-free augmented reality technology

02/06/2019  Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography.

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council

02/06/2019  SEMI today announced the appointment of John Chong, vice president of product and business development at MEMS manufacturer Kionix, as Governing Council chair of the SEMI-MEMS & Sensors Industry Group.

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies

02/06/2019  This year’s MEMS & Sensors Technical Congress(MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards.

CEA-Leti builds prototype of next-generation mid-infrared optical sensors for portable device

02/05/2019  CEA-Leti today announced it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices.

LPKF offers glass foundry service for advanced IC and MEMS packaging solutions

01/25/2019  Laser systems specialist LPKF Laser & Electronics, based in Hannover, Germany has added a foundry service for thin glass substrates to its product portfolio.

Development of MEMS sensor chip equipped with ultra-high quality diamond cantilevers

12/20/2018  Progress in the development of highly reliable and sensitive diamond MEMS sensors.

FLEX 2019 and MSTC to highlight SMART medtech, transportation and IoT innovations

12/19/2018  Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short courses at the co-located FLEX 2019 and MEMS & Sensors Technical Congress (MSTC) in Monterey, California, February 18-21, 2019.

Graphene's magic is in the defects

12/18/2018  NYU researchers offer major new insights for precise engineering of ultra-small, ultra-sensitive electrochemical sensors.

Novel laser technology for microchip-size chemical sensors

12/10/2018  'Frequency combs' are optimally suited for chemical sensors; a revolutionary technology developed at TU Wien (Vienna) now produces these laser frequencies in a much easier and more robust way.

Vertiv completes acquisition of MEMS maintenance business

12/06/2018  Vertiv announced today that it has completed the purchase of the maintenance business of MEMS Power Generation (MEMS), a privately-owned company headquartered in the United Kingdom that specializes in temporary power solutions.

Artificial synapses made from nanowires

12/05/2018  Scientists from Jülich together with colleagues from Aachen and Turin have produced a memristive element made from nanowires that functions in much the same way as a biological nerve cell.

Qualcomm launches $100M AI investment fund

11/30/2018  Qualcomm Incorporated today announced the launch of the Qualcomm Ventures AI Fund to invest up to an aggregate of $100 million in startups transforming artificial intelligence.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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