Category Archives: 3D Integration

August 10, 2005 – RoseStreet Labs (RSL), Phoenix, AZ, has announced the opening of its 3D Research and Development laboratory for next-generation semiconductor packaging, as well as an alliance with Suss MicroTec, which will provide the lab with a full suite of lithography and 3D packaging equipment. RSL and its subsidiary, FlipChip International, develop packaging materials and processes used in wireless products. RSL R&D offers contract R&D services in addition to its internal R&D work in support of FlipChip International’s flip-chip and wafer-level packaging product lines.

Bob Forcier, RSL president and CEO, said, “This opening of our new R&D lab and our alliance with our close partner, Suss MicroTec, is part of our five-year technology roadmap to provide next-generation solutions to our valued customers in the areas of wafer-level MEMs, sensor, system-in-package, and advanced 3D packaging.”

March 2, 2005 – Ziptronix has appointed 17-year semiconductor industry veteran Phil Nyborg as its new president and CEO. The company said that Nyborg will guide it as it more fully commercializes its proprietary bonding and interconnect processes for 3DICs.

As the former chief executive of two semiconductor companies, Nyborg will pinpoint market segments in the electronics industry where Ziptronix’ 3D technology will prove to be most useful, and will help Ziptronix continue to build relationships with key players in the 3DIC supply chain and related design infrastructure.

“Ziptronix has developed an impressive portfolio of intellectual property that I believe holds solutions to a number of vexing problems facing the industry,” Nyborg said.

Mitch Mumma, a member of Ziptronix’ Board of Directors and a general partner with Intersouth Partners adds, “Phil brings an outstanding record of successfully commercializing semiconductor technology and we are thrilled that he is on board.”

Prior to being named president and CEO of Ziptronix, Nyborg served as CEO at JAM Technologies of Boston. Prior to that, Nyborg was president and a founder of ONEX Communications, a producer of high-speed, telecommunications SoC integrated circuits. Over the course of his career, Nyborg has played a key role in new product and service introductions at SALIX (acquired by Tellabs), Whistle Communications (acquired by IBM), TRW, Ameritech/SBC, Transwitch, Hewlett-Packard, MCI and others.

APEX EXTRAVAGANZA


March 28, 2003

Semi-automatic Screen Printers
The Viking-class Horizon 05 platform featuring fully automatic vision alignment has adjustable stencil mount and extensive networking capabilities. Viking-class machines will accept stencils up to 29 x 29″, and reportedly can be upgraded to pass-thru capability as business requirements evolve. Advanced options are said to include automatic paste dispensing, ProFlow, 2-D inspection with advanced optics and lighting. Vortex underscreen cleaning may be specified at manufacture or added later as machine performance upgrades. DEK, Zurich, Switzerland Booth 2225

Tessera Announces Symposium on 3D Packaging, Advanced Packaging Media Sponsor
SAN JOSE, CALIF.
As part of its ongoing efforts to educate and elevate awareness of advanced packaging technologies, Tessera Inc., a premier technology developer and services provider for chip-scale and multi-chip packages (CSPs and MCPs), announced it will host a half-day symposium on 3D packaging technologies during the week of SEMICON West 2003. Speakers and panelists will include a number of leading technologists from premier companies throughout the electronics manufacturing, assembly, and packaging supply chain.

Amkor to expand development of 3D IC packages

April 5, 2001 – West Chester, PA – Amkor Technology is expanding its development and qualification of 3D IC packages in order to reduce production costs and handling time. 3D or stacked ICs also require less space, have higher reliability and better electrical performance than the combination of devices they replace, the company said.

The company’s 3D packaging options include die stacked three- or more high, stacked die of the same or different sizes and side-by-side 3D die stacks. 3D assembly techniques allow interconnect technologies to be combined within the package, according to Amkor.

Another advantage of 3D packaging, the company said, was that stacked die reduce the length of interconnects between the devices, providing better performance. Moreover, 3D packages only require a single substrate, while individually packaged ICs each require its own high-density interconnect substrate.

Since 1999, Amkor has been shipping 3D IC packages used in cellular phones, routers, switches and other emerging technologies.

For the year 2001, 3D package volumes will climb to 230 million units, according to analyst Tech Search International. The firm expects a 50% market growth to 348 million by the end of 2002 for all applications.