Category Archives: LED Packaging and Testing

July 17, 2012 – BUSINESS WIRE — Intematix Corporation, phosphor and phosphor component developer for light-emitting diodes (LEDs), plans to conduct a registered initial public offering (IPO) of its common stock.

The IPO is expected to commence after the Securities and Exchange Commission (SEC) completes the review process initiated by Intematix’s confidential submission on July 13, 2012 of its draft registration statement, subject to market and other conditions.

Phosphors help control LED luminous efficacy and color to bring the technology on a level with traditional lighting. Phosphors used in LED lighting applications will see a market increase to over $1.6 billion by 2019, according to a recent NanoMarkets report.

Cree, Philips, and Intematix are the three major players in remote phosphors, a developing sector of LED phosphors that can reduce costs and increase light quality control.

IPO details: This announcement is being made pursuant to and in accordance with Rule 135 under the Securities Act of 1933. As required by Rule 135, this press release does not constitute an offer to sell or the solicitation of an offer to buy securities, and shall not constitute an offer, solicitation or sale in any jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of that jurisdiction.

Intematix Corporation is a materials developer making customizable, patented phosphors and remote phosphor components for high-quality, energy-efficient LED lighting. To learn more about the company, please visit www.intematix.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 16, 2012 — In the July/August issue of Solid State Technology’s sister publication, LEDs Magazine, Lily Li, patent strategist at IP Checkups, examines remote phosphors for light-emitting diode (LED) bulbs, in “Patents compete for priority in the remote-phosphor LED technology space.” Phosphors modulate the color of LED-produced light. For better thermal reliability and system-level design flexibility, LED chips are grouped in modules or bulbs with remote phosphor-coated ceramic plate.

Remote-phosphor technology for LED lighting applications is a hotbed of innovation, with companies such as Intematix and Cree leading the way, Li says. “Remote phosphor addresses a fundamental pain point in the solid-state lighting industry and the one main barrier to widespread adoption of LEDs: cost, cost, cost. But intellectual property concerns cloud the picture for remote-phosphor usage.”

Li considers the advances in remote phosphor technology from Cree and Intematix, noting that Philips has an impressive remote phosphor technology roster, but the company also has access to Cree’s patents, and therefore was not included. “Given the potential size of the LED lighting market, and the revolutionary nature of remote phosphors to the industry, a battle already rages on for ownership of the fundamental technology behind remote phosphors” between Cree and Intematix.

Li also explains why remote phosphors are used and how they change the cost composition of an LED product.

Figure from the article: Company comparison of phosphor technologies and applications. Publications from 01/01/2009 to 02/01/2012.

Read this article, published in the July/August 2012 issue of our sister publication, LEDs Magazine, here.

Also read: In "Phosphor trends for LED manufacturing," Barclays Capital shares some take-aways from the Intertech Pira Phosphor Summit, touching on LED efficiency and quality from phosphors, color mixing, remote phosphors, and silicone encapsulants for LED packages.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 16, 2012 — The price of a light-emitting diode (LED) bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding “balance of system” elements — thermal management, drivers and optics — to push costs lower.

Costs of the central LED chip package will fall by more than 70% to $2.14 in the next decade, but this makes up just 19% of the bulb costs in 2020. To drive overall costs lower, the related system elements will need to see similar cost reductions.

Read about blogger Dr. Phil Garrou’s costs saving analysis of an LED bulb in Bidding Adieu to Lester Lightbulb and Lester the Lightbulb vs CFL and LED : the Saga Continues

“We find that today’s balance of system technology solutions fall short of the dramatic cost reductions needed to mirror the LED package,” said Pallavi Madakasira, Lux Research Analyst, adding that existing alternatives are ineffective and uneconomical.

Lux Research analysts studied the key LED cost stack components of a 60 W incandescent equivalent LED bulb as well as the technologies available to accelerate cost cuts in order to understand the true pathways to LED bulbs’ potential. “LED lighting is by no means standardized, and potential disruptions to the component stack abound,” Madakasira said.

Thermal management is the biggest target for cost reduction past the package. Active thermal management technologies such Nuventix’s SynJet will lead to cost savings over aluminum-based solutions, but only from 2017 on.

Dimmable drivers are priced at a premium to non-dimmable ones because they enable precise control of the light output and lead to energy savings. Innovation in this area will bring about a 1% cost saving in 2020, boosting the performance of the LEDs overall.

Secondary optics account for about 5% of the total cost of a 60 W equivalent LED bulb. The field is dominated by specialists such as Ledil, Khatod, and Fraen, and innovation lies in improving the shape of the beam and the ability to collect more light from primary optics.

The report, Cheaper, Brighter, Cooler: The Need for Cost Reduction Past the Package, is part of the Lux Research Energy Electronics Intelligence service. Lux Research provides strategic advice and intelligence for emerging technologies. Visit www.luxresearchinc.com for more information.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 2, 2012 – BUSINESS WIRE — SemiLEDs Corporation (NASDAQ:LEDS) combined its vertical light-emitting diode (LED) chip architecture with a proprietary metal alloy substrate to create the Enhanced Vertical (EV) LED product line.

The EV LED has been designed to have higher thermal endurance for better reliability at higher temperatures. It also offers excellent optical output and high thermal conductivity, according to the company.

The LEDs are sampling in blue, green, and UV and chip sizes of 0.4mm2 through 1.5mm2.

Also read: SemiLEDs, LG Siltron, Epistar install Veeco MOCVD tools

SemiLEDs develops and manufactures LED chips and LED components for general lighting, including street lights and commercial, industrial and residential lighting, along with specialty industrial applications such as UV curing, medical/cosmetic, counterfeit detection, and horticulture. SemiLEDs sells blue, green and ultraviolet (UV) LED chips. For more information, visit www.semileds.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

June 28, 2012 — SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the light-emitting diode (LED) and organic LED (OLED) events taking place during SEMICON West.

Wednesday, July 11

10:30am-3:30pm

Enabling the Next Generation of HB LEDs

We’ve invited industry experts from across the globe to talk about practical solutions for enabling the economics for the solid state lighting market to take off, focusing particularly on significant new developments in manufacturing technology. The morning addresses some big-picture topics, with Cree’s Mike Watson discussing business model issues, and Canaccord Genuity’s Jed Dorscheimer examining the impact of improving yields on his projections for wide market adoption. Everlight Electronics’ Ilkan Cokgor focuses on potential solutions for reducing the high cost of packaging. Lunera’s Steve Paolini looks at options beyond blue LED emitters. LayTec’s Kolja Haberland discusses the potential impact of in-situ metrology on yield, while EVG’s Thomas Uhrmann talks about better light extraction with efficient alternatives for nano-patterning sapphire.

The afternoon program looks at the status of some potentially disruptive technologies.

Soraa’s Mike Krames updates on GaN-on-GaN technology, while Lattice Power’s Hanmin Zhao presents results of their GaN-on-Si production, and Yole Développement’s Eric Virey gives an overview the state of GaN-on-Si technology across the industry. Seoul Semiconductor’s Brian Wilcox looks at the potential for AC and UV technologies. James Zahler of GT Advanced Technologies shares results of research on which substrate defects turn out to really matter most. And Dan Morrow of Op-Test shows data on using radiometric color measurements to predict final device performance. http://www.semiconwest.org/node/8501 

Location: Extreme Electronics TechXPOT

Back right-hand corner of Moscone South Hall

 

10:00am-6:00pm

Metal Oxide TFT Devices and Technology Workshop

FlexTech Alliance presents a workshop on the state of low temperature, low cost metal oxide TFTs for OLED and LCDs, with speakers from Sharp, CBRITE, PARC, BizWitz, Cambridge NanoTech, Oregon State, Penn State, Eastman Kodak, and Arizona State. Separate registration required. http://www.semiconwest.org/node/9156

Location: San Francisco Marriott Marquis Hotel, 55 Fourth Street (Fourth & Mission), near Moscone Center

3:30-5:00pm

SEMICON West Happy Hour

Location: South and North Halls

 

Thursday, July 12

10:30-11:45

Plastic/Flexible Electronics program looks at the state of OLED lighting technology

The program on printed/flexible electronics also covers OLED technology this year.

Panasonic’s Takuya Komoda will report on the lower- cost production technology enabling the company’s joint venture commercial OLED lighting products. Display Search’s Jennifer Colegrove gives an update on the state of the OLED market and technology for lighting and displays. IMEC’s Serge Biesemans discusses that research institute’s OLED flexible electronics work. http://www.semiconwest.org/node/8536

Location: Extreme Electronics TechXPOT

3:00 PM to 5:00 PM

 

HB-LED Standards Committee Meeting

The HB-LED Standards Committee will review progress towards 150mm sapphire wafer specifications, automation specifications, and evaluation of wafer defects. The wafer task force will report on progress on its sapphire wafer specifications, and on the available results from its cooperative research effort on the survivability of various wafer marks. The automation task force will update on its progress on specifications for open cassettes, load ports, and software communications interfaces. The new task force on wafer impurities and defects will discuss results from its survey on which sapphire defects matter most and how best to inspect for them. See Standards SEMICON West 2012  for more information and to register.

Location: San Francisco Marriott Marquis Hotel, 55 Fourth Street (Fourth & Mission), near Moscone Center

For more information on SEMICON West 2012, please visit www.semiconwest.org. Register now.

June 20, 2012 — LUXeXcel introduced its one-step 3D Printoptical printing process for plastic optics for lighting fixtures. The optics can be custom manufactured from a CAD model, on demand, at prices competitive with injection molding. The manufacturing process eliminates molds and tooling.

LTI Optics’ Photopia Parametric Optical Design Tools module enables creation of optical designs to achieve a prescribed distribution of light. All of the key aspects of the design that affect the light control are parameterized in ways meaningful to optical design. Lighting manufacturers can combine Photopia software for creation and verification of CAD models with LUXeXceL’s Printoptical technology for mass customized manufacturing. LUXeXcel reports that initial product development costs and working capital requirements are reduced with this system, enabling a wider product range.

Photopia was originally developed to “enable simulation study of alternative designs prior to incurring the high expense of tooling for an optic to be physically produced,” said Mark Jongewaard, president of LTI Optics. “Now as a software partner for LUXeXceL’s zero-tooling Printoptical manufacturing services, Photopia has a second value proposition to enable rapid custom variations of a proven design for immediate manufacture.”

According to Richard van de Vrie, CEO of the LUXeXceL Group, “The combination of Photopia software and Printoptical manufacturing is the digitization of plastic optics design and fabrication.  A Photopia design becomes a digital “mold,” enabling any correction or change to be implemented immediately.  The Printoptical manufacturing service is on-demand with an economic order quantity of one (EOQ1), so inventory is also digital, requiring minimal working capital and eliminating write-offs of obsolete stock.”

LTI Optics develops and sells the Photopia optical design software and provides optical design consulting services.  For more information, please visit www.ltioptics.com.

LUXeXceL Group BV, is the inventor and exclusive provider of Printoptical fabrication services, the new digital 3D printing technology which enables prototyping and manufacture of plastic optics for the lighting industry and other applications. For more information, please visit www.luxexcel.com

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

June 18, 2012 – PRWEB — Daewon Innost achieved what it says is the light-emitting diode (LED) industry’s best thermal dissipation performance on its Glaxum LED Array family of chip on board (COB) modules. The proprietary Nano-Pore Silicon Substrate (NPSS) technology developed by Daewon Innost led to thermal impedance of 0.41°C/W.

Daewon Innost’s NPSS is created by applying semiconductor lithography to silicon wafers, allowing for 50µm-pitch interconnection between gallium nitride (GaN) LED chips; conventional metal-core printed circuit boards (MCPCBs) cannot drop below 300µm pitches. The COB modules are fabricated with high-efficacy, commercially available 1W LED chips. An LED chip supplier independently tested the modules.

“Our Glaxum module runs over 12°C cooler than the previous top performing COB module,” said Sungyuk ‘Stephen’ Won, CEO of Daewon Innost, noting that generally 1°C lower operating temperature = an extra 1000 hours of lifetime.

The Glaxum NPSS modules are available in models ranging from 3.5 to 100W. The models with lowest thermal impedance are Glaxum-MCL-GL-WC-020-002 (warm white) and the Glaxum-MCL-GL-CC-020-002 (cool white). Tested voltage and current value of Glaxum module is 16.6 V, 1.2 A, respectively.

Daewon Innost was founded in 2011 as a spin-off from Daewon SPIC, a leading company in the global semiconductor packaging industry, to focus on LED lighting. Learn more at http://www.dwinnost.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

ECTC


June 15, 2012

June 15, 2012 — San Diego, CA, hosts the annual ECTC (Electronic Component Technology Conference) every three years. Attendance at this year

June 14, 2012 – Marketwire — Light-emitting diode (LED) maker Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.

Luminus Devices combined proprietary processes, new specialty materials and assembly equipment to achieve the thermal reduction. The thermal manangement improvement results in up to 20% higher brightness levels, while maintaining current reliability during operation. It also simplifies system-level design.

These higher-brightness LED chips will be used in applications such as projection displays, said Arvind Baliga, VP of engineering at Luminus Devices, where the chips can help shrink projector size and cost. Other possible applications include high-brightness wash lights and spot lights for entertainment.

Luminus is currently sampling products based on this new technology; production quantities will be available next quarter.

Luminus Devices develops and manufactures LED technologies and solutions. For more information, visit www.luminus.com

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

June 13, 2012 — MicroSense LLC, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech Inc., developer of high-sensitivity metrology tools for light-emitting diode (LED), micro electro mechanical system (MEMS), and semiconductor manufacturing.

“SigmaTech’s customers and prospects will continue to be supported by the existing SigmaTech employees, all of whom will stay with the combined business,” said James Pelusi, Chairman and CEO of MicroSense.

MicroSense gains leading-edge wafer inspection tools for its metrology portfolio, with systems that integrate optical spectrometry, interferometry, SigmaTech’s patented auto-positioning back pressure (APBP) technology and other sensing tools. MicroSense will integrate its capacitance sensors into SigmaTech metrology platforms. SigmaTech took the 2011 Best of West award at SEMICON West. The MicroSense high-resolution capacitive sensor technology provides “an ideal path to increasing throughput” of SigmaTech metrology systems and expanding its applications, said Jacques Fauque, semiconductor industry veteran and founder of SigmaTech who will remain with the business and continue to lead its development.

MicroSense’s capacitive sensors enable precise, high-bandwidth measurements of solar wafers, hard disk drive (HDD) motors, air bearing spindles, precision X-Y stages, optical disks, automotive parts and machine tools. Leading equipment manufacturers around the world use MicroSense capacitive sensors in wafer lithography systems, solar wafer sorters, autofocus mechanisms, nanopositioning stages, metrology tools and flat panel display manufacturing equipment.

MicroSense supplies capacitive sensors, metrology modules, and magnetic metrology tools. Learn more at www.microsense.net.

SigmaTech offers automated metrology solutions for a broad range of standard and specific applications in the field of semiconductor wafers, materials and optics. SigmaTech has multiple system installations at many of the world’s leading semiconductor manufacturing companies and stands at the forefront of the dimensional wafer metrology industry. SigmaTech currently offers multiple gauging technologies that can be implemented to provide the optimal solution for virtually any customer application. Learn more at http://www.sigma9600.com/.