(August 25, 2010 – BUSINESS WIRE) — Nanocomp Technologies Inc. was awarded a multi-million dollar Phase II contract by the United States Air Force Research Laboratory (AFRL) under the Department of Defense’s Small Business Innovation Research (SBIR) program. The contract is to advance CNT-based materials use in EMI shieldingand ESD components.
Northrop Grumman Aerospace Systems and Cytec Engineered Materials will participate with Nanocomp in this Phase II program.
The Phase II award builds upon Nanocomp’s successful demonstration, under its SBIR Phase I contract predecessor, that large-format CNT sheets can meet the functional requirements of EMI shielding, as well as withstand the industrial stresses involved in pre-pregging, a process that prepares the material for direct insertion into aircraft manufacturing systems. Nanocomp’s Phase II program is structured to optimize its material’s functional properties for shielding requirements and scale up production volume, while decreasing the cost of finished CNT-based pre-pregged products.
“This is an incredible day for Nanocomp Technologies, as we continue to be recognized as a company that is delivering on the promise of carbon nanotube technology,” said Peter Antoinette, president and CEO of Nanocomp Technologies, Inc. “We’re turning the corner from ‘potential’ to ‘proven’ in several commercially important applications and are now directing our focus on scaling for insertion into various Air Force systems. In short, our vision for delivering products with a meaningful path to volume scale is moving closer to fulfillment with every passing day.”
The SBIR program is funded by 11 federal agencies from research and development budgets. It is designed to simultaneously stimulate technological innovation among private sector small businesses such as Nanocomp Technologies and to increase the commercialization of new technology through federal R&D.
Nanocomp Technologies, Inc. researches and produces long carbon nanotubes and fabricates them into strong, lightweight and electrically conductive yarns and sheet products. For additional information, please visit www.nanocomptech.com
(August 25, 2010) — In August 2010, the Semico inflection point indicator (IPI) index experienced its first drop since December 2009. The Semico IPI Index signals changes in the direction of semiconductor sales growth one year in advance.
Semico Research’s growth rate for semiconductor sales already assumes a slower year in 2011 at 13% year over year (YOY) growth compared to the 31% growth in 2010.
"The IPI drop was small and one month is not a trend, so we will not be making any major changes to our forecast numbers yet," said Jim Feldhan, president, Semico Research. "But we will be keeping our eye on what happens to the Index next month." Listen to a podcast with Feldhan about the market forecast.
The big question is whether the foundries and memory manufacturers will be able to control spending in the first half of 2011 in order to avoid an over-capacity situation in the second half of 2011 and into 2012.
The Semico IPI Index tracks 14 weighted, worldwide economic and semiconductor market factors including semiconductor sales, inventories, and printed circuit board (PCB) sales. Semico’s IPI accurately predicted the upturn in semiconductor sales that occurred in February/March 2009 when the IPI Index increased in February 2008.
In addition to the IPI variables, Semico’s forecast outlook considers the semiconductor production capacity landscape as well as consumer and business electronic buying trends. After experiencing two years of underinvestment, tight capacity and shortages in certain product segments have driven up prices this year, but huge capital investment projects are helping the industry to catch up.
Although Semico believes electronic devices will continue to be a ‘must-have’ for most consumers, the volatile economic situation in both the U.S. and Europe will determine whether we wait for bargain sales or splurge on the latest iPad for holiday gift giving.
To subscribe to the Semico IPI, contact Sam Caldwell at [email protected] or 602.214.9697.
(August 24, 2010) — Continental Corporation applied economic conveyor and handling modules from IPTE’s EasyLine product portfolio to link its gold and aluminum wire bonding, mounting, and AOI areas. The set up and economic benefits are detailed below.
In every electronics-manufacturing environment, optimum efficiency and profitability are of paramount importance. To realize these advantages, the linking of different production steps can render significant improvements. Automotive-device supplier Continental Corporation (Nuremberg branch) linked together the placement line in the chip and wire manufacturing area and the process zones of bonding and automated optical inspection (AOI). Conveyor and handling modules from the EasyLine equipment portfolio of IPTE Factory Automation (FA) were used.
Continental Corp.’s Nuremberg location is its worldwide competence center for hybrid technology. At this site, Continental Corp. manufactures control units, based on ceramic substrates, for automated gearbox systems used in the automotive industry. A range of surface mount devices (SMDs) and naked (unmolded) semiconductors (bare die) are placed on these small substrates, and a certain amount of diverse wire-bonding operations have to be added for the necessary interconnections, using an assortment of gold and aluminum wires with diameters from 25 to 400 µm. These hybrid-technology control units are placed directly into the gearbox and have to withstand up to 160°C, necessitating quality and high-reliability circuits.
Production starts with gold wire bonding, followed by aluminum wire bonding, and finally AOI to efficiently control and verify the results from these various steps. The project has been realized in close co-operation by Continental’s Nuremberg-based industrial engineering department and the automation specialists at IPTE Factory Automation, leveraging their expertise in these fields.
Seven gold-wire bonders, two aluminum-wire bonders and three AOI systems have been linked together in this line, additional to the placement equipment. A magazine buffer was installed before and after each process step as well as a bypass configuration to every machine to increase the availability of the line in total. In the event of the hold-up of a single machine or of the entire equipment in a complete process step, the line can still be used for other tasks with the remaining equipment. The advantages of the line-interlinkage project have so far been realized with two manufacturing lines at Continental Corp. in Nuremberg.
Interlinkage among different areas of the manufacturing line can drastically reduce lead times and allow minimized inventory on the shop floor. The purchase/installation costs for conveyors and handlers can be offset by decreased labor cost (calculated in minutes) for each product. Interlinking can also reduce a machine’s footprint by some 40%; manual handling of magazines could be minimized by 80%; logistical overhead on the shop floor was also remarkably diminished. Very short loops in production verification can help to avoid systematic errors, which would perhaps otherwise have been gone undetected at this manufacturing stage. Additionally, handling mistakes and false error alarms from the optical inspection can also be reduced by the short loop between the bonding and the AOI stages.
Roland Wurm, manager, production engineering chip & wire at Continental in Nuremberg, summarizes the results of the project: “Regarding the quality manufactured we are now playing in a superior league through the interlinking of the different production steps in this hybrid line. The cost of this interlinkage project is fully compensated through the elimination of magazine handler systems. We now have comparable machine expenses for the interlinked line in contrast to the former solution whereas throughput and quality have been significantly increased”.
IPTE Factory Automation is a supplier of automated production equipment for the electronics industry. More information is available at www.ipte.com.
(August 20, 2010) — Researchers at North Carolina State University (NC State) developed a method for predicting the ways nanoparticles will interact with biological systems, including the human body. Their work could have implications for improved human and environmental safety in the handling of nanomaterials, as well as applications for drug delivery.
Dr. Jim Riviere
Dr. Nancy Monteiro-Riviere
Dr. Xin-Rui Xia
NC State researchers Dr. Jim Riviere, Burroughs Wellcome Distinguished Professor of Pharmacology and director of the university’s Center for Chemical Toxicology Research and Pharmacokinetics, Dr. Nancy Monteiro-Riviere, professor of investigative dermatology and toxicology, and Dr. Xin-Rui Xia, research assistant professor of pharmacology, wanted to create a method for the biological characterization of nanoparticles. The research goal is a screening tool that allows scientists to see how various nanoparticles might react when inside the body.
“We wanted to find a good, biologically relevant way to determine how nanomaterials react with cells,” Riviere says. “When a nanomaterial enters the human body, it immediately binds to various proteins and amino acids. The molecules a particle binds with will determine where it will go.”
This binding process also affects the particle’s behavior inside the body. According to Monteiro-Riviere, the amino acids and proteins that coat a nanoparticle change its shape and surface properties, potentially enhancing or reducing characteristics like toxicity or, in medical applications, the particle’s ability to deliver drugs to targeted cells.
To create their screening tool, the team utilized a series of chemicals to probe the surfaces of various nanoparticles, using techniques previously developed by Xia. A nanoparticle’s size and surface characteristics determine the kinds of materials with which it will bond. Once the size and surface characteristics are known, the researchers can then create “fingerprints” that identify the ways that a particular particle will interact with biological molecules. These fingerprints allow them to predict how that nanoparticle might behave once inside the body.
“This information will allow us to predict where a particular nanomaterial will end up in the human body, and whether or not it will be taken up by certain cells,” Riviere adds. “That in turn will give us a better idea of which nanoparticles may be useful for drug delivery, and which ones may be hazardous to humans or the environment.”
The Center for Chemical Toxicology Research and Pharmacokinetics is part of NC State’s College of Veterinary Medicine. The research was funded by the Environmental Protection Agency and the U.S. Air Force Office of Scientific Research.
Abstract, “An index for characterization of nanomaterials in biological systems”
Authors: Xin-Rui Xia, Nancy A. Monteiro-Riviere and Jim E. Riviere, NC State University In a physiological environment, nanoparticles selectively absorb proteins to form ‘nanoparticle—protein coronas’, a process governed by molecular interactions between chemical groups on the nanoparticle surfaces and the amino-acid residues of the proteins. Here, we propose a biological surface adsorption index to characterize these interactions by quantifying the competitive adsorption of a set of small molecule probes onto the nanoparticles. The adsorption properties of nanomaterials are assumed to be governed by Coulomb forces, London dispersion, hydrogen-bond acidity and basicity, polarizability and lone-pair electrons. Adsorption coefficients of the probe compounds were measured and used to create a set of nanodescriptors representing the contributions and relative strengths of each molecular interaction. The method successfully predicted the adsorption of various small molecules onto carbon nanotubes, and the nanodescriptors were also measured for 12 other nanomaterials. The biological surface adsorption index nanodescriptors can be used to develop pharmacokinetic and safety assessment models for nanomaterials.
(August 20, 2010) — Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, and researchers from Georgia Tech made two advancements proven to meet key challenges facing the industry with respect to off-chip interconnect solutions. The results address both the urgent need for greater off-chip bandwidth and reduced power per bit and promise to enable continued improvements for system performance.
Higher frequencies
On-chip computing continues to improve with scaling, but that doesn’t help off-chip communications. In fact, many on-chip computing advancements in recent years, including multicore processors, have greatly increased the demand for off-chip bandwidth to memory. As a result, system performance will slow unless off-chip bandwidth also rises.
Off-chip interconnect is considered a key enabler for continued performance scaling. However, the power dedicated to off-chip interconnect competes with the rest of the system for use of the available energy. This presents a challenge, as off-chip electrical communications need to simultaneously move to higher frequency per pin — while also demanding less energy per bit of information. Typically, moving to higher frequency requires more energy per bit.
“Off-chip connectivity is both critical and essential for continued advancement of systems. However, most of the off-chip infrastructure used today — chip substrates, printed circuit boards (PCBs), and backplanes — are unsuitable for these high frequencies because there are signal distortions and losses,” said Dr. Paul Kohl, director of the SRC-FCRP Interconnect Focus Center at Georgia Tech and lead researcher at Georgia Tech for several SRC-funded projects.
Reducing energy loss per bit with air
The first of the two advancements announced by SRC-FCRP and Georgia Tech — in collaboration with University of Florida professor Rizwan Bashirullah — provides for significant reduction in energy loss per bit in off-chip pathways. By using air as the dielectric material for substrate or board-level interconnect, signal distortions, losses and power consumption can all be greatly reduced. To create these structures with air dielectrics, new processes and sacrificial materials are used on organic boards. Related research involves differential pair conductors and multi-layer structures, where two or more layers of air-clad interconnect can be fabricated to further reduce energy loss.
Among the benefits from the multilayer stacking is that the number of off-chip bytes per on-chip floating point operation will drop. This means that on-chip calculations and access to memory will become more plentiful, compared to the traditional means for connecting to off-chip memory.
“Research in packaging is not as forward looking as in chips and tends to be incremental in nature. Particularly in view of the industry’s shortage of affordable solutions, these new results should be highly beneficial for our semiconductor industries,” said Betsy Weitzman, SRC executive vice president and executive director of the Focus Center Research Program (FCRP) funding the work on bandwidth.
Better performance brought to you by copper
The second advancement is the actual connection between the chip and substrate. Both the chip and the substrate use copper wiring. The weak link between them is the solder, which is the only non-copper element in the pathway. Solders are mechanically brittle and limit both the density and performance of flip-chip connections between chips and boards. Georgia Tech researchers are replacing solder with all-copper connections, which are made into non-spherical structures, such as shielded, co-axial or other shapes that enable higher densities and performance than current solder materials.
Not only does this approach support continued system performance improvements, but also provides an environmental improvement by creating a smaller chemical footprint during fabrication. Georgia Tech has also researched package interconnects formed with graphene rather than copper (Graphene could replace Cu for IC interconnects).
“These results reflect multi-disciplinary improvement where materials and chemical advances are brought together with electrical design and modeling achievements. They help to create significant system-level progress that should enable further system performance improvements,” said Dr. Scott List, director of Interconnect and Packaging Sciences within the SRC Global Research Consortium that is funding work to improve the interconnectivity.
The aim of the combined effort from SRC and Georgia Tech is to provide the industry with low-cost options for forming high-value structures. Among the key beneficiaries of the interconnect results are chipmakers, packaging houses and equipment manufacturers.
(August 19, 2010) — SouthWest NanoTechnologies Inc. (SWeNT), manufacturer of single-wall and Specialty Multi-Wall (SMW) carbon nanotubes (CNTs), is manufacturing specialty multi-wall carbon nanotubes for NanoRidge Materials Inc. These CNTs are being incorporated into enhanced body armor to improve protection of soldiers and law enforcement officers from small arms fire.
SWeNT’s SMW100 will be used in a highly advanced nanotechnology application to create stronger, lighter armor that fundamentally improves its resistance to impact and reduces the penetration depth of a bullet.
This new hybrid armor, which will be manufactured by NanoRidge customer Riley Solutions Inc. (RSI), has been selected by the Defense Advanced Research Program Agency (DARPA) to undergo rigorous testing and evaluation against the most destructive small arms fire.
"Once it has passed testing, the armor will provide U.S. military and law enforcement personnel better, lighter and less costly armor than has been available before," explains Kyle Kissell Ph.D, and RSI’s technical advisor. "NanoRidge selected SWeNT’s SMW100 after evaluating many different products and believes that its characteristics and commercial scalability will meet the needs of our nation’s protectors while saving lives."
“SouthWest NanoTechnologies is proud to be providing NanoRidge and Riley Solutions with SMW100 for use in these groundbreaking, nano-enhanced armor products," explains SWeNT CEO Dave Arthur. “Our patented CoMoCAT process enables us to produce the desired quality and at a cost and in quantities needed to meet the sizable demand that is expected.”
"SWeNT SMW100 is an excellent choice for this armor application because it is affordable, easy to disperse in polymers, and forms extremely robust networks that enhance the structural performance of the composites," says NanoRidge CEO Chris Lundberg. "Additionally, SWeNT’s domestic production and proven ability to deliver consistent quality are critical for the Department of Defense."
NanoRidge Materials, Inc. is a manufacturer of high-performance nanocomposite materials and composite components.
SouthWest NanoTechnologies Inc. (SWeNT) is a privately held specialty chemical company that manufactures high quality single-wall and specialty multi-wall carbon nanotubes, printable inks and CNT-coated fabrics for a range of products and applications including energy-efficient lighting, affordable photovoltaics, improved energy storage and printed electronics. For more information, please visit www.swentnano.com
(August 17, 2010) — Rohit Pathak, Acropolis Institute of Technology & Research, Indore, M. P., India and Satyadhar Joshi, Shri Vaishnav Institute of Technology & Science, Indore, M. P., India, have analyzed the effect of innovations in nanotechnology on wireless sensor networks (WSN) and have modeled carbon nanotube- (CNT) based sensor nodes from a device prospective. A WSN model has been programmed in Simulink-MATLAB and a library developed. Integration of CNT in WSN for various modules such as sensors, microprocessors, batteries etc has been shown. Also, average energy consumption for the system has been formulated and its reliability has been shown holistically. A proposition has been put forward on the changes needed in existing sensor node structure to improve its efficiency and to facilitate as well as enhance the assimilation of CNT based devices in a WSN. Finally we have commented on the challenges that exist in this technology and described the important factors that need to be considered for calculating reliability. This research will help in practical implementation of CNT based devices and analysis of their key effects on the WSN environment. The work has been executed on Simulink and Distributive Computing toolbox of MATLAB.
The proposal has been compared to the recent developments and past experimental results reported in this field. This attempt to derive the energy consumption and reliability implications will help in development of real devices using CNT, which is a major hurdle in bringing the success from lab to commercial market. Recent research in CNT has been used to model an energy efficient model which will also lead to the development CAD tools. Library for Reliability and Energy consumption includes analysis of various parts of a WSN system which is being constructed from CNT. Nano routing in a CNT system is also implemented with its dependencies.
Finally the computations were executed on a HPC setup and the model showed remarkable speedup.
The combination of recent technological advances in electronics, nanotechnology, wireless communications, computing, and networking has hastened the development of Wireless Sensor Networks (WSNs) technology. Since CNT remains the main technology that threatens the CMOS technology due to its immense interesting properties our work has been to realize where the technology stands and the results of energy and reliability modeling. Wireless Sensor and Actor Networks (WSANs) constitute an emerging and pervasive technology that is attracting increased interest for a wide range of applications. WSN see application in various areas like space research, biomedical engineering, military applications such as battlefield surveillance and the quest for making low power, reliable and cheap sensor nodes has been a prime focus in recent years.
Nanotechnology has enabled realization of low power devices such as MEMS devices and CNT based FETs [11-12]. CNT based sensors have shown many benefits over their past counterparts and are suitable candidates in this Nanotechnology driven age [24]. Nanotechnology uses the smallest unit of matter to engineer new materials and devices atom by atom, aiming at achieving superior properties and performance through atomic scale architecture. An improvement in techniques of Nanocharacterization and Nano-fabrication has helped us to pave the way to develop many novel materials that can be applied to various spheres of technology. For example the impact of Nanotechnology on Wireless Communications has been shown by Er. Ping Li in [14]. An Architecture of Quantum-Based Nano-sensor Node for Future Wireless Sensor Networks has been proposed in [10]. WSN with Biomedical Applications has been shown by Zachary Walker describing the importance of Middleware [22]. Miniature Acoustic Communication Subsystem Architecture for Underwater Wireless Sensor Networks has been proposed by Saunvit Pandya [33]. WSN architecture for the Wireless Health Mobile Bio-diagnostic System for physiological studies has been proposed [34]. In our previous work, we have shown Nano based WSN where the importance of CNT and MEMS technology in WSN has been shown [32]. WSN plays a very important role in the overall development of a developing nation, which is being felt in the recent years [4]. Also planetary sensing applications have been proposed in recent years [6]. In this paper we have proposed energy and reliability models for a CNT based WSN. The models were developed using Simulink and Distributive Computing Toolbox, which were tested on a HPC setup.
CNT sensors and nano processors
Research on carbon nanotubes is yielding many results in labs and many theories are being proposed, but many parallel work on areas like reliability, packaging and energy constrains in CNT devices are still not being explained. Realization of CNT based sensors devices can make them a suitable candidate for WSN sensor nodes. Functional CNT can lead to novel device application giving advantages of their unique properties [25]. We know that conductance of CNT depends on the rolling of the graphene sheet which in turn depends upon the chiral vector Ch as given by the equation
Ch =na1 + ma2 (1)
Here n and m are integers and a1, a2 are unit vectors in the bi-dimensional hexagonal lattice of the graphene sheet. The radius of the nanotube being
R = a0(n2 + m2 + nm)1/2 /2π (2)
This is most basics idea of CNT that is known to all. Mathematics of CNT and their latest paper in this regard has been discussed in later part of the work. Hence we can model a sensor dependent on the above parameters as follows: 1. Define m, n and calculate the radius required for the particular sensor as electronic structure (energy band gap structure) depends on the integers m and n. 2. Take note of the impact of working temperature and environmental factors on the reactivity of CNT like hydrogenation, oxygenation, NO2, NH3, CO, O3 as studied in [24, 25]. 3. Effect of elasticity, mechanical motions and effect of other adsorbent on CNT surface. 4. Predicting the reliability of the sensor.
Fig. 1. Interaction of CNT and other molecules.
We know that variations in current conductance properties of CNT make it a useful for detecting gas and chemicals. We can illustrate the variation of current vs. time in a CNT based sensor from the graphs in [24]. The special semiconducting properties of CNTs have been exposited that makes them a suitable candidate for the future development of Nano-processors and Nano-scale circuitry [28, 30-31]. Atashbar et al. [37] has asserted that SWNT (Single Wall Nanotube) based efficient gas sensor using SWNT functionalized with Sodium Dodecyl Sulfate improved the solubility of SWNT in DI water significantly. He proposes that this functionalization reduces the short range attraction forces by introducing repulsive forces of equal strength and this result in the alteration of structural, electronic, and mechanical properties of the nanotubes. We are aware that there is a change in conductance of CNT on absorption of CO, NH3, CO, O3 NO2 and O2 and other gases [24]. Jing Li [18] has proposed a unique and marketable way to develop Nano-scale chemical sensors with polymer-coated CNTs for selective chemical sensing in gas phase. But we need more exploration in coating and doping techniques for broad application coverage. Carbon Nanotube also sees its very important application in biosensors [9, 13]. The main challenge for any engineering application of CNT is its reliability and interconnects. The effect of various gases has on CNT is shown in Fig. 1.
Modeling of low-bias electronic transport in ballistic conductor. There are various models developed for calculating the conductance of CNT. In this section the most applicable model is stated from the literature which is then implemented to calculate the energy consumption and reliability analysis. We know that Electronic transport in ballistic conductors can be assumed as the sum of IL and IR the currents flowing right and left; this forms the basic model of calculating current in CNT based devices where it is capable of carrying high currents [1]
(3)
(4)
Here D(E) is the density of states in units of (states/eV/nm), ν(E) is the electron velocity and f (E) is the Fermi function with Fermi levels EFR in the right lead and ELF in the left lead. These equations are simply expressing the fact that the current at energy E is the product of the number of charges ε D (E) f (E – EF) and their velocity ν(E). This is the current through metallic CNTs which forms the basis of the WSN network based on CNT. The total sum of right and left current in a ballistic system is thus
(5)
The difference of the Fermi functions implies that most of the current will flow between the two Fermi levels. There are two generalizations of the above derivation that need to be considered when describing transport through real systems. The first is that in general there may be several modes that contribute to the current, and each mode will contribute one quantum of conductance. The second point is that, because of scattering processes in the conductor, the electron transmission probability may be less than unity. Putting this together gives the final expressions for the current
(6)
And the total conductance (including spin) is given as
(7)
Thus this part of the system is the observation for conducting CNTs now in our work we have worked on the reliability and energy consumption as shown classically in [1].
CNTsensors. Sensors are the most important applications of CNTs. The sensing mechanism and the charge transfer needs to be modeled for the sensor part of the wireless sensor network. Using the expression for the capacitance per unit length of a CNT we can obtain an expression for the maximum relative change in conductance [27].
(8)
At the other end of the spectrum, one can consider the impact of a single analyte on the nanotube conductance. Under the assumption that the transferred charge is delocalized over the entire channel length, we can estimate the relative change in conductance to be
(9)
The appearance of the channel length is made explicit in this expression. This equation relates the conductance with channel length so it is an important part of parameter. For detection of analytes of concentration c in a gas or liquid phase, it is useful to relate the surface coverage θ to the analyte concentration. This can be accomplished by considering equilibrium surface coverage with analyte binding energy Eband analyte chemical potential in the gas or liquid μ. The partition function is then given by
(10)
Here zvib is the vibration contribution. The expression for the concentration dependence on the coverage can be combined with that for the threshold voltage shift, to obtain
(11)
Contacts and interconnect. The most important issue that is being talked about is contacts and interconnects in a CNT-based system. This research is also very useful for developing CNT based NOC which is an area of research for the near future. The presence of charge near the interface will change the electrostatic potential and hence the electrostatic potential in the semiconductor (z > 0) is calculated as [2]
(12)
The first term in this equation is the potential due to the image charge in the metal while the second and third terms arise from the charge in the semiconductor. This is the part which needs to be studied in light of reliability and energy consumption. Thus the electrostatic potential hence derived is
(13)
Thus we can see that Vbulk (z) is given above it where the potential attains a constant value at z>>q-1 which is
(14)
Diode of CNT systems. Diode as we see is one of the main things that are used in the circuitry which is being shown in this part. Assuming that the band edge simple tracks the Fermi levels in the leas (i.e. far away from the junction), the diode physics of CNT is shown as [3]
(15)
(16)
Here E∞ c is the energy of the conduction band edge on the n-type side far from the junction. As shown above it is the celebrated ideal diode equation describing rectifying behavior, except that here it was derived under the assumption of ballistic transport. This is important for considering the current in the diode part. I here is the celebrated ideal diode equation describing rectifying behavior, except that here it was derived under the assumption of ballistic transport.
Ohmic contacts and transistor. Temperature has been a major issue that needs to be taken in account. The temperature dependence of the ON state conductance also provides further evidence for the presence of ohmic contacts. Assuming perfect transmission through the contacts and the nanotube, the obtained temperature-dependent ON state conductance as [5]
(17)
Here Δ = EV − EF represents the position of the Fermi level in the valence band. The conductance G monotonically decreases with increasing temperature in agreement with the work done earlier. Thus, even in carbon nanotube field effect transistors without electron–phonon scattering it is expected that the conductance will decrease with increasing temperature, and can be reduced by as much as a factor of two at room temperature compared to its low- temperature value. Expression for conductance in a Schottky barrier nanotube transistors is [2, 7]
(18)
Here
(19)
Here tox is the gate oxide thickness. The much different physics behind the operation of Schottky barrier nanotube transistors has important implications on the scaling of various performances parameters with device dimensions. As discussed above, it was predicted that reducing the thickness of the gate insulator improves the sub threshold swing because it allows the gate to more effectively modulate the band-bending at the contact. Such a behavior has been verified experimentally by fabricating nanotube transistors with gate oxide thickness between 2 and 20nm. Thus this is the study of the CNT based transistor.
CNT electromechanical systems. Once the transmission probability is known for the relevant range of energies, the conductance is calculated from [3]
(20)
Here Tij is transmission probability between bands i and j. This equation signifies the relations of bending vs change in conductance. Impact of bending causes change in bond length which causes change in conductance which is shown. For the metallic nanotubes, a band-gap opens around the Fermi level, and the conductance at the Fermi level follows the relation [26]
(21)
Model for power consumed in a CNT-based WSN
Contemporary work in computation of WSN reliability is pretty generalized and Nano-scale devices based WSN has not been the sole focus of the research done in this area. In our previous work we have shown that MEMS reliability can be calculated using HPC thus making their practical applications possible [38, 37]. Effects of the failure of sensor nodes are studied and no compromise data acquisition methods have been proposed in [21]. Requirement for sustained, reliable and fault-tolerant operations have been conferred and a solution has been proposed by Kaminska in [15]. In this regard, the reliability calculations by probabilistic graph models and algorithm have been demonstrated by Hosam M. F. Abo El Fotoh [17]. Reliability studies in respect to Common Cause Failures have been examined [20]. Modeling and evaluating the reliability of Wireless Sensor Networks as subject to common cause failure has been described in [18]. Data transport and the reliability of data transport protocols have been discussed in [19]. Thus if we can predict the cause of failure then we can modify the protocols in our system accordingly. In Nano domains the failure can be caused due to large number of problems and errors which needs to be modeled and predicted in advance. Ad hoc wireless architecture has been introduced by Kamiska in [15] for the sustainability of self-configuring Wireless Sensor Networks and the routing scheme forwards sensor data along fuzzy and intentionally redundant paths to provide for reliability and fault-tolerance has been proposed. In [23] Zhand Dingxing discusses coverage algorithm based on probability to evaluate point coverage. Reliability in Wireless Sensor Networks using Soft Sensing and Artificial Neural Network methodology has been demonstrated by Rubina Sultan [21]. Optimizing availability and reliability in Wireless Sensor Networks applications by the use of middle wares has been shown in [16]. Thus we need to develop middleware in accordance with the challenges that exist. The CNT memory developed is not considered in our model [29, 35].
Current consumed in all elements can be distributed as follows: Ip = current in processor Is = current in sensor Id = current in diode I em =current in Electro mechanical CNT Idp = CNT diplay device if attached Icon = Contact of metal and CNT Itrs= current in transporting Energy consumed in V12 G1 + V22G2 + V32 G3 + V42G4 + V52G5
(also we need to take into account the Capacitance of the inter connects for the energy consumption: G1 is conductance in processor of FET based on CNT, here it’s a function of L (Length of nanotube) and energy consumed in capacitance: G2 is the conductance in sensor is also depended in L G3 diode does not depend on Length G4 current depends on deformation and bond length not L G5 It depends on L G6 does not depend on length; here capacitive effects may come into picture. Thus total energy consumption is a function of L length of the tube, length of the sensor tube, length of the display tube E = f (I, L1, L2, L3, Number of contacts,) (Assumed for diameter to be constant)
This can be done using MATLAB Distributive Computing Toolbox to calculate energy consumption at various temperatures so that we can model the circuit in the desired way. Using HPC needs to done in an optimum way by correct distribution of the jobs in the work load. Thus to calculate E we need the power of HPC to distribute the various parameters on an HPC setup because the system is complex. Capacitive effects on joining points or inter connects needs to be also taken in account which is ½ CV2. In most the cases it is can be considered in Diode and Contacts. If all of the system is just made of CNT then all the energy consumed in each part will be a function of CNTs parameter such. Our model results are done on HPC but an abstraction level function for overall consumption of the energy can be stated as
P= K1e-k 1 V (Energy used in circuit) + K21/2 CV2 (Energy lost at interconnect) (22)
Fig. 2. Y axis X axis, P vs. V(applied) for a derieved CNT WSN system.
Fig. 3. Graph between Power Consumed vs. Voltage applied vs. Capacitance of the system.
First term is of energy used in circuitry and 2nd term is for the interconnects. The variations can be seen in the figure plotted with the help of derived equation in Fig. 2 and taking all 3 parameters with number of inter connects, current, power the variations are shown in Fig. 3. It can therefore be used in an abstraction way as the formulae above but for accurate calculations we need high computation power, which can be done. Thus using this equation we can calculate the energy consumed in a CNT based Wireless Sensor network. But reliability and performance of the Node in a CNT based Sensor Node depends on the Sensor, Nano-processor, Nano-battery sources. Thus we need to make appropriate changes in the middle ware and Operating System. The energy for such a system can be derived from a MEMS better-less system where energy is induced in transponders, recent proposals shows real prospectus of such a technology maturing [8].
Unified reliability model developed for nano WSN
Probability function density of the failure for the device can be calculated as follows: f(t) is depended on frequency CNT device operate, electrostatic forces and electromagnetic forces it is subjected to, material which defines the strength of the device in various forms. υ= frequency of operation, also the frequency of CNT antenna will have a part in the function κ = stress it is subjected to, this is reaction RA and damping force as described earlier in case of a CNT mechanical sensors η = viscosity of the medium (which is most cases air) for a CNT mechanical sensor ЄC = electro static and effect, like capacitance based which for example shows at the interconnect of Carbon Nanotube metal junction ЄM=electromagnetic forces, like for inductive CNT antenna and transponders there is no mechanical motions but force due to inductance and induced voltages M (ρ, С, r) = material properties of the device, which also is the parameter of the density, head capacity, resistivity, strength and dielectric capabilities Ī=current flowing in the device for example which can be derived of various part of CNT based circuitry To=in some cases temperature may also be a cause of discrepancies which needs to be taken in account f(t) is a function of υ, κ, η, ЄC, ЄM, M (ρ, С, r), Ī,To
We have discussed the physics of these devices which is where we have given the current through various parts of the system.
It is assumed that the function will be exponential with some modification since it’s a standard reliability function used. It is obvious that f(t) will increase with υ, κ, η, ЄC, ЄM, M (ρ, С, r), Ī,To
As these parameters are linked to the failure rate therefore to insert their equivalent they are calculated by operator f’ where increase in any of them will increase the failure of the device, this operator converts the respective value to a function that needs to be inserted in the main failure probability distribution equation. Also it is obvious that the variation will have an exponential distribution for the failure rate distribution which can be derived from the basic principle of exponential distribution of reliability theory. So,
(23)
(24)
We have assumed we are given all parameters and they remain constant throughout the cycle of the CNT device then (f(υ) + f(κ) + f(η) + f(ЄC) + f(ЄM ) + f(M (ρ, С, r)) + f(Ī) + f(To)) = λ is assumed constant for computation that is being done on MATLAB. This formulation developed need to be modified as the exact dependencies of a case specific CNT device for example CNT based RFID or CNT based WSN. For example we need to derive for RFID which has CNT based antenna and transponders.
(25)
where I is the current through the system, n is the number of interconnects, and L is the approximate length of CNT used in the system. The failure probability distribution can be visualized as given in Fig. 4. And assuming only current and no interconnect effects the system behaves as shown in Fig. 5.
Fig. 4. Failure probability distribution f(t) vs I (current) and n (number of inter connects), which is the function derived.
Fig. 5. Failure rate function vs. I (current in the device) with no capacitive effects.
f(t)=( I + n+ L) e -(I + n+ L)(26)
The other model can be assumed in case the system is behaving in alternative way which is not satisfied by the first one can be seen in Fig. 6.
f(t)=( I n L) e -(I+ n L) (27)
Fig. 6. Failure probability distribution f(t) vs. I (current) and n (number of inter connects).
Thus for many CNT based devices in a WSN that are arranged in serious the probability of combined functioning can be calculated by the formulae below
(28)
A series system’s reliability decreases (increases) if the reliability of any unit decreases (increases). A series system’s reliability decreases (increases) if the number of units increases (decreases). A series system’s reliability is worse than the reliability of any of its units. Switching technology has been used very effectively and since at MEMS devices we have MEMS switches to shift to the redundant part of the system we need to analyze the reliability of the system with switch added. In a CNT system we can also use them. Psyst(t)=PSD(t)Pm(t) where Pm(t) is the probability of failure free operation of redundant group, PSD(t) of switching device and Psyst(t) of the system as a whole. A specific reliability function of switching device can be calculated in this way. Other miscellaneous issues that might come into factor are discussed below: Reliability of CNT depends on miscellaneous factors such as: 1. Functional group(s) attached, length and chirality of the CNT molecule 2. Packaging model used 3. Integration with other devices and interconnects 4. Other factors such as temperature and environmental parameters
Developed model for nano routing. Now we need to find a path in which the distance, the load at node (which is defined in terms of n which is also the number of connection is made) and the energy conservations to makes least energy dissipation for routine in a CNT based sensor network. Now this energy loss will be calculated by each node and then it will decide the path of propagation. Nanotechnology has enabled modeling of Nano antennas and MEMS technology enable transducers thus we can see that energy consumption can be greatly minimized. Propagation of waves is an independent area for a WSN and routine methodology formation can be worked as shown below: Here we have calculated the energy loss as a function of distance, load on the device, and the Voltage at which the CNT device is working. We know that Energy at a distance r is Er= k/r2 (this is the relation of the energy received at a distance r and k is assumed constant) by classical propagation theories. Now the energy loss is a function EL=f(lt,nl, Nf)
EL = k/l2t + nl + (K1e-k1V + K21/2 CV2), (29)
lt = length at which the transmission is to be made; Nf = Nano-factor for a CNT which is dependent on the energy conservation formulae derived in the earlier part, which is assumed as the energy conserved in the CNT as a function of Voltage which may be induced by MEMS transducers in this case; nl = load due to n devices at a node, which can also be said as the load complexity and also weighted value can be taken, in some cases it is the interference or the number of nodes surrounding the node that is a part of transmission or the interference nodes. It can also be stated as number of nodes in the path into average number of surrounding nodes (npath*navg). Also the relation can be studied graphically as EL vs. lt vs. V as shown below.
Fig. 7. Simulink Model of CNT based nano-WSN.
Model of the system in light of recent developments. We have shown that since CNTs which are used in many parts of the sensor nodes, Nano-processors [20], therefore, it is necessary to study the reliability and effect of various parameters on CNT based devices is the motivation behind the work. We have shown the importance of functional CNT and its realistic applications in chemical sensors and other Nano-electronic devices [36]. HPC can be useful for optimization of complex computations which has been shown in [39, 40]. The sensor software has to be modified for CNT specific computations and in case of detection of erroneous readings by the node in CNT based calculations; corrective measures are needed to be incorporated into the software to counter these readings. An algorithm 1 is the algorithm for the functioning of the sensor node:
Algorithm 1. Algorithm for the functioning of the sensor node.
Start Step 1: Input from CNT Sensors Step 2: ADC converters Step 3: Data sent to CNT based Nano-processors Step 4: Computation of data to study the reliability of the signal and the various aspects of occurrence of discrepancy in the readings of the functional CNT sensors End
Modifications needed in current Operating System for CNT based WSN: 1. Minimizing the inconsistency in the readings of CNT sensor nodes due to functional CNTs. 2. Inclusion of correction for the CNT based Nano battery source.
Modeling of CNT based devices in a WSN environment such as CNT Sensors, CNT electronics, CNT-based power sources can be done in this way. Since CNT is the main ingredient of devices, its reliability is of paramount importance. We have corroborated that the reliability of CNT-based sensor node depends upon functionalization of the CNT molecule, application, interconnects and packaging.
VHDL-AMS (VHSIC hardware description language Analog and Mixed-Signal extensions) modeling can be done as substantiated in [26]. The Simulink model shown in Fig. 7. is derived from the various parts of a WSN CNT that has been shown in part II. The programs given in Code 1 and Code 2 are the conversion of the complex mathematical equations into MLATAB format.
Code. 1. Demo code of above Simulink model.
function y = CNT_Sensor() % This block supports the Embedded MATLAB subset, it is used for calculation for equation 6 and equation 7in simulink. dgs =3; di=1g=1;e=1;alpha = 1;h=1;d=1;pi=3.14;k=1;T=1; L=1;epsi=1; dgs= g ( (pow(e,2) * alpha * ln((4*h)/d) ) / (2 * pi * epsi * k * T * ln(10)) ) * (1/L); di=dgs*V
Code. 2. Demo code of above Simulink model.
function y = CNT_Transistor() % This block supports the Embedded MATLAB subset, it is used for calculation for equation 16 and equation 17 in simulink. e = 2.7;h=1;V=1;Vg=1; G = ((4 * (e^2))/h) * (e ^ (-(1/3)* ((V/Vg)^2))); pi=3.14;Eg=1;alpha=1;gamma=1;tox=1; V = (((pi * (Eg^3))/(12 * alpha * gamma))^(1/2)) * (tox^(1/2));
Code. 3. Demo code for distribution of Computation.
Fig. 8. Configuration and status of the HPC setup.
The detailed implementation can be seen in [38]. The configuration of the status of the HPC setup is shown in Fig. 8. Due to symmetry of computation and distributions of various computations on the HPC setup, we got various results. When we fed the reliability computations we got maximum speedup (Fig. 9.), followed by I (current) in various (Fig. 10.), and the least in energy consumptions. Shown below are the speed-up results for various (Fig. 11) calculations that are performed on the HPC set-up in figure 9, 10 and 11. The explanation of the graphs can be predicted from the fact that symmetry of computation and limits used has the most effect on the speed-up. Virtual reality can also be used for taking the analysis in Virtual reality domain with the help of HPC setup.
Fig 9. Speed up which was obtained in reliability computations.
Fig. 10. Speedup in current (I) computations in various parts of the CNT based WSN.
Fig. 11. Minimum speed up obtained in energy consumptions in various parts of a CNT based WSN.
Conclusion
We have shown how novel nanotechnology-enabled devices can be used in a WSN environment. We have addressed the challenges that need to be confronted in CNT based WSN. We have substantiated integration of CNT based devices in WSN including sensors, micro processors, etc. We corroborated the challenges that exist on modeling of CNT based devices for a WSN sensor node and build a reliability model to accurately predict reliability. The modeling of CNT based nodes can be done in packages like Simulink in MATLAB which has been used in this work. We have derived a formulation for energy consumption of CNT based WSN system because energy is the main issue of concern secondly we have derived the reliability equation for the system. Developing a reliability, nano routing and reliability is helpful accelerating time to market for CNT based WSN. Routing plays an important role in CNT based devices where interconnects are very inefficient. Implementation has been done on an HPC setup and comparisons between various calculations have been reported. Control engineering can also play an important role in expanding the work, which is an area of future work. The transmission line equivalent needs to be modified as the new nano scale physics that is currently being developed which is introduced in this paper. To model such systems we have to use complex modeling aspects for which HPC is an eminent need.
Fig. 12. Energy consumption in Nano routing of a CNT based WSN.
Rohit Pathak, Acropolis Institute of Technology & Research, can be reached at [email protected].
Satyadhar Joshi, Shri Vaishnav Institute of Technology & Science, can be contacted at [email protected]
Originally published by Sensors & Transducers Journal (ISSN 1726-5479), Vol. 118, Issue 7, July 2010: Sensor Networks and Wireless Sensor Network. Rohit Pathak, Satyadhar Joshi, Modeling Energy & Reliability of a CNT based WSN on an HPC Setup, Sensors & Transducers, Vol. 118, Issue 7, July 2010, pp.28-45 (http://www.sensorsportal.com/HTML/DIGEST/P_640.htm).
(August 13, 2010) — Scientists at GE Global Research, GE’s technology development arm, in collaboration with Air Force Research Laboratory, State University at Albany, and University of Exeter, have received a four-year, $6.3 million award from the Defense Advanced Research Projects Agency (DARPA) to develop new bio-inspired nanostructured sensors that would enable faster, more selective detection of dangerous warfare agents and explosives.
Three years ago, GE scientists discovered that nanostructures from wing scales of butterflies exhibited acute chemical sensing properties. (Read a 2007 interview with GE chemist Margaret Blohm here.) Since then, GE scientists have been developing a dynamic, new sensing platform that replicates these unique properties. Recognizing the potential of GE’s sensing technologies for improving homeland protection, DARPA is supporting further research.
Radislav Potyrailo, a principal scientist at GE Global Research and principal investigator, said, “GE’s bio-inspired sensing platform could dramatically increase sensitivity, speed and accuracy for detecting dangerous chemical threats. All of these factors are critical, not only from the standpoint of preventing exposure, but in monitoring an effective medical response if necessary to deal with such threats.”
Potyrailo noted that GE’s sensors can be made in very small sizes, with low production costs. This would allow large volumes of these sensors to be readily produced and deployed wherever needed. Unique sensing properties, combined with the size and production advantages offered by GE’s bio-inspired sensors, could enable an array of other important industrial and healthcare applications, including:
Emissions monitoring at power plants
Food and beverage safety monitoring
Water purification testing for home, environmental and industrial applications
deliver important information about air conditions in localized regions or over large distributed areas. This information can range from warning of impending chemical or health threats to more precisely measuring air quality at a power plant. The unique sensing properties of GE’s bio-inspired sensors provide an opportunity to improve the quality of this sensing data and the ability to collect this data at previously unavailable levels of detail.”
DARPA Program Manager Viktoria Greanya, Ph.D., said: “We have been greatly inspired by examples of naturally occurring optical structures whose properties arise from an intricate morphology. For example, the brilliant colors seen in butterfly wings, beetle carapaces, and peacock feathers are due in large part to their complex structure, not simply their color. DARPA’s goal in this program is to harness the best of nature’s own photonic structures and use advances in materials technology to create controllable photonic devices at visible and near-infrared wavelengths.”
For the DARPA project, GE has assembled a world-class team of collaborators who are recognized experts in their fields. They include: Dr. Helen Ghiradella, from State University at Albany, an expert on the biology of structural color; Dr. Peter Vukusic, from the University of Exeter, an expert on the physics of structural color; Dr. Rajesh Naik, from the Air Force Research Laboratory, with a strong background in bio-inspired functional materials and surface functionalization; and Dr. John Hartley, also from State University at Albany, specializing in advanced lithographic nanofabrication. These team members will complement GE’s strong multidisciplinary team of analytical chemists, material scientists, polymer chemists, optical engineers and nanofabrication engineers who are contributing to development of this new platform.
GE Global Research is the hub of technology development for all of GE’s businesses. Visit GE Global Research on the web at www.ge.com/research. GE is a diversified global infrastructure, finance and media company that is built to meet essential world needs. For more information, visit the company’s Web site at http://www.ge.com
(August 12, 2010) — Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) will reportedly reduce costs for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour and assemble semiconductor dies in their packages. Plans are in the works for the TPR to do semiconductor manufacturing tasks as well.
A single TPR can assemble all the major package types including naked dies, flip chips, stacked chips, Package-in-Package (PiP) and System in Package (SIP) devices. With the other A-Series robots placing up to 94,000 cph, the TPR helps match chip and IC placement rates to significantly reduce the overall cost of placement. Placing chips and ICs with the same machine saves labor, energy, maintenance and other operational costs of a separate line balancing machine, according to Assembleon. The A-Series suits high volume and high mix production, with fast New Product Introductions and batch sizes down to 1. The machines can pick ICs from a range of carriers including Jedec tray stackers and tape on reel.
The A-Series now has an accuracy of 25µm and repeatability of 17µm (both at 3 sigma, CpK>1), essential for reliable assembly of micro-miniature chip components and fine-pitch devices. Adding multiple TPRs and reducing the individual robot speeds to increase the settling time will soon also improve placement accuracy enough for A-Series machines to be used for encapsulating semiconductors at a much higher rate than is now possible.
(August 10, 2010) — The Department of Physics and Technology at the University of Bergen, Norway, selected Plasma-Therm 790+ Reactive Ion Etcher for its nano-fabrication facility. The University of Bergen’s system addition to their facility will assist in the development of free-standing Fresnel zoneplates for neutral helium microscopes. The 790+ RIE equipment will also support university work on biophysics experiments in surface engineering and nano-science experiments to test optical and magnetic properties of nanostructures.
“As we move forward with the reach of our experiments, we are constantly searching for reliable, flexible tools that support us in our research and help us push the limits of nano-science. The 790+ system is one of the tools we are using to define the future of nanotechnologies,” said Professor Bodil Holst, Nanoscience Programme Leader at the University of Bergen’s Department of Physics and Technology.
The 790+ RIE provides a flexible technical solution for etching the variety of structures and materials required for advanced research. Simple operation coupled with manual loading on a large electrode addresses the multiple needs of a university operating environment where different substrate sizes and shapes in addition to ease of use by multiple users is key. “The increased area of the 790+ electrode increases uniformity and throughput while maintaining affordability for both university and production settings,” said Ed Ostan, executive vice president of sales & marketing at Plasma-Therm.
Plasma-Therm is a supplier of advanced plasma process equipment that focuses on various specialty markets including photomask, solid state lighting, thin film head and compound semiconductors. Learn more at www.plasmatherm.com
The University of Bergen, located in Bergen, Norway, is a research university emphasizing basic research, research-based teaching, and the development of academic disciplines. The Faculty of Mathematics and Natural Sciences is one of six faculties at the University of Bergen and has around 2700 students. The Faculty consists of eight departments, including the Department of Physics and Technology, which provide the foundations for its teaching and research activities.