Category Archives: Materials and Equipment

February 19, 2008 — Nanomaterials developer Ecology Coatings Inc. has been awarded its fifth patent, this one covering processes and technologies for producing environmentally friendly nanotechnology-enabled coatings.

U.S. patent number 7,323,248, “Environmentally Friendly Coating Compositions for Coating Composites, Coated Composites Therefrom, and Methods, Processes and Assemblages for Coating Thereof,” covers nanocoatings that include fiberglass, fire retardant fiberglass, carbon fiber, fire retardant carbon fiber, Kevlar, and fire retardant Kevlar.

In addition, the patent covers certain applications, including composite architectural panels, which when incorporating Ecology’s coatings technology, resist yellowing and allow the removal of graffiti without harm to the panel surface.

“We intend to aggressively expand our IP portfolio of multifunctional Liquid Nanotechnology advanced materials, while pursuing licensing and business development programs with highly focused business partners,” said Richard Stromback, Ecology Coatings’ chief executive and chairman.

Wire Bonder


February 18, 2008

The Wire Bonder 3200’s new air bearing technology and rotary axis enable it to attain 22 wires/sec with very thin wires. The wire bonder makes the electrical connections between the semiconductor and the terminals on the substrate. The control pulses generated in the chip reach the surrounding area via a gold wire that is thinner than a human hair. The wire bonder also features optimized ergonomic design and recipe portability from machine to machine, down to 35 µm. The air bearing technology minimizes wear phenomena on the material. Two independent clamps/supports make the processing operation even faster, with a dramatic increase in the units per hour rate. The cooling system has been optimized to ensure constant temperatures even when the bonder is operating at maximum performance. The optional high-resolution visual control system supplies clear, detailed images that improve process monitoring further. Oerlikon Esec, Cham, Switzerland; www.oerlikon.com.

Feb. 15, 2008 – NEC says it has developed a carbon nanotube (CNT) transistor using a new channel-coating process, achieving “extremely high mobility” despite performance variation. Results of the research are being presented at this week’s nano tech 2008 International Nanotechnology Exhibition & Conference in Tokyo.

Design guidelines for the CNT transistor, based on an NEC device model, were established to verify the relationship between the transistor characteristics and the length and density of the CNT where the channel is created, and to increase CNT transistor performance. (The part of a transistor that connects the electrodes, NEC explained in a statement — the faster the electrons move in the channel, the faster the electronic device can operate.)

Channel materials of conventional research organic transistors have generally demonstrated insufficient mobility for use in electronic devices requiring high-speed operation — but NEC says its CNT-channel transistor has 100x greater mobility than regular organic transistors.

Work was done toward a goal of creating electronic devices with increased performance but also reduced environmental impact. One potential answer to this dilemma is printed electronics, including organic transistors, where transistors are printed directly onto a substrate. This dramatically simplifies the manufacturing processes vs. that of conventional semiconductors, and reduces waste materials and CO2 emissions by >90%.

“The research results prove the potential of CNTs as a core transistor material, even in the field of printed electronics,” NEC said in a statement, adding that “further research is expected to show the potential to dramatically expand the scope of printed electronics applications.”

(February 13, 2008) Tokyo — NEC Corp. has announced the successful development of a carbon nanotube (CNT) transistor using a coating process. The basic operation of the new transistor with advanced characteristics has been verified, confirming its application in the printed electronics field.

Feb. 8, 2008 – Legacy Holding, a provider of wafer cleaning/strip technologies, says it has submitted a patent application for its proprietary “Organostrip” photoresist removal technology used in backend semiconductor manufacturing processes, saying that opportunities in China’s IC industry make it a sweet spot for business.

The company generally described its technology in a statement, saying it removes photoresist in backend processing “in less than 30 seconds,” claiming it does not damage advanced metal interconnects (e.g. Cu) nor alter electrical properties of low-k dielectric films. It says the technology was developed “through a four year partnership with the world’s largest semiconductor manufacturer” (presumably meaning Intel).

Driving the company’s patent push are increased use of photoresist removal in both backend and solder bump packaging by Asian semiconductor fabs/foundries in Asia, and also growth rates in China, the company noted. It also cited data from the SIA that China’s government seeks to grow its chip industry from $2B in 2000 to $24B by 2010, annual growth of >25%, more than double the projected worldwide annual growth (8%-10%) during the period.

Also noteworthy is the company’s apparent ties to Intel, which has already laid out plans for its proposed 300mm Fab 68 in Dalian, China, expected to open sometime in 2010.

Legacy CEO Robert Matthews stated that following the company’s work with a leading semiconductor equipment manufacturer, it wants to extend the product “to other Tier 1 customers that are experiencing similar challenges,” with the eventual goal of becoming “the technology ‘process of record’ for other Tier 1 fabs.”

February 6, 2008 – Nanomaterials developer Ecology Coatings Inc. (OTCBB: ECOC), has signed a letter of intent with the U.S. Automotive Partnership for Advancing Research & Technologies (USAutoPARTS) to participate in a nonprofit automotive research initiative program.

USAutoPARTS, which is to be located in a 56,000-square-foot research and development facility in Shelby, Mich., and donated by Delphi Corp., has invited a number of companies to locate a portion of their R&D organization within the facility.

Funding for the R&D facility will be obtained from companies in the automotive industry, foundations, government grants and other financial resources. The participating companies will focus their research on three areas: lightweight materials, electric and electronic thermal management systems, and carbon emissions control.

No date has been set for completion of the fundraising or for USAutoPARTS to move into the Delphi facility.

“With the increased market and regulatory pressure to improve fuel efficiency, there is a need to cost-effectively lower vehicle weight without sacrificing safety,” said Ecology Coatings CEO Richard Stromback.

“Lightweight polymer and polymer composites, metal matrix composites, and bio-based materials are being developed to replace certain heavy metal components currently used in the manufacture of vehicles.”

This company’s latest M1 AOI system, the M1m, has been developed with special design enhancements to address the advanced inspection challenges presented by complex wire bonding, epoxy splash, and ever-shrinking component sizes. The system offers advanced high-speed device inspection with good defect coverage. With 3 megapixel resolution, telecentric optics, and proprietary Fusion Lighting technology, the M1m inspects bond wires, die placement, and SMT components and substrates, all within a footprint that is <1 sq. m. The system can be put in-line with wire bonders or off-line to support several bonders. With CAD data input, a complete recipe can be completed in <1 hour. The M1m utilizes a standard SMT package library to simplify training and insure program portability across manufacturing lines. This company's off-line programming software allows the engineer to program the system at any remote location while the system continues with production. YESTech, San Clemente, CA; www.yestechinc.com.

The first CMOS RF switch of a whole new family, the BGS12A, is available in a fine-pitch wafer-level package with dimensions of 0.79mm x 0.54mm, which the company says is ~60% less printed circuit board (PCB) space compared to the smallest packaged GaAs RF switch on the market.

This 27-gauge tapered dispensing tip makes it possible to apply extremely small, precise amounts of silicones, epoxies, lubricants, and other thick assembly fluids. Designed for use with air-powered dispensing equipment, it will produce accurate, consistent dots and lines as small 0.008-in. wide. The new tip was created to help manufacturers keep pace with the trend towards smaller products with tighter tolerances, and the increasing use of adhesives on products that do not permit the use of mechanical fasteners. The silicone-free tip is precision molded from clear polyethylene that will not scratch delicate surfaces, and the tapered design provides faster flow than straight dispensing needles when using thick or particle-filled materials. Like all EFD dispensing tips, it has SafetyLok threads for safe, secure attachment to syringe barrels and dispense valves. EFD, East Providence, RI; www.efd-inc.com.

Since then, KIC has grown dramatically to become the industry leader in automated thermal management tools and systems for reflow, wave, cure and semiconductor thermal processes.

(February 04, 2008) SUNNYVALE, CA — Unisem Berhad today announced that KVD, a provider of test solutions for the analog-dominant device market, will be leasing part of Unisem’s Sunnyvale testing facilities for KVD’s analog testing services and solutions for final test and wafer sorting. KVD will have its own engineering staff onsite and will utilize Unisem’s onsite training facilities to provide classes for engineers and operators to allow them to get up to speed quickly on the latest analog testing equipment.

“All of our businesses have exceptional people, products, and intellectual property, and the ability to achieve category leadership in their markets,” said Greg Brown, president and CEO. “We are exploring ways in which our Mobile Devices Business can accelerate its recovery and retain and attract talent while enabling our shareholders to realize the value of this great franchise.”

(January 31, 2008) NEWPORT, WALES — Surface Technology Systems plc (STS) has announced that it has sold a Pegasus deep reactive ion etch (DRIE) tool to the Institut f