Category Archives: Materials and Equipment

by Jeff Demmin, Contributing Editor, WaferNews

As usual, the challenge for SEMICON West attendees is prioritizing among the many options to make the best use of your time. SEMICON West seems to have more “extras” than ever, and this year many of them are focused on assembly and test.

With the next biennial update to the International Technology Roadmap for Semiconductors (ITRS) due in December, Wednesday’s (July 17) Summer Public Conference for the 2007 ITRS will be a good opportunity to get information from the current drafts of each working group — and they still welcome public feedback, too. Updates typically highlight changes from the previous edition, and looking at these changes is a great way to see what the experts think is either more or less important or challenging than two years ago. A very full agenda covers every chapter in the ITRS, and a panel discussion titled “More than Moore” should cover some topics related to the 3D technology that is helping to address the conventional scaling described by Moore’s Law.

One of the more efficient options is the half-day Kulicke & Soffa Interconnect Symposium on Tuesday afternoon (July 17), which promises a view of advanced packaging from all possible angles, from the analyst community to a major chip company, a large subcontractor, and a materials/equipment supplier. Jan Vardaman, president of TechSearch International, will offer an update on “Advanced Packaging Interconnect Trends and Technology.” Recent focus areas for TechSearch have included developments in Asia and materials trends, and those are certainly big topics now. Freescale scientist Stephen Lee will give an update on wire bonding on Cu / low-k devices with bond pads on top of active circuitry. Challenges with Cu / low-k have been studied for years, but “bond over active circuitry” is an important space-saving approach that can decrease the die size. Flynn Carson of STATS ChipPAC will talk about “Advanced 3D packaging and interconnect schemes,” which covers perhaps the most critical areas in packaging today. K&S VP Robert Chylak concludes the session with a talk on ultrafine pitch copper wire bonding.

A series of technical sessions held under the “Test, Assembly, and Packaging TechXPOT” umbrella also promise some interesting updates. The sessions include advanced packaging trends and packaging material trends, as well as three separate sessions on various aspects of test. Joint sponsors of these sessions include MEPTEC, IMAPS, and FSA, which should contribute to fresh content with a variety of viewpoints.

Perhaps the most interesting trend in the TAP TechXPOT is the quantity of test coverage. A session on “Critical issues in test” includes speakers from Advantest, Credence, Verigy, Teradyne, and Qualcomm, scheduled to discuss topics including “Redefining the value of test in an era of commoditization” — a particularly important topic for the industry given the escalating cost of test. Another test related session, “Best of Burn-In & Test Sockets and IEEE Semiconductor Wafer Test workshops,” has selected presentations from the events, as well as an overview presentation by Jerry Broz, general chair of the IEEE event.

Last but not least, on Thursday (July 19) representatives from throughout the supply chain, including Intel, LogicVision, TSMC, and ASE, give their views on test as “A gating factor for success at advanced nodes.” A key concept to be discussed is the need to reduce the cycle time for test and debug. Faster cycle times improve the test quality while decreasing the time to market, which all contributes to a higher value-added for the test process. As usual, it all comes back to cost, which is why SEMI is focusing on test so much in 2007. — J.D.

June 26, 2007 — /PRNewswire-FirstCall/ — MARLBOROUGH, MA — Rohm and Haas Electronic Materials will invest $60 million in leading-edge lithography equipment to support its extensive research and development of advanced 193 nm photoresist and anti-reflective coatings used in the manufacture of semiconductor devices.

“As a leading material supplier to the semiconductor industry, our ability to deliver advanced lithography materials is critical, especially as the industry moves down below the 45 nm node,” says Dr. Dominic Yang, business unit director, microelectronic technologies. “This investment will not only enable deep technical partnerships with the front runners in the memory, foundry, and logic segments, but will bring to these customers high-quality products manufactured and tested using the best tools in the industry.”

As part of its investment, Rohm and Haas Electronic Materials will purchase ASML’s TWINSCAN(TM) XT: 1900Gi 193nm Step and Scan system. This tool, along with a new 300 mm coat/develop track and state-of-the-art defect and metrology equipment, will be installed in first quarter of 2008.

Dr. Peter Trefonas, research and development director for microelectronic technologies, says the addition of an immersion tool is an important investment for Rohm and Haas. “Many of the world’s leading semiconductor manufacturers — our customers — are installing advanced immersion equipment on their commercial lines. This immersion tool investment is the right step at the right time for us,” says Trefonas.

“Our 193 nm materials are increasingly being selected as the process of record in the industry,” Trefonas adds. “As adoption of immersion technology widens, Rohm and Haas Electronic Materials will continue to push the edge of materials innovation.”

About Rohm and Haas Company
Leading the way since 1909, Rohm and Haas is a global pioneer in the creation and development of innovative technologies and solutions for the specialty materials industry. The company’s technologies are found in a wide range of markets including: building and construction, electronics, food and retail, household and personal care, industrial process, packaging, paper, transportation, and water. Our innovative technologies and solutions help to improve life everyday, around the world. Based in Philadelphia, PA, the company generated annual sales of approximately $8.2 billion in 2006. Visit http://www.rohmhaas.com/ for more information.

About Rohm and Haas Electronic Materials
Rohm and Haas Electronic Materials develops and delivers innovative material solutions and processes to the electronic and optoelectronic industries. Focused on the circuit board, semiconductor manufacturing, advanced packaging, and flat-panel display industries, its products and technologies are integral elements in electronic devices around the world. Additional information about Rohm and Haas Electronic Materials can be found at http://www.rohmhaas.com/.

Source: Rohm and Haas Company

Contact:
Jeremy Cole
Tel: 508-229-7047
E-mail: [email protected]

Dr. Rick Hemond
Tel.: 508-229-7299
E-mail: [email protected]

Nano Risk Framework to aid in responsible development of nanotechnology

June 21, 2007 — /PRNewswire-FirstCall/ — WASHINGTON, DC — DuPont and Environmental Defense today released a comprehensive framework to assist with the responsible development and use of nanotechnology and to help inform global dialogue on its potential risks. The Nano Risk Framework is intended for use around the world by small and large companies, regulatory agencies, universities, and others with an interest in commercializing nanoscale materials.

DuPont and Environmental Defense began a partnership on nanotechnology in September 2005, creating a multi-disciplinary team with expertise in science, engineering, law, and business. The goal was to develop a systematic and disciplined process for evaluating and addressing the environmental, health, and safety risks of nanomaterials across all stages of a product’s lifecycle — from initial sourcing through manufacture, use, and recycling or disposal.

The resulting framework offers a thorough and usable six-step process for organizations to identify, assess and manage potential risks. The six steps within the framework include:

  • Describing the material and the intended application.
  • Profiling the material’s lifecycle in this application.
  • Evaluating the associated risks.
  • Assessing risk management options.
  • Deciding and documenting actions.
  • Regularly reviewing new information and adapting actions accordingly.

“Nanotechnology has the potential to unleash innovations in materials, energy, and other fields that could lead to powerful environmental and health benefits,” says director of corporate partnerships at Environmental Defense Gwen Ruta. “Our intent is to help reap the full promise of this technology without creating unintended consequences. We want to get this right the first time around.”

“This framework outlines a disciplined process for the responsible development of nanomaterials,” says DuPont vice president and chief sustainability officer Linda Fisher. “At DuPont, we have adopted this approach as a part of our mandatory product stewardship process, and we encourage others to do the same. While we do not see this framework as a substitute for regulation, we hope that it assists governments in drafting appropriate regulations.”

In developing the framework, DuPont and Environmental Defense solicited and received significant feedback from a broad range of interested parties, including other companies and NGOs, government officials, and academics. The framework uses proven risk-management techniques in order to fully integrate with any current environmental, health, and safety practices in place within companies. It also provides several new elements that can be instrumental in understanding the unique potential risks of nanomaterials, including: the recommendation to develop informational profiles (or “base sets”) regarding the properties, hazards, and exposures associated with a given nanomaterial; and guidance on developing more detailed information on physical-chemical properties, ecotoxicity and environmental fate than has typically been used in existing risk management profiles.

In order to evaluate the effectiveness, flexibility, and practicality of the framework, DuPont conducted three demonstration projects on three different classes of nanoscale materials: a new titanium dioxide-based product, carbon nanotubes, and zero valent iron.

“These projects were selected not only because they are of interest to DuPont, but also because they represent a good test of the framework,” says DuPont global regulatory affairs director Terry Medley. “Each represents a different position for DuPont in the value chain and is at a different stage of development. The projects required different resources, produced varying outcomes, and each demonstrated different aspects of the Framework.” The three projects were:

  • A new titanium dioxide-based product, called DuPont(TM) Light Stabilizer 210, which is designed as sun protection for plastics. An announcement about this product and its commercial availability will be made in the near future. Not all of the particles in this product fit the specific definition of nanomaterials, since a significant fraction is larger than the threshold 100 nm size. However, this material proved to be a good test of the framework’s methodology. The framework helped DuPont develop a comprehensive exposure and hazard profile for this material prior to commercialization.
  • Carbon nanotubes incorporated into polymer nanocomposites to improve mechanical and electrical properties of engineering thermoplastics. DuPont currently conducts basic research and development using carbon nanotubes for potential future product applications. The company used the framework to refine internal management procedures and to identify questions to be answered for such applications before they move from R&D toward commercialization.
  • Nano zero valent iron, which DuPont was evaluating for potential use in groundwater remediation. Use of the framework identified a number of questions regarding the physical safety, fate, and transport of the material for this environmental application. DuPont chose not to pursue use of this material until these questions could be addressed.

Environmental Defense, a leading national non-profit organization, represents more than 500,000 members. Since 1967, Environmental Defense has linked science, economics, law, and innovative private-sector partnerships to create breakthrough solutions to the most serious environmental problems.

DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.

Source: DuPont

Contact:
Michelle Reardon of DuPont, 302-774-7447, [email protected]

Melanie Janin of Environmental Defense, 202-572-3240, [email protected]

Web site: http://www.dupont.com/

June 25, 2007 — ST. PAUL, MN — Ecolab Inc. announced today a new Hand Hygiene Monitoring Compliance Program for hospitals and healthcare facilities. The Ecolab Hand Hygiene Compliance Monitoring Program provides a multi-intervention approach that combines effective hand hygiene products, a step-by-step implementation process, patient empowerment education and training materials, ongoing measurement, and benchmarking to increase and sustain hand hygiene compliance. According to the Centers for Disease Control, proper hand hygiene is the single most effective method for preventing healthcare-associated infections (HAIs) in hospitals.

“Simply put, proper hand hygiene enables hospitals to provide better patient care and to reduce costs,” says Tim Mulhere, vice president and general manager of healthcare at Ecolab. “The Ecolab Hand Hygiene Compliance Monitoring Program provides all the tools and resources hospitals need to drive hand hygiene compliance and reduce healthcare-associated infections.”

Elements of the Ecolab Hand Hygiene Compliance Monitoring Program include:

  • Patient empowerment — Patient empowerment programs increase awareness of the importance of hand hygiene and encourage patients and their families to ask their healthcare provider to wash or sanitize their hands prior to any direct contact. Ecolab has developed a comprehensive set of materials, including brochures, posters, buttons, and a video, under a program entitled “It’s OK To Ask,” that encourage patients to actively participate in their care. According to recent studies (1999-2006) in the American Journal of Infection Control and Journal of Hospital Infection Control, patient empowerment and measurement have been shown to increase and sustain compliance on average 56 percent.
  • Measurement — Measurement of compliance data establishes an accurate, current baseline compliance rate against which progress can be tracked. Ongoing measurement and reporting further supports compliance by enabling hospitals to objectively measure the progress of programs and promote improvements.
  • Benchmarking — Confidential reporting of data and analysis helps hospitals to validate their hand hygiene program as it grows. In addition, ongoing compliance can be compared against data from similar sized hospitals and units including in

(July 9, 2007) DUBLIN, Ireland &#151 Analyst firm Research and Markets released “Plasma-aided Nanofabrication: From Plasma Sources to Nano-assembly,” detailing plasma-based processing techniques, carbon-based structures, and quantum confinement elements in nano-fabrication. Ken Ostrikov, Ph.D., University of Sydney (Australia); and Shuyan Xu, professor, Nanyang Technology University (China), authored the summary of plasma tools and processing.

The publication details reactive plasma as a nano-fabrication tool, plasma production and plasma-source development, applications including carbon-based nanostructures and low-dimensional quantum confinement structures and hydroxyapatite bioceramics. Written principally for solid state physicists and chemists, materials scientists, and plasma physicists, the book provides a forecast for each application.

July 3, 2007&#8212Unidym, the nanotechnology company that develops high-performance, cost-effective products for the electronics industry, and majority-owned subsidiary of Arrowhead Research Corporation, has established a technical advisory board. The board, whose members are internationally recognized leaders of the scientific community with expertise ranging from nanoscale materials to printed electronics, will advise the company as it moves into its next phase of growth.

Members of the technical advisory board include Professor P. M. Ajayan, the Henry Burlage Professor of Engineering at the Rensselaer Polytechnic Institute; Professor Mike McGehee of Stanford University; George Gruner, Distinguished Professor at the University of California-Los Angeles; Professor Jin Jang of Kyung Hee University, Korea; Professor Jie Liu of Duke University; and John Rogers, Founder Professor of Engineering at the University of Illinois at Urbana-Champaign.

Unidym is focused on the manufacture and application of carbon nanotubes (CNTs) and is actively pursuing joint development and partnerships with manufacturers of touch panels, solar cells, and flat-panel displays. The company expects to execute key agreements and begin joint development work in the near future.

The American Association of Cancer Research’s recent article, “Nanoparticles Can Damage DNA, Increase Cancer Risk,” provides a good example of how researchers can unintentionally damage the public’s ability to develop a balanced understanding of nanotechnology.

The article covers research done at the University of Massachusetts and relays an interview with an undergraduate researcher, Sara Pacheco, who conducted a study on genotoxicity of two nanoparticle types. According to the article, Ms. Pacheco attributes a number of unfavorable qualities to “nanoparticles” and claims “such nanoparticles” are being used in a series of consumer goods.

Unhelpful and misleading

The article intimates that nanoparticles are a monolithic entity. As I am sure Ms. Pacheco is aware, there are vastly different nanoparticle forms, ranging from nano-metals to carbon nanotubes, buckyballs, nano-metal oxides, nano-clays, quantum dots, and several others. Even within a class such as carbon nanotubes, the number of walls, chirality, length, diameter, and surface chemistry all profoundly affect reactive properties.

Talking about “nanoparticles” is, in fact, a bit like talking about “materials”-and the statement “materials can damage DNA” is about as accurate and as informative as the article’s headline. Aside from the article’s assertion that nanoparticles are all approximately 100 nanometers in size (and certainly that is subject to debate), little can be said about them as a group. The article even admits this, stating that “very little is known about how [nanoparticles] behave,” a fact that surprisingly does not stop the author from making definitive statements about them.

As Ms. Pacheco is quoted as saying, studies like the one she and her colleagues conducted are valuable in that they improve our understanding of how a particular nanomaterial interacts with human biology. It is a mistake however, to use these findings to imply a threat from products that contain that nanomaterial. Just as there is a difference in toxic effect between drinking and inhaling water, there is a difference between holding a tennis racket with some nanotubes in the handle and directly introducing nanotubes to the DNA of cancer cells. The study neither uses the same formulations of carbon nanotubes found in consumer products, nor does it use an exposure route that represents how a consumer would come in contact with nanotubes through using the products.

In fact, in many cases where carbon nanotubes are incorporated into a matrix (like a plastic or ceramic), they bind very tightly to their surrounding and there is no evidence that they are released through use. Furthermore, most carbon nanotubes have a very high tendency to clump so that even if there existed a case where they were released, they would likely lump themselves into macro-scale carbon before contacting a cell.

Fundamentals

The article quotes the research team and Ms. Pacheco as using these findings to recommend that with nanoparticles, it is “prudent to limit their introduction into the environment.” This statement conveys a fundamental misunderstanding of the existing presence of nanoparticles in our world. Carbon nanotubes and C60 fullerene nanoparticles are produced as a by-product of most fossil fuel combustion, and sea salt on the surface of the ocean exists as a nanoparticle. We have been inhaling them and coming into contact with them ever since we discovered how to burn wood and walk to the beach-a fact that calls into question the entire culture of alarmism over the toxicity of nanomaterials. The difference is that the nanoparticles used in products have specifically been engineered to remain in the product and to be safe. If we truly want to limit our introduction of nanoparticles, our best bet would be to start using the nanocatalysts and ultra-light nano-materials that will cut down our fuel consumption.

To be fair, these issues are not isolated to this article, and I doubt there was any intent to mislead. Terms like “nano-particle” are a convenient shorthand, but there is no standard definition for them and they can be misleading. Nanotechnology holds significant promise and there are good reasons to be cautious as we proceed with it.

However, as the article admits, “there is not enough data yet” to warrant being alarmist. And we must not forget mass media’s penchant for alarmism. Scientists routinely demand precision and accuracy in research and engineering work. And it’s certainly time to make the same demand concerning communication with the public.

Click here to enlarge image

Aatish Salvi is vice president of the NanoBusiness Alliance. He can be reached at [email protected].


Sean Olson
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Through its merger with Carbon Nanotechnologies Inc. (CNI), founded by the late Richard Smalley, who won a Nobel prize for his work in nanotechnology, Unidym has assembled a full intellectual property portfolio and a range of patents covering many aspects of carbon nanotubes (CNTs).

Arrowhead Research, a publicly traded company that invested in Unidym and retains majority control, aims to assemble a complete management team, a well-stocked patent portfolio, and production capacity to make CNT-based products. Validating that strategy is the recent $16.5 million second-round investment by York Capital Management.

Unidym’s president Sean Olson (see editor’s note below) recently announced a pact with Touch Panel Laboratories of Japan to develop CNT films for handheld gaming devices. Olson tells Small Times’ Jo McIntyre how he manages the challenges of finding new markets while he’s running the merged organization.

Q: Managing industrial innovation is always challenging. What is your perspective on this? Where do you start?

You begin by focusing on which of your capabilities or assets will form the foundation for your new ideas. Whether it’s a technology platform, a customer need, or even a distribution channel, I believe it’s important to pick a starting point, even if the idea-generation process takes you someplace else.

Once you’ve come up with a few concepts, the focus should be on understanding what potential customers want. It is absolutely imperative to get out into the marketplace as quickly as you can-go to conferences, trade shows, and anywhere else you might find potential customers-and talk to them about the concept.

You will learn more from a one-hour discussion with somebody who is in one of your target markets than you will in a month of reading background materials.

Q: How do you handle the complex management structure of Unidym, CNI, and Arrowhead Research?

There was strong agreement on the strategy before the merger, so there aren’t that many management issues associated with the integration. We wanted to bring our carbon nanotube-based products to market, but knew we needed to have a stronger intellectual property position and internal production capability for our proprietary CNTs.

On CNI’s side, they realized that many of the opportunities for carbon nanotubes are ones where you don’t need a large volume of material. For them to be able to capitalize on these characteristics they knew they needed to forward-integrate into the product to capture more of the value.

What Unidym had was one specific product: transparent, conductive film of carbon nanotubes that replaces the indium tin oxide (ITO) films currently used in touch screens, flat-panel displays, OLEDs, and thin-film solar cells. It was a very good fit for what CNI wanted to do.

Q: Arrowhead starts up and operates companies through relationships they have with universities. How does that work?

There are many great technologies at universities, but not many companies are working on pulling them out into the market. That’s the opportunity for Arrowhead.

Arrowhead’s model is a bit different from the standard venture capital model. In addition to providing funding, Arrowhead maintains a controlling interest in each company and provides more management expertise and operational support, like back-office-type services, than most venture companies.

They have five subsidiaries engaged in commercializing nanotech products and applications, including anti-cancer drugs, RNAi therapeutics, carbon-based electronics, and compound semiconductor materials.

Q: How did Unidym begin?

Two years ago, John Miller of Arrowhead started Nanopolaris to assemble a toolbox of patents and productions capabilities. After about a year, the company decided there were near-term manufacturing opportunities in CNTs, so in the summer of 2006 it decided to combine with Unidym, a company that was started by UCLA professor George Grüner.

Nanopolaris took on the Unidym name and became a company with patents and a product direction-transparent conductive films and CNT-based film transistors.

Arrowhead funded the combined company with $7 million, and I got involved about three months after that.

Q: Is that where your business skills were needed?

Yes. There had been no formal management team in place. Arrowhead asked me to get involved, refine the strategy for the company, and bring in a management team. Miller got into active discussions with CNI about a merger a few months after I joined. At the outset, there was strong agreement as to what the strategy of the company should be.

Q: Do you have any customers for this product?

Yes. We sold CNT materials in 2006 to a wide range of different customers, mostly for R&D. We want to continue those relations. We expect to begin selling our transparent conductive film product in 2008. Our thin-film transistor technology leverages the work we’re doing in deposition of CNT-based films and is a second-generation product. We’re aiming for the emerging flexible display market.

Q: With Touch Panel Laboratories of Japan, for example? Do you view this as a major development, or is it just a part of your larger strategy?

It’s a collaboration with them. There is no money involved in the Touch Panel Lab joint development deal we announced in April, but we expect to have product sales in 2008. They have expertise in different touch panel markets. We are working to integrate our products into one specific area-handheld gaming applications-where they think it’s promising.

The reason CNTs are of interest there is that the primary failure mode in touch panels found in gaming devices is microcracks in the transparent conductive films that today are made of ITO. CNT films are actually a network of tiny wires that don’t degrade under repeated mechanical loading, like hitting the panel with a stylus. The CNT manufacturing technology is also less expensive, because it’s an aqueous, roll-to-roll deposition process, almost like a printing press.

Q: Does Unidym also conduct research projects, or do you farm those out to universities?

We do most of our research internally, but there are lots of experts out there doing interesting things with CNTs, and we want to develop strong relationships with them. We are funding two university projects: one at Duke with Jie Liu, who is working on carbon nanotube-based interconnects, and another at the University of Florida with Andrew Rinzler, who is working on thin-film transistors. He’s pursuing a slightly different approach than what we are doing in-house.

Q: Will you also license your many patents to other manufacturers?

Yes. We intend to use them to work with companies to bring products to market. A big driver for our merger with CNI was to get the IP base to get to market. Unidym’s patent portfolio broadly covers many other promising applications, ranging from structural composites to sensors to therapeutics. We want to partner with companies that already have capabilities in these markets.

Q: Which of these are closest to commercialization or licensing out to other manufacturers?

There are already commercial applications for carbon nanotubes in composites, and CNI is selling into that space. That is actually here and now. I believe the next big opportunity is in transparent conductive films, where we’ve got something cheaper and better than ITO films used today. Longer term, we see uses in therapeutics and drug delivery. We expect to license these, because electronics is our core capability.

Q: What do you consider the most promising direction nanotechnology research is taking these days-electronics, medicine, optics, cosmetics … ?

Electronics definitely presents the most near-term opportunities, most specifically for CNTs. As far as long-term impact, medicine would be my top pick. Arrowhead has two companies working in that space. Insert Therapeutics has developed a nano-engineered sugar that stays in the system longer for drug delivery in oncology. Calando Pharmaceuticals can engineer a delivery mechanism for siRNA therapeutics to reach their intended targets.

Q: What accomplishments are you most proud of?

I’m proud of getting myself into a role where I can help bring exciting new technologies to market. CNTs have great potential, but as with most innovations, it has taken longer than people expected. It takes a network of companies, researchers, and customers to make new technologies happen.

That critical mass is finally here for CNTs and, with the IP, the ability to produce CNTs, and a great product opportunity, we are well-positioned.


The Olson File

Sean Olson, 36, has MS/BS degrees in mechanical engineering from Massachusetts Institute of Technology and an MBA from Harvard Business School. His technical and business experience includes positions with Silicon Valley Group Lithography, Idealab, and The Boston Consulting Group.

In 2004, he co-founded Aonex Technologies, a start-up that develops materials for the blue LED industry with a seed investment from Arrowhead Research. In November 2006, he became president of Unidym, where he will refine business strategy, hire key team members, and position the company for an IPO by the end of 2007.

Increasing microelectronic density and processing speeds imply more heat. Small tech offers next-gen solutions

By Richard Gaughan

Perhaps classifying Gordon Moore’s famous 1965 prediction-that the economically producible number of discrete components in a single IC was to double every two years-as a “Law” has given it a sense of inexorability. In fact, though, Moore’s observation was a quantification of the effects of human ingenuity in the face of a technical challenge.

And there are challenges ahead.

The average power density of advanced microcircuits is heading to several hundred Watts/cm2, creating a more difficult heat dissipation problem at the same time as small circuit dimensions lead to greater consequences of overheating. Power requirements are also an exponentially increasing function of processing speed.

If microelectronics are to continue to follow the trend of increasing density and improved processing speed, then innovative methods of dissipating heat are needed. Micro- and nano-cooling approaches are poised to meet that need.

The task of a thermal management system is to get heat out of a sensitive area and dissipate it in a large heatsink. For example, a microprocessor may be mounted with an integral radiator so that heat conducts from the electronic chip through the device to the radiator base and then radiates into the surrounding air. A circulating fan will exchange the air within the case with air from the room, which then becomes the final heatsink.

The first step is simply to get the heat from the chip to the radiator base, and the effectiveness of heat transfer depends upon the quality of the surface contact. Thermal grease is often used to ensure uniform thermal contact between the two surfaces. The better the thermal grease, the better the heat transfer.


An array of vertically aligned carbon nanotubes grown using plasma enhanced chemical vapor deposition is intercalated with copper to create a composite that exhibits good thermal properties ideal for chip cooling. (Image courtesy of NASA)
Click here to enlarge image

Carbon nanotubes are the most thermally conductive material known, so what better material for enhancing thermal conductivity? That is the reasoning of Professor Minoru Taya of the University of Washington. He developed a material blend that takes advantage of both the thermal conductivity of CNTs and the mechanical flexibility of phase changeable polymer (http://depts.washington.edu/cims/research/electronic.htm). Using chloroform as an environmentally friendly solvent, the CNTs are dispersed in the polymer matrix. With the material under compression, when the polymer changes to liquid, at its specific critical temperature, the thickness decreases. Combined with the high conductivity of the CNTs, the resistance of the thermal interface material is a factor of five smaller than traditional thermal interface material.

Good thermal interfaces are useful in other places as well. For example, the Hubble Space Telescope’s Imaging Spectrograph suffered from high operating temperatures, which degraded the data quality. The problem is that surface roughness in the conductive path decreases the thermal conductivity, raising the instrument’s temperature. That may change during a proposed Hubble servicing mission next year. If approved, the material, a carpet of 40-micron-long carbon nanotubes on a copper pad, will be inserted between the two surfaces. The nanotubes, intercalated with copper, retain their structural integrity even at pressures up to 60psi. The nanotubes will conform to the rough surface, providing good thermal contact.

The intercalated CNT/copper material is also suitable for chip cooling, for which NASA has licensed the technology to a commercial partner. Meyya Meyyappan is the chief scientist for exploration at NASA’s Ames Research Center (www.ipt.arc.nasa.gov/). He spoke at NSTI’s Nanotech 2007 conference, held May 21-24 in Santa Clara, Calif., about the status of a variety of carbon nanotube applications.

This example, like all he spoke of, relies on the properties of nanomaterials to provide unique capability, but, he said, “the system itself needs a seamless integration to micro/macro for a technically feasible and commercially viable product.”

To the macro world, and beyond!

Thermal management systems are a perfect example of Meyyappan’s point. Heat may be transferred through highly conductive nanomaterial, but eventually large amounts of heat must be dissipated into the environment, the “thermal bath,” and that takes macro-scale hardware. Cooligy (www.cooligy.com), a company based in Mountain View, Calif., has developed a microstructured heat exchanger as the heart of an integrated liquid cooling system for advanced microelectronics. The company’s system approach considers not only such factors as workability of the heat exchanger material and low thermal resistance of the exchanger design, but also macroscopic factors such as efficiency of the radiator design, thermal conductivity of the cooling liquid, and even resistance to bacterial growth within the cooling loop.

Effective heat transfer in a cooling system requires the cooling fluid to be in contact with as much surface area as possible of the material that is designed to extract the heat. Fabrication of a reliable and efficient high surface-to-volume ratio microstructure (HSVRM) is therefore extremely critical for developing an effective microheat exchanger. For microchannels of the same shape, the heat transfer coefficient is inversely proportional to the hydraulic diameter. HSVRMs with very fine features in a microheat exchanger should significantly enhance heat transfer.

HSVR microstructures that are applicable in microheat exchangers can be classified into two types: microchannel and microporous. Silicon microchannels are commonly used in liquid cooling systems, although metallic materials with higher thermal conductivity are preferable for more-effective heat transfer. Folded fins are another class of microchannel HSVRMs that are used as heat exchanger structures.

Microporous types of HSVR structures provide higher values of surface area per unit volume than commonly used micro/minichannels. Mesh and woven mesh structures are ordered porous structures, while metallic foams are the most common form of unordered microporous structures. They are formed by sintering a polymeric foam substrate that is coated with slurry of metallic particles. Metal foams can also be created by electrodeposition accompanied by hydrogen evolution where metallic deposition takes place around hydrogen bubbles. The surface area of this electrochemically formed porous foam structure is several orders of magnitude higher than the other types of foams because of dendrites that form within the pores.


This image illustrates part of a series of experiments at Purdue University designed to quantify the effects of surface roughness on heat transfer. In general, increased roughness appears to offer increased heat extraction. (Image courtesy of Suresh Garimella, Purdue University)
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The problem is that small features, while they enhance the heat transfer, increase the pressure drop, levying additional requirements on the pumping system. Cooligy circumvented this problem by incorporating a manifold into the side of the heat exchanger away from the microelectronics and retaining the microstructure adjacent to the surface to be cooled. But, as Madhav Datta, Cooligy’s chief scientist, said at the recent Electrochemical Society Meeting in Chicago, “development of microheat exchangers with high heat transfer rate and minimized pressure drop is a challenging task.” Depending upon the application and required performance, the active microstructure heat exchanger design can be the porous material or the microchannel design. Coupled with a high-pressure compact mechanical pump or other pump technology, the system can maintain consistent die temperature in the presence of local hot spot zones of 1 to 2mm2, with power densities of 500W/cm2 or above. According to Fred Rebarber, director of sales and marketing, Cooligy’s process is compatible with high-volume manufacturing techniques, so costs are kept low for a technology that “offers maximized performance and reliability in a system concept that is available today for a wide range of high-end thermal management needs.”

Other commercial solutions are coming from companies such as ALD Nanosolutions, IBM, Celsia, and CoolChips (see “Aiming for a cool market,” p. 15).

Two-phase is best

The Cooling Technologies Research Center (CTRC, http://meweb.ecn.pur due.edu/~CTRC/), founded in 2002 at Purdue University, is one of the National Science Foundation’s industry/university cooperative research centers. The center’s mission is to improve the understanding and technology of high-performance heat removal from compact spaces. Air-cooled and passive heat pipe approaches generally available in commercial equipment, according to Suresh Garimella, the CTRC’s director, “have a limited ability for heat removal, and acoustic noise and space restrictions may prevent air cooling solutions from continuing. New solutions are already being called for, and a wide variety are being investigated both in the industry and universities.”

Garimella’s academic investigations into liquid cooling systems have reached the conclusion that a two-phase cooling cycle is the optimum system design for high-performance applications. In a two-phase system, the confined liquid is heated to the boiling point and then condensed, cooled, and recirculated. The latent heat of the phase transition provides a larger, well-defined heat transfer that functions at lower flow rates and smaller temperature differentials than a single-phase liquid cooling system. But the thermal performance can be influenced by several factors, including exactly where in the system the phase transition takes place, the liquid flow rate, and other conditions. The pressure requirements vary as a function of flow conditions, so design constraints on the microchannel heat exchanger, the tubing interconnections, and the pump are likely to be tighter than necessary for single-phase systems.

Several pump technologies are available, but to reach the full potential and full economic competitiveness, Garimella believes micropumps must be incorporated within the microchannel structure of the heat exchanger. No current technology is effective at that scale, but he is encouraged by the prospects for integration of electrohydrodynamic injection micropumps.

More hot technologies for cooling

Garimella noted, “We consider a wide range of approaches that span the spectrum from very high flux techniques to those that are very quiet, consume very little power, and can be incorporated into portable devices.” Other technologies that have shown promise for cooling microelectronics are piezoelectrically driven resonant fans, immersive jet-impingement cooling, and advanced heat pipe designs.

For some of these technologies, the fundamental physics is not yet well understood. But, Garimella said, “even in cases where the operational principles are understood and demonstrated, there are a lot of implementation issues, including reliability, cost, and supplier availability.” Although the addition of thermal control capabilities introduces additional design considerations, Garimella believes it is now time for thermal management to be considered simultaneously with electrical considerations in designing the next generation of electronics.

He’s encouraged by the trend within industry to use that co-design approach. “With combined electrical and thermal design, the power efficiency and self-heating problems are likely to be kept at bay for the coming decades.”

Collaboration Is the Key

BY PAUL REID, K

Demands for continuously smaller IC packages with increased I/O capability are requiring tighter wire-bond loop tolerances. Die with multiple rows of bond pads, called tiers, are common in the current generation of package assembly (Figures 1a and 1b).


Figures 1a and 1b. Close-up views of wire loops in some of today’s packages.
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Achieving this high level of precision in loops on a wire bonder takes more than simply programming the right loop shape. It requires a deliberate collaboration and choice of materials, equipment, and motion control software to create reliable and repeatable loop profiles, while still adhering to the universal demands of maintaining the highest throughput, lowest cost, and highest yield. The diversity of package and customer requirements is causing process engineers to find creative ways to mix-and-match elements of the process to achieve the desired wire-bond loop profile.

Looping Materials

The diameter of bonding wire is getting smaller for two reasons: to achieve finer pitches in smaller packages and – given the current price of gold – to lower costs. Obviously, the wire itself is an integral structural component of the end product, and there is a limit to simply reducing the size used in a package before it adversely impacts performance and reliability. Not so obvious is that optimal wire type for various packaging challenges is required to achieve the correct level of final product quality and reliability. It will be an enabler of the specific wire-bond looping challenges of each package.

For example, applications that have die-center bond pads and strict package height limitations typically require very long, low, in-board wire loops. After the first bond is placed, the wire loop must travel a long, flat span to the die edge, and then descend to the second bond very sharply as the wire goes over the edge of the die. To achieve an optimal loop profile, as shown in Figure 2, the wire type chosen must be of sufficiently high tensile strength to allow for diameter reductions without compromised mechanical stability. The choice of loop shape, along with the programmable motions and trajectory of the bonding tool to create the loop itself, must also be considered. During the travel from first to second bond, a combination of forward and reverse motions put small “kinks” in the wire that give it the intended final shape and added strength. Choosing an ultra-low loop (ULL) profile on the wire bonder achieves the optimal loop height, span length, and descent angle to second bond.


Figure 2. Example of an optimal loop profile.
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In choosing wire from a strength perspective, there may be consideration to using copper wire instead of gold, which is inherently stronger and stiffer. Even though copper wire use is increasing in many applications, gold wire is still used in the overwhelming majority of the advanced packages under discussion. No longer can the old industry-standard 25-µm 4N wire be assumed to be optimal, particularly in these newer packages. The bottom line is that for each application, a review of the packaging and looping requirements such as pad pitch, desired bonded ball size, wire lengths, loop heights, desired pull strengths, etc. must be cross-referenced to the specific properties of gold wire such as size, tensile strength, elastic modulus, length of heated affected zone (HAZ), resistance to mold sweep, etc.

Capillary Properties

Similar to the choices in wire, more bonding tool choices are available to achieve an optimized process. The right capillary must be dimensionally specified to fit the diameter of the wire being used. However, even in this seemingly simply choice, there are some less obvious pitfalls to avoid. The internal diameter of the hole in the capillary is not exactly the same as the wire; there needs to be some room so the wire pays out smoothly through the cap as it is used. Generally, more room is better to reduce potential clogging from contaminants during production. However, too much space will affect placement accuracy. Many process engineers use the general guideline of a capillary internal hole diameter between 1.2× and 1.4× the diameter of the wire as a starting point.

After hole diameter, there are still many other decisions to make. Each capillary has more than 10 different parameters to specify (Figure 3). The capillary tip size, shape, and surface angles determine not only the gold ball size and shape; they also serve the added function of forming the second, or stitch, bond that cleanly severs the wire and allows the bonding process to start again for the next wire loop.


Figure 3. Each capillary has more than 10 different parameters to specify.
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Process engineers should evaluate the attributes of capillaries that are designed to address specific issues of stacked die and multi-tier applications. For instance, one capillary choice* was designed for wire loop reliability and repeatability, and works the wire to minimize wire sagging. Also, for finer-pitch applications, it can be specified in a contained inner chamfer (CIC) configuration, which optimizes the bonded ball shape to provide the most pad and ball contact in the smallest space, therefore providing the strongest possible bond with a smaller ball.

Equipment Ramifications

The automatic wire bonder remains the interconnect method of choice for many reasons, such as the extent of the installed infrastructure and capacity, the bonder’s inherent flexibility for adapting to a wide variety of packages, and the low cost of the overall wire-bond process. The other key element is the continued advancement of wire bonders’ capabilities. Continuously reducing the pad pitch on die with one row of perimeter bond pads was once the mainstay of filling the demand for increased I/O in a package. This has shifted to stacked die and multi-tiered packages as they achieve the increased I/O and provide increased device functionality, while the package size continues to decrease. These new packages have shifted the focus of the primary bonder spec discussion from accuracy and pitch capability to looping control and portability. New, tighter looping tolerances are called out as percentages of the diameter of the wire itself. These requirements simply could not have been achieved in previous generations of wire bonders. The enabling technologies in the wire bonders are the servo control systems and positioning systems, and the resulting improved resolution in the X, Y, and Z axes. The motions are being made with accelerations and decelerations of more than 12 Gs and with accuracy approaching ±2 µm. The motion-control systems are, in turn, enabled by the computational power and speed of the latest microprocessors, which allow continuous real-time execution of complex algorithms that tell the bond head where to go to create the desired loop and execute the requested bonding process.

Other bonder subsystems have made equally impressive jumps in capability. The most prominent is the vision system, which locates alignment reference points on both the die and substrate, and enables the bonder to correct for alignment inaccuracies within the package. New search algorithms and increasing camera translation speeds have kept the vision system from being the throughput-critical path. Advanced vision systems can perform certain additional functions on an as-needed basis, such as looking for backup reference points if the first is not found. This could occur in the simplest cases of when a die is not present or the site has contamination covering the primary reference point. This added functionality can keep the bonder from stopping and waiting for an operator to provide assistance due to a material problem. Such capabilities directly increase the mean time between assists (MTBA), translating into increased bonder productivity, while still keeping the yield at the highest levels, ultimately lowering the overall cost of production.

Conclusion

Cell phone vendors shipped 1.019 billion phones in 2006, 22.5% more than the 832.8 million mobile phones sold in 2005. Each phone will typically use more than two stacked-die packages. Increasing wire bonders’ technology – particularly their complex looping capabilities – has enabled these packages to be wire bonded. As new packages come to the assembly facility, process engineers can choose an optimal bonding wire and tool and the appropriate loop shapes and, in a short amount of time, develop a production-worthy process. Combining the latest high-performance bonding wire with an arsenal of process-customized bonding tools enables wire bonding to continue meeting challenging packaging demands.

* Kulicke & Soffa’s ARCUS capillary

PAUL REID, product marketing director, equipment division, may be contacted at Kulicke & Soffa, 1005 Virginia Drive, Fort Washington, PA 19034; 215/784-6792; E-mail: [email protected].