Category Archives: Metrology

ATMI, Metara sign JD agreement


September 12, 2002

Sept. 12, 2002 – Danbury, CT – ATMI Inc., a provider of specialty materials and services to the semiconductor industry, and Metara Inc., a supplier of automated metrology systems, have signed a joint development and manufacturing agreement.

Under this agreement, ATMI has acquired rights to integrate into its new chemical management system an OEM version of the Metara system for analyzing chemical constituents of liquids used in copper electrochemical deposition. ATMI has concurrently taken a minority equity position in Metara.

C. Patrick Franklin, president and CEO of Metara, said, “We are excited by the confidence that ATMI has placed in Metara technology and products. Under our joint development program, we will be working closely with ATMI. We see Metara technology as a key component in enhancing the ATMI copper process efficiency products.”

By Rachel Robinson
WaferNews Associate Editor

As mask data sets become more complex and data-intensive, maskmakers face the challenge of how to manage large amounts of data that must be moved from design to mask.

Tom Grebinski, chair of SEMI’s design/photomask data path task force explained: “The density of integrated circuitry has increased according to Moore’s Law, and subsequently, the amount of data required to express, and ideally resolve, all of the features of an IC design has increased as well.”

With this increased data comes three major focus points, according to Shawn Knox, VP of information systems at Photronics, a sub-wavelength reticle solutions supplier:

*How to move the data from the design centers
*How to process the information or put it into the proper format
*How to store and archive the data

“The amount of data needed to design and manufacture photomasks and ICs will continue to increase with time,” noted Grebinski. “The problem needs to be dealt with concurrently at the design level, the design data encapsulation level, the data preparation level, and at the computational data path level for both photomask pattern generation and inspection technology.”

Photronics is expecting one file of source data to swell to 324 gigabytes by 2005, more than three times the memory needed to store the entire Encyclopedia Britannica.

“Once the design data reaches Photronics, it must do data fracturing and prepare for inspection tools, and then for metrology tools,” Knox told WaferNews. “A critical layer node on file can be exploited three or four times.”

Grebinski further explained the problem. “The necessary addition of resolution enhancement technology accelerates the increase in data volume and thus the need for a substantially greater computational infrastructure.”

In hopes of addressing the problem, Photronics built a new wide area network (WAN) to link Photronics with its customers, based on broadband and Internet protocols.

Photronics’ Advanced Technology Data Center was developed to address increased data management complexities including IT infrastructure, data communications, design data transformation, storage and archiving data, redundancy and fault tolerance, frontend reticle data preparation, centralization, standardization, automation, and optimization.

Knox said that Photronics has built the WAN-based on existing communications infrastructure. “What’s important about the solution is that we have no single point of failure in the infrastructure. If we can’t move data, we can’t move product.”

Moving the data will prove to be a major problem down the line. According to Knox, the challenge in coming years will be how much bandwidth is available. Knox continued that infrastructure is constantly being built, and Photronics “has its eyes and ears on the telecom industry.”

In terms of handling the information once it is received, Photronics has invested in data storage equipment that allows it to store multiple terabytes of data. According to Knox, the data is stored in a central form on a regional basis. Photronics is using storage-area networking and network-attached storage.

“If you look at how much storage is required to push data to manufacturing tools, we’re talking tens and hundreds of terabytes,” he said.

“Seeing how traditional data movement is pushing Moore’s Law, it can become a constraint,” Knox cautioned. “Data management and handling is going to be a roadblock.”

From Grebinski’s point of view, the many problems associated with mask data set size and the movement of data is an industrywide problem. He warned that the majority of these problem sets are outside the scope of any one company or industry, but have everything to do with data inefficiencies and increases that are being faced today and will be faced in the future.

With an eye toward the future, Photronics is focused on a three-year business plan with flexibility being the key. “[We need to have the] ability to respond and meet the needs of business,” stressed Knox.

WASHINGTON, Aug. 22, 2002 — The White House has signed off on a report detailing the full scope and breadth of the budget request and research vision established by the National Nanotechnology Initiative, which includes a heightened commitment to using nanotechnology to fight weapons of mass destruction.

The 153-page report (PDF, 879 KB), an in-depth analysis of the NNI that was requested by Congress last year, concludes that while the NNI is only a year old and has fundamental research as its focus, “its ancestral programs have already made enormous impact in commercial markets. High electron mobility transistors, vertical surface emitting lasers, and giant magnetoresistance read heads are examples of one-dimensional nanotechnology providing evidence that buttresses the expectation for similar results from the NNI investment.”

A subcommittee of the National Science and Technology Council, which is chaired by President Bush and is part of the powerful White House Office of Science and Technology Policy (OSTP), endorsed the report.

Click here to enlarge image

Support by the OSTP is critical to the vitality of any federally funded research agenda. The body advises the president about how, and where, the federal government should make science research and development investments. Its judgments also hold sway with lawmakers, who use OSTP studies as they weigh science funding decisions.

The report states that much of the proposed increase of $106 million for NNI — boosting it from $604 million to $710 million — will be spent on fundamental research, including biomimetics, augmentation of three new grand challenge programs and development of a more balanced NNI infrastructure.

Any additional funding would go toward increasing support of fundamental research, purchasing more instruments, launching eight new centers, building a testing and training facility for academic institutions and studying the societal implications of nanotechnology.

Mike Roco, NNI director, said he expects the NNI to receive more money after members of Congress are finished with the appropriations process. The Senate, he said, has voted to boost nanotechnology initiatives in various spending bills. The House, he said, has voted to stick with Bush’s budget figures, but members have praised nanotechnology research. Roco predicted that when the two bodies head into conference after their August recess and hammer out their differences, nanotechnology will receive more than the $710 million Bush is requesting.

“People (in Congress) feel we have something that is real and cross-cutting,” Roco said. “Most of the budget was very tight this year,” but despite the overall fiscal restraint, nanotechnology is getting boosted.

The enthusiasm for nanotechnology, he said, is “a reflection of the plan” endorsed by the OSTP. “We showed we had results in the first year, that we have items we would like to solve.”

The report lists “significant contributions” to nanoscale science and engineering during the past year that have relied upon the NNI, and it supports the NNI’s decision this year to create three new research focuses — nanotechnology for biological/chemical/radiological/explosive detection and protection; nanoscale instrumentation and metrology; and manufacturing at the nanoscale.

It also provides details about nanotechnology investments within each of the 15 NNI agencies.

During the first year of the NNI, the organization supported more than 2,000 active university awards through NNI’s 15 participating agencies, the report states. About 65 percent of FY 2001’s $464 million NNI investments went to university researchers, about 30 percent were sent to government laboratories and 5 percent went to industry.

The report goes into great depth detailing the degree to which NNI could help in the war against terrorism.

Nanostructures, the report says, “with their small size, light weight, and high surface-to-volume ratio, will dramatically improve our capability” to protect against and detect chemical, biological, radiological, and explosive (CBRE) agents.

“The nanoscale offers the potential for orders of magnitude improvements in sensitivity, selectivity, response time and affordability,” the report states. “For the instruments being developed to measure and manipulate individual atoms with sub-nanometer precision, one pathogen or even one chemical molecule is huge. The detection of a single CBRE moiety becomes possible. You can’t get any better sensitivity — however there is still the nontrivial problem of getting that single moiety to the location where it can be detected.”

The report also provides blueprints for how each agency plans to invest in nanotechnology. At the Department of Energy, for example, research to understand the properties of materials at the nanoscale will be increased in three areas: synthesis and processing, condensed matter physics and catalysis.

At the National Institutes of Health, researchers are focusing on “several promising areas,” the report says. The list of eight areas includes:

  • Nanomaterials science to interface with living tissues, deliver pharmaceuticals, enable tissue engineering and for contrast and biologically active agents;
  • Nano-imaging that will give real-time, intracellular imaging of structure, function and metabolism;
  • Nanoscale research on cellular processes, including biophysics of molecular assemblies, membranes, organelles and macromolecules.
  • Technologies to detect biological signals and single molecules within and outside cells.

Aug. 15, 2002 – Fremont, CA – Therma-Wave Inc., a supplier of metrology equipment, has opened a new sales and service office in Shanghai, China.

Located near Shanghai Technology Park, Therma-Wave’s facility will offer sales, service, spare parts, and applications support for customers in China. The new center will serve as a headquarters for sales representatives, service, and applications employees, who will support SMIC, GSMC, ASMC, and CSMC, as well as, a number of fabs in Beijing.

Currently in Asia, Therma-Wave has offices located in Taiwan, Korea, Japan, and Singapore.

Heading up the China team is Dave Jway, China country manager, who has in excess of eight years of Therma-Wave product experience during his tenure at service representative, Aneric Ltd. in Singapore.

July 30, 2002 — FEI Co., the Hillsboro, Ore., developer of metrology tools set to merge with metrology equipment provider Veeco Instruments Inc., announced second quarter earnings of $4.9 million, or 15 cents per share, compared with $8.6 million reported for the second quarter of 2001.

Revenues were $87.9 million, compared with $94 million for the same period last year. The company partly attributed the results to lower sales volume and costs associated with its merger with Veeco. The company’s stock was up 99 cents at $19.23 in late afternoon trading.

FEI also announced a new R&D center to be located at a 27-acre Hillsboro site purchased from Tokyo Electron Ltd. It includes one building for offices, another for R&D and will be used to consolidate FEI’s local operations. Currently, FEI’s operations are housed in five separate buildings.

Veeco reports Q2 results


July 29, 2002

July 29, 2002 — Veeco Instruments Inc., a Woodbury, N.Y., provider of process equipment and metrology tools used in development of MEMS and other devices, announced it lost $1.6 million, or 6 cents per share in the second quarter, compared to income of $10 million dollars for the same period last year, according to a company news release.

Revenues were $77.3 million, a 31 percent decrease from the $112.1 million reported for the second quarter of 2001. Metrology sales were up slightly from last year, while process equipment sales were down almost 50 percent. The company estimates third quarter revenues in the $75 million to $80 million range.

Veeco recently announced an agreement to merge with FEI Co. The company’s stock was up 59 cents at $13.28 at late this morning.

July 25, 2002 — Nanometrics Inc., a Milpitas, Calif., supplier of automated metrology equipment used for integrated circuit, flat panel display and magnetic recording head manufacturing, announced second quarter results. The company lost $1.7 million for the period, or 14 cents per share, compared with income of $1.5 million, or 13 cents per share for the same quarter last year.

Revenues were $8.4 million, down 43 percent from the year-earlier results of $14.8 million. The company attributed the decrease in revenues to weaker demand for process control metrology equipment, particularly in the United States and Pacific Rim countries. Its stock was down 39 cents at $9.01 during morning trading.

July 23, 2002 – Flanders, NJ – Rudolph Technologies Inc., a provider of process control metrology systems, has entered into a definitive agreement to acquire privately held ISOA, a defect control company based in Richardson, TX.

The acquisition is an all cash transaction valued at approximately $27.5 million.

ISOA is a spin-off from Texas Tech U.’s International Center for Informatics Research (formerly the Institute for Studies of Organizational Automation).

Over the past 16 years, ISOA has licensed its technology for use in the semiconductor industry and recently began transitioning to a semiconductor capital equipment supplier. The company’s core technologies are knowledge based algorithms used in wafer macro defect detection and classification.

Customers in Asia, Europe, and the US are currently using its recently introduced WaferView family of tools.
Following the completion of the transaction, ISOA will continue to maintain its offices in Richardson, TX, and will become the yield metrology group of Rudolph. Additionally, ISOA’s tool manufacturing currently outsourced to Japan, will be moved to Rudolph’s Ledgewood, NJ, facility. ISOA currently has approximately 40 employees.

July 23, 2002 – Woodbury, NY – Veeco Instruments Inc.’s metrology group has created a technical advisory board (TAB).

The TAB, made up of seven nanotechnology researchers, will meet regularly to review and provide feedback on Veeco’s efforts and future product development, and to highlight emerging areas of nanoscale research that may lead to future applications and measurement requirements.

John Carruthers, Intel’s former director of components research, will chair the board. The other members are Professor Jeffrey Bokor of UC at Berkeley’s department of electrical and computer sciences; Julio Fernandez, chair of the Mayo Clinic’s single molecule mechanics and engineering lab; Professor James Gimzewski of UCLA’s department of chemistry and biochemistry; Joseph Kirk, former senior engineer at IBM; Professor Calvin Quate of Stanford U.’s departments of electrical engineering and applied physics; and Don Sweeney of Lawrence Livermore National Laboratory.