Category Archives: Displays

July 5, 2012 — Indium tin oxide (ITO) is the basis of more than 90% of transparent conductive films (TCFs), used in displays, flexible photovoltaics, and other devices, reports Cathleen Thiele, technology analyst, IDTechEx. With indium prices rising, and technical challenges related to indium’s brittle nature, manufacturers are looking to new technologies, such as finely printed conductive meshes, layers of silver or copper that are highly transparent, organic transparent conductors and variations such as carbon nanotubes and graphene.

The TCF market is valued at more than $2 billion in 2012. ITO is an entrenched technology for displays manufacturing, said Thiele.

Figure. The commonly used options (excluding uses of transparent conductors that are not in displays, photovoltaics or touchscreens) with their market share. 

Transparent conductor Main uses 2012 value ($M) 2012 market share (%)
Indium tin oxide (ITO Displays (LCD, e-paper, OLED)
Photovoltaics
Capacitive touchscreens
1527 93
Other metal oxides (FTO, AZO) Photovoltaics (CdTe, a-Si, Silicon PV) 106 6
Transparent organic conductors (PEDOT:PSS), CNTs, graphene Flexible photovoltaics, bi-stable displays 0.6 <0.1
Metals, composites (Metal grids or nanowires) Flexible devices 1.4 0.9

Source: IDTechEx http://www.IDTechEx.com/TCF 

Transparent conductors based on nanosilver and PEDOT:PSS are getting a lot of interest, in addition to carbon nanotubes and graphene. There are also hybrid approaches – using nanosilver to print fine lines, filled with a transparent conductor such as PEDOT:PSS.

Most of the focus is on use as a transparent conductor for display, solar and touchscreen applications – representing the biggest need and opportunity.

In comparison to other types of transparent conductors ITO has a very competitive conductivity-transparency-ratio. However, an issue not only for ITO, but also many other types of TCF, is that they are not particularly flexible. Sputtered ITO and other TCO layers on plastic films are known to be brittle, and they crack upon a few percent strain.

As more and more flexible devices are required, the market for transparent conductive films increases. The trade-off between conductivity, transmittance, and flexibility is best met with materials other than the traditional conductive oxides, which are expected to get more expensive as in the case of ITO, and many companies and research institutes work on alternate technologies.

Flexible E-readers and touchscreens

The recent developments in the e-Reader market are a good example of the interest to move to flexible displays: While the first devices where rigid and based on glass, new versions are intended to eventually be somewhat flexible, though a rollable device is still a dream.

In addition, some are targeting to replace ITO in applications where high conductivity is not needed – e-readers are an excellent example of that.

Eastman Kodak sees the opportunity for their PEDOT formulation in applications where customers seek cheaper alternatives than ITO and where a more resistive film is acceptable. Together with Heraeus they presented a milestone at the Printed Electronics USA 2011 Show – a polymer-based 14" touch screen panel featuring completely invisible conductive patterns. Fabricated by GSI Technologies the panel features Kodak HCF-225 Film/ESTAR™ Base and transparent Clevios™ PEDOT:PSS coating with a surface resistivity of 225 ohms/sq.

Flexible photovoltaics

The same is true for photovoltaics; thin-film solar cells based on compound semiconductors or amorphous silicon (a-Si) are manufactured in industrial scales on glass, but flexible versions on plastic substrates are available and will open new applications and markets.

Moreover, the PV market seeks very large areas of transparent conductive material and therefore must reduce cost as much as possible to maintain competitive cost/watt pricing. Therefore some in the PV market have moved away from ITO already: a-Si manufacturers for example use ITO, FTO and AZO, First Solar (CdTe solar cells) is using FTO and most CIGS PV manufacturers use AZO.

This report focuses on the requirements and achievements to date on the topic of transparent conductors, where high transparency and high conductivity are required, particularly flexible versions. Worldwide research and design efforts are presented, both from research institutes and companies that are developing the necessary materials and processes – in total 53 organizations are profiled. Several technical solutions available are compared, and forecasts are given for the next 10 years, based on assessing the need from different applications.

To learn more about the topic please read Transparent Conductive Films 2012-2022 

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July 5, 2012 — Air Liquide will supply the ultra-pure carrier and electronic specialty gases to 3 new cutting-edge flat panel display (FPD) fabs manufacturing advanced active-matrix organic light emitting diode (AMOLED), low-temperature polysilicon (LTPS), micro electo mechanical systems (MEMS), and OLED displays. Those technologies are currently under commercial development.

These display fabs are located in Singapore, Japan, and Taiwan, making display panels for next-generation smartphones and tablets.

Electronics specialty gases (ESG) and carrier gases are used to deposit, clean, and functionalize material layers for thin film transistor (TFT) displays. Air Liquide is partnering with leading customers to develop novel precursors, gases and innovative packaging solutions that help resolve industry challenges in deposition, ion implantation and encapsulation.

Air Liquide will supply electronic specialty gases, equipment and installation, and on-site total gas management services for 2 new large-scale fabs in China that manufacture large Gen 8.5 panels. These gases will be provided by Air Liquide Electronic Centers strategically located in Asia. Air Liquide recently strengthened its position with each of the flat panel market innovation segments, signing multiple contracts and enlarging its gases & services offer.

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SUMMARY:

Colin Moorhouse, Coherent Inc., discusses ultrafast (picosecond) industrial lasers for high-precision manufacturing of smartphone displays and other leading-edge devices. These tools can help reduce the size, weight, and material cost of devices; the lasers’ unique operating regime (megawatts of peak power) enables clean cutting and patterning of sensitive materials and thin films used in a number of novel devices as well as micromachining of wide bandgap, "difficult" materials such as glass. In several instances, the picosecond laser is replacing multi-step photolithography with a single-step direct-write laser process; in other cases it supplants traditional cutting/drilling processes. With a choice of near-IR, green, or ultraviolet output, these lasers can micromachine almost any material bringing new technologies to market successfully.

FIGURE. Schematic of a basic OLED structure.

The article covers patterning organic light-emitting diodes (OLEDs), thin-film solar cells, and bioabsorbable stents as well as laser drilling of transparent materials. Read it at our sister publication, Industrial Laser Solutions, here: http://www.industrial-lasers.com/articles/2012/05/picosecond-laser-enables-new-high-tech-devices.html

July 4, 2012 – BUSINESS WIRE — Lieff Cabraser Heimann & Bernstein, LLP and Pearson, Simon, Warshaw & Penny, LLP announced that a federal court jury found that Toshiba Corporation and its subsidiaries conspired with the world’s other leading manufacturers of Thin Film Transistor-Liquid Crystal Displays (TFT-LCDs) to raise and fix the prices of TFT-LCD panels and certain products. The jury awarded damages of $87 million. Federal antitrust law requires the trebling of these damages, resulting in a $261 million award against Toshiba.

 

“There was strong evidence that Toshiba participated in the price-fixing conspiracy through communications with other TFT-LCD manufacturers, and that it received future pricing information from its competitors, shared its own future information, and was aware of its wrongdoing”

.Richard M. Heimann, co-lead counsel for plaintiffs, stated, “We are very pleased the jury found in favor of the plaintiffs and found that Toshiba violated the law, particularly in light of the government’s decision not to criminally prosecute Toshiba for its misconduct. The case demonstrates once again the critical role our civil justice system plays in holding corporations, no matter how powerful or where they are based in the world, accountable for violating U.S. antitrust laws.”

 

“There was strong evidence that Toshiba participated in the price-fixing conspiracy through communications with other TFT-LCD manufacturers, and that it received future pricing information from its competitors, shared its own future information, and was aware of its wrongdoing,” stated Bruce L. Simon, co-lead counsel for plaintiffs. “We are grateful for the jury’s service. The jury rejected Toshiba’s claim that it had done nothing wrong, and this is one of the few antitrust class actions ever tried to a successful verdict.”

 

About the LCDs Antitrust Litigation

TFT-LCDs are used in flat-panel televisions as well as computer monitors, laptop computers, mobile phones, personal digital assistants, and other devices. Plaintiffs charge that defendants conspired to raise and fix the prices of TFT-LCD panels and certain products containing those panels for over a decade.

 

Previously in the class action litigation, entitled In re TFT-LCD (Flat Panel) Antitrust Litigation, MDL No. 1827 (N.D. Cal.), the Court certified two nationwide classes of persons and entities that directly purchased TFT-LCDs from January 1, 1999 through December 31, 2006, one class of panel purchasers, and one class of class of buyers of laptop computers, computer monitors, and televisions that contained TFT-LCDs.

 

The classes reached settlements with ten other defendant manufacturers for a combined value of $430 million. Toshiba was the only defendant to proceed to trial. Lieff Cabraser serves as court-appointed Co-Lead Counsel for direct purchasers in the litigation.

 

Contacts

Lieff Cabraser Heimann & Bernstein, LLP

Richard Heimann, 415-956-1000

or

Lieff Cabraser Heimann & Bernstein, LLP

Eric Fastiff, 415-956-1000

or

Pearson, Simon, Warshaw & Penny, LLP

Bruce Simon, 415-433-9000

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July 3, 2012 — Technology for making electronic circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies — and the whole new ecosystems needed to integrate them into useful products — offer must-have advantages.  Flexible and large-area organic light-emitting diode (OLED) displays and lighting offer perhaps the largest tangible opportunity, and hybrid products using solution-processed layers and flexible substrates are starting to come to market.

Flexible active matrix OLED (AMOLED) displays will enter mobile phone applications by the end of 2012, and may show up in tablet applications in 2013, reports Jennifer Colegrove, NPD DisplaySearch VP of Emerging Display Technologies. OLED technology advanced rapidly in 2011, a trend that NPD DisplaySearch forecasts will continue through this decade in its recent OLED Technology Report. Progress has been made in organic materials, color patterning, electronic driving methods, and encapsulation. Enthusiasm has increased recently as Samsung Mobile Displays has started manufacturing AMOLED displays in a Gen 5.5 fab, and both Samsung and LG Display have announced plans to build Gen 8 (2200 x 2500mm) fabs, while several other suppliers entered or re-entered OLED display manufacturing, including AUO, CMI, IRICO, Tianma, and BOE. Also read: Samsung Mobile Display sources OLED materials from Novaled

These technology improvements and investments indicate that AMOLED will compete in larger-size applications, such as in TV and mobile PCs, within 2 years. Samsung released a 7.7” AMOLED tablet PC in December 2011, more tablet and other mobile PCs are expected in 2012. Both Samsung and LG are expected to bring 55” AMOLED TV to market in 2012. Also read: Sony, Panasonic combine OLED manufacturing expertise

However, the ability to scale OLED display manufacturing to fabs larger than the current Gen 5.5 has yet to be demonstrated, and the cost of larger panels remains in question. It is not clear if vacuum deposition of the organics at the larger size will be economical, or if printed layers will be practical to reduce costs. Challenges remain for printed and flexible processes, for example, organic material life time is still shorter with solution processes than with chemical vapor deposition.

“I think OLED technology has made good progress and is ready to enter large-size applications, but low-cost manufacturing for large sizes is still a challenge,” says Colegrove. She’ll discuss OLED technology trends, include printed and flexible OLEDs, as well as provide the most recent market forecast in her presentation at SEMICON West.

Panasonic uses printed hole injection layer, continuous evaporation process

On the OLED lighting side, more efficient mass production process technologies developed in part in the Japan’s NEDO research project are enabling production of OLED lighting with brightness of up to 1000 cd/m2 with efficiency of some 130 lm/W in the lab, reports Takuya Komoda, Research Director at Panasonic Corp’s Core Technologies Development Center. He will discuss this technology enabling the Panasonic-Idemitsu OLED Lighting joint venture to produce commercial 2mm thin, ~8cm2 OLED panels with integrated electronics for easy integration by lighting designers, with warm 3000K light and good color rendering (CRI>90), with 10,000 hour life (70% lumen maintenance.)

The manufacturing process is made economical by coating the initial hole injection layer with a slot die printer, and depositing the emitters with a new hot-wall continuous evaporation tool developed with Choshu Industries that increases the deposition rate to 10nm/second and significantly cuts down waste of the expensive emitter materials.

The company got best lifetimes of 150,000 hours to half decay at 1000cd/m2 and 55lm/W efficacy with a fluorescent/phosphorescent OLED system on a light outcoupling substrate.  Using all phosphorescent emitters improved efficacy to over 80 lm/W, while maintaining half decay lifetime at a still respectable 30,000 hours.  The 130 lm/W efficacy was achieved with a 1cm2 OLED fabricated on a hemispherical high-refractive lens.

IMEC uses low-temp metal-oxide TFTs for flexible OLED displays, RFID tags

Imec’s approach to making flexible AMOLED displays laminates a flexible PEN substrate to a temporary carrier, then builds a stack that includes a moisture barrier, backplane with metal-oxide TFTs fabricated at 150°C, an interlayer dielectric, a top-emitting OLED, and a thin-film top encapsulation, reports Serge Biesemans, imec VP of wafer technologies and smart systems, who plans to talk about the new materials and process technologies developed for this stack. Imec’s research program with partner TNO in the Holst centre aims at overcoming the challenges towards high-volume manufacturing of flexible active-matrix OLED displays on flexible plastic foils: high resolution, low power consumption, large area, outdoor readability, flexibility and light weight.

Imec is also making thin film transistors on flexible plastic, combining the n-type transistors of the metal oxide AM backplane with organic p-type semiconductors to make RFID circuits and display line drivers. For the RFID tag, a complementary hybrid organic-oxide technology was used, combining a 250°C solution-processed n-type metal-oxide TFT with typical charge carrier mobility of 2cm2/Vs with a pentacene p-type TFT with mobility of up to 1cm2/Vs. A high-k Al2O3 dielectric was used, which increases the transistors’ current drive.

Imec, Holst Centre and their partners in the EU FP7 project ORICLA have fabricated an RFID circuit in this low-temperature thin-film technology that allows reader-talks-first communication, by transmitting identification data when the reader transmits power to the tag. In retail applications, many tags will usually try to contact the reader at the same time when powered by the RFID reader, requiring an effective anti-collision mechanism, which is complicated and slows reading time. Reader-talks first tags could more simply be used to provide buyers with information on price, characteristics, or freshness, or to allow vendors to implement automated billing and inventory management.

Learn more about the progress of these technologies in markets that matter at the SEMICON West program on printed/flexible electronics, July 12, in San Francisco, Practical Plastic Electronics: Bringing Disruptive Flexible and Organic Materials into Volume Electronics Manufacturing.

Read Paula Doe’s other SEMICON West previews:

Guide to LED and OLED programs at SEMICON West

Guide to MEMS at SEMICON West 2012

MEMS manufacturing changes with HV consumer apps

Maturing MEMS sector looks at ways to work together

For more information on attending or exhibiting at SEMICON West 2012, please visit www.semiconwest.org.

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July 2, 2012 — Seiko Epson Corporation (TSE:6724) reached the milestone of 80 million high-temperature polysilicon (HTPS) thin film transistor (TFT) liquid crystal display (LCD) panels for 3LCD projectors, enough for more than 26.5 million projector units.

Epson develops technologies to boost power and performance of these projectors. 3LCD projectors historically are used for enterprise computing — business presentations. Today, 3LCD projectors are used in various markets — home theaters, education, commercial segment, and more. The market for projectors is expected to grow nearly 10% every year.

Epson plans to enhance and expand its lineup of HTPS display panels for specific market needs, said Nobuyuki Shimotome, deputy chief operating officer of Epson’s Visual Products Operations Division.
Epson is a global imaging and innovation company making inkjet printers and 3LCD projectors, sensors, and other microdevices. Internet: http://global.epson.com/

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This article was published in the DisplaySearch Monitor, June 2012, and authored by David Hsieh.

July 2, 2012 — Liquid crystal display (LCD) panel makers have added new display features — high color gamut, 3D, LED backlight, slim type, ultra-slim bezel, 120 Hz/240 Hz/480 Hz frame rate driving, fast response time, high brightness — with varying success in driving TV demand.

Consumers will not pay a price premium for a new feature that cannot be proven valuable. For example, high color gamut was panned because broadcasting systems regulate the color gamut of content, and preferences for color saturation vary widely.

Instead of “spec up,” more and more end users are looking to “spec down” for budgetary reasons. Lower but acceptable panel brightness now prevails, as it helps to reduce backlight cost. Meanwhile, as analyzed in the May 09, 2012 DisplaySearch Monitor article “Direct LED TV Selling Better than Edge LED TV,” the cost effective direct type LED-backlight LCD TV is doing well in sell-through results. While its form factor is not slim, some end users care more about how an ultra-slim bezel looks from the front.

For all these reasons, LCD TV panel and set makers are wondering what new features will add value for end users and motivate another replacement cycle.

 

Higher resolution: The next added value?

Many people believe that ultra-high 3840 × 2160 definition (UHD or UD), also known as 4K×2K, will be a meaningful value-added feature on next-generation TV displays. 4K×2K has 4x as many pixels as full high definition (FHD, 1920 × 1080), which is the current prevailing resolution for LCD TV panels.

Smart phones and tablet PCs prove that the higher the resolution, the better for end users. These very high definition devices set consumer expectations for televisions. Because LCD TVs are still mainly used for watching rather than interaction or content creation, consumers will perceive very high resolution as a direct benefit to viewing, unlike other new features (such as smart, connected, or 3D TV and LED backlights).

The best quality video is recognized as vivid with no difference between reality and screen, and the higher the resolution, the more vivid the content. 3D technology halves resolution on LCD TVs. On 4K×2K LCD TVs, the impact of the downgrade in resolution when watching 3D content is not as severe. With 4K×2K, even after the 3D downgrade, the resolution is full HD, falling from 3840 × 2160 to 1920 × 1080.

For ultra-large LCD TVs, such as 60-80”, pixels are so big that they are visible in FHD. Therefore 4K×2K is recognized as necessary on very large TVs.

 

4K × 2K manufacturing options

Most panel makers have been working on 55”+ panels for 4K×2K. This is because panel makers target high-end and very large screen markets.

Most panel makers are implementing oxide thin-film transistor (TFT) manufacturing for 4K×2K resolution. Because of the higher electron mobility of oxide, it’s easier to design with a smaller pixel; therefore more pixels can be implanted onto the glass substrate. However, the oxide TFT process requires a 6-8 photomask process, compared to the 4-5 photomask process for amorphous silicon (a-Si) TFT. This will affect fab capacity. Chimei Innolux is planning to use a-Si TFT, rather than oxide TFT. In theory, this is workable and Chimei Innolux can save lots of surplus cost for new photomasks and maintain a better yield rate.

4K×2K LCD TV panels are a big challenge for TFT LCD process yield rate and stability. In the current TFT LCD process, the yield rate and reliability of HD and FHD do differ much. However, when the pixel count quadruples, the yield rate will fall significantly. Meanwhile, the higher resolution means panel transmittance will be reduced because there are more pixels on the substrate. As analyzed in the TFT LCD Process Roadmap Report, there are many new technologies needed for this kind of ultra-high definition:

  • High resolution photo lithography (high resolution patterning)
  • SHA (super high aperture) ratio
  • High mobility backplanes (such as oxide TFT or microcrystalline silicon)
  • Copper (Cu) metallization
  • BM (black matrix) width reduction
  • The EE (electronics engineering) panel design: data/scan driving, input format compatibility, and value-added features including 4K up-conversion, 3D, and local dimming backlight.

 

Panel makers developing 4K×2K

The market outlook for 4K×2K is still unclear due to TV broadcasting bandwidth limitations. Despite this, LCD TV panel makers have developed many 4K×2K panels.

Table. 4K×2K Ultra High Definition LCD TV Panel Development. Source: DisplaySearch China Smart TV & Smart Display Conference.

Maker

Size

Native
Resolution

Panel
Technology

3D

3D Technology

MP (Estimate)

AUO

65”

3840×2160

Oxide TFT

Yes

Lenticular lens

Q2’12
(LGD, Vizio)

55”

3840×2160

A-Si TFT

Yes

Lenticular lens (naked eye)

Now
(Toshiba)

LG Display

84”

3840×2160

Oxide TFT

Yes

FPR (film pattern retarder)

Q1’12-
Q2’12

Samsung

70”

3840×2160

Oxide TFT

 

 

Q2’12

70”

3840×2160

Oxide TFT

Yes

240 Hz, Shutter glass

Q2’12

82”

3840×2160

 

 

 

 

Sharp

64”

4096×2160

 

 

 

EOL

60”

3840×2160

Oxide TFT,
Photo alignment

 

 

2012

Chimei
Innolux

56”

3840×2160

 

No

 

Now
(Medical)

50”

3840×2160

A-Si TFT

120 Hz

 

Q4’12

65”

3840×2160

A-Si TFT

120 Hz

 

Q4’12

AUO is currently the only panel maker that has commercialized a 4K×2K product. The product is a 55” 4K×2K LCD TV with glasses-free 3D and a powerful video driving engine (Toshiba’s REGZA), shown below.

Figure 1. Toshiba’s 55” 4K×2K LCD TV with AUO’s Panel. Source: Toshiba.

There’s also a face tracking feature, which should assist users who choose to video chat in high resolution. It’s said that LGE and Vizio are also interested in launching a 4K×2K LCD TV in the North America market later this year.

Sharp is focusing on 4K×2K and calling it Super Hi-Vision, as analyzed in the May 10, 2012 DisplaySearch Monitor article “Sharp’s Leading TV Panel Technologies.”

4K×2K Ecosystem

The biggest concern for 4K×2K remains the ecosystem. Currently the TV ecosystem relies on the bandwidth of broadcasting and transmission. For content providers, it will be harder to achieve UD as the cost of production, post-production, storage, and data transmission will be very high.

Content is also an issue for 4K×2K TVs. At the DisplaySearch China Smart TV & Smart Display Conference, Chimei Innolux used a slide to illustrate the current 4K×2K ecosystem status (shown below).

Figure 2. 4K×2K Ecosystem status. Source: Chimei Innolux.
  • Camera: Commercial cameras are available, and some are already reaching 8K×4K. These professional cameras are very expensive, but some camera companies such as Sony or JVC plan to introduce a 4K×2K camera for general consumers.
  • Content: For content providers, the high cost of post-production is a concern. A 4K×2K program is estimated to cost 5-6 times more than HD.
  • Broadcasting: NHK and BBC plan to use 4K×2K or even 8K×4K broadcasting for the 2012 Olympics in London. This experiment will explore the challenges to the growth of 4K×2K broadcasting.
  • Coding/De-Coding Standard: H264 seems to be sufficient for 4K×2K. The new generation H265 will be ready by 2013. At the same time, enhancing compression will further reduce the bottleneck of 4K×2K signal transmission. Also, there are some up-scaling solutions to convert HD and FHD signals to 4K, such as QDEO.
  • BD Capacity: With the enormous amount of data for 4K×2K, storage and transmission are big challenges. For storage, dual-layer Blu-ray DVDs can provide 50 GB capacity, and some can even be 200 GB with current compression technology. DVD makers are studying how to increase compression ratio.
  • BD Player: Blu-ray disc players also need to support 4K×2K.
  • HDMI: The HDMI 1.4a standard supports 4K×2K, but HEVC (High Efficient Video Coding) will be better.
  • Bandwidth: ADSL and fiber have achieved 100 Mbps per second. However, it’s still time consuming to transmit 4K×2K data. For example, a 3-hour 4K×2K movie equals 3 terabytes of data, which requires 200 Blu-ray discs.

With all of these opportunities and challenges, the DisplaySearch Quarterly Global TV Shipment and Forecast Report is forecasting that 4K×2K TV will account for 22% of all 50”+ FPD TVs in 2017.

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July 2, 2012 – BUSINESS WIRE — Samsung Mobile Display (SMD), a global leader in the display industry, will purchase dopant materials used in the transport layers of its active-matrix organic light-emitting diode (AMOLED) display modules from Novaled, OLED technologies provider. Novaled will also provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules. The licensing and purchase agreement covers several years.

Since 2005, Samsung has cooperated with Novaled in the field of technologies and materials for advanced OLED products. Novaled’s latest agreement with SMD extends the use of Novaled’s high-performance OLED materials and proprietary PIN OLED technology to SMD’s next generation of mobile AMOLED devices.

Novaled has developed several doping and transport materials that can be used in OLEDs to further enhance the advantages of Novaled’s PIN OLED technology. As a result, these OLEDs have very low driving voltage and high substrate compatibility, while maintaining high power efficiency and long lifetime. The company recently debuted a class of n-doped electron transport layer (ETL) materials for OLED TV and mobile displays that could double lifetimes.

“Novaled materials are designed to deliver customer benefits, especially for mass-produced devices,” said Gildas Sorin, CEO of Novaled, adding that building “successful and long-lasting business relationships with leading OLED display and lighting manufacturers” is part of his company’s strategy. Sorin is to the left in the above photo.

“We are focused on developing innovative and state-of-the-art OLED technology, and so we have maintained a close cooperation with Novaled,” said S.I. Cho, president and CEO of Samsung Mobile Display (to the right in the above photo, shaking hands with Sorin).

Novaled AG performs research, development and commercialization of technologies and materials that enhance the performance of organic light-emitting diodes (OLEDs) and other organic electronics. Commercially active since 2003, Novaled was founded in 2001 as a spin-off of the Technical University and the Fraunhofer Institute of Dresden. For more information, please visit www.novaled.com.

Samsung Mobile Display Co., Ltd. (SMD) was established in January 2009 as a core Samsung company that provides cutting-edge display solutions based on technologies like active matrix organic light emitting diode (AMOLED) and liquid crystal display (LCD). For more information about Samsung Mobile Display, visit www.samsungsmd.com.

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June 29, 2012 — OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies such as VITEX, 3M, GE, UDC, Samsung, LG, Philips, and DuPont will increase accordingly, shows Displaybank’s report, “OLED Thin Film Encapsulation Technology Key Patent Analysis.”

Figure. OLED Thin Film Encapsulation Patent Application Trends. SOURCE: Displaybank.

Encapsulation protects organic light emitting diodes (OLEDs) from the external environment. Methods include CAN, glass, thin film, and hybrid encapsulation technology. Of these, thin film encapsulation is expected to be the enabling factor for lightweight and thin large-area OLED as well as flexible OLED. These architectures will support next-generation displays and OLED lighting.

OLED thin-film encapsulation patents are growing in line with increasing interest in flexible OLED and OLED lighting technology and the acceleration of technology development competition.

The report examines worldwide patent application trends, particularly from Korea, Japan, the US, and Europe. In addition, in-depth analysis such as key patent status of major companies, technology development, citation relation analysis, key patent point analysis, and key patent example analysis were performed by extracting 135 key patents around U.S. patents. Access the report at http://www.displaybank.com/_eng/research/report_view.html?id=875&cate=1

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June 29, 2012 – Marketwire — Cambridge NanoTech, maker of atomic layer deposition (ALD) technologies, entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology. 

Cambridge NanoTech ALD systems are used in the production of semiconductors, flat panel displays, and solid state lighting. The new system, Cyprus, will perform ALD coatings of particles, powders, and small 3D objects with and without plasma. Its rotary reactor architecture optimizes conformal coating without the complexity of traditional fluidized approaches.

"The Cyprus Particle Coating system expands the ability to deposit thin films on powders by utilizing thermal and plasma ALD in a single platform. This in turn and can allow users to take advantage of the full spectrum of additional benefits such as improved nucleation rates, decreased processing temperature, and improved film quality offered by plasma-assisted ALD processes," explains Ganesh Sundaram, VP of technology at Cambridge NanoTech.

Ghent University has been developing its particle and powder coating technologies focusing on surface functionalization uses. "There have been an increasing number of possible applications for nanocoatings on particles and powders emerging over the past decade that require atomic level control of layer thickness and uniformity," said Christophe Detavernier, Professor at Ghent University. "ALD has proven to be a very reliable method for depositing ultrathin, conformal coatings on powders."

Located in Flanders, Belgium, Ghent University is an active partner in national and international educational, scientific and industrial cooperation. Ghent University hosts 32,000 students and 7,100 staff members.

Cambridge NanoTech delivers Atomic Layer Deposition (ALD) systems capable of depositing ultra-thin films that are used in a wide variety of research and industrial applications. To learn more about Cambridge NanoTech, please visit www.cambridgenanotech.com.