Category Archives: MEMS

January 27, 2012 — Genalyte developed and produced a set of disposable silicon photonics biosensor chips with research body imec, for use in its diagnostic and molecular detection equipment. The chips use imec’s standard silicon photonic waveguide devices, modified for bio-compatibility.

These chips allow for high levels of multiplexed biosensing due to the high integration level of Si photonics.

A bio-compatible passivation technology was developed on 200mm wafers with high yields. The chips contain up to 128 proprietary ring resonator sensors coated by Genalyte with application-specific chemistry to create very sensitive molecular detection capability. On-chip grating couplers are used to couple the infrared light from and to Genalyte’s diagnostic equipment. The chips were tested in the field.

More Si photonics work at imec:

Imec’s silicon photonics platform densely integrates photonics and electronics, manufactured on standard microelectronic CMOS manufacturing processes. The high quality and reproducibility of the photonic waveguides and devices with features measuring 100-500nm requiring nm-scale accuracy are the keys to high yield. Genalyte first made a proof-of-concept using Multi-Project Wafers access to imec’s Silicon Photonics technology under ePIXfab (www.epixfab.eu).

The Si-photonics biosensor chips were made as part of imec’s silicon photonics CMORE service. Via this initiative, imec offers companies all the services needed to turn innovative ideas into smart packaged microsystem products. The CMORE toolbox includes 200mm CMOS, Si-photonics, MEMS, image sensors and device packaging. Services also cover design, testing and reliability, bringing products from feasibility studies to design, technology development, prototyping and low-volume manufacturing. Imec also is able to guide companies in tranferring to volume production at a foundry.
 
Imec performs world-leading research in nanoelectronics. Imec’s research activities in the field of silicon photonics are coordinated closely with those at Ghent University. The Photonics Research Group in the Department of Information Technology of Ghent University has been active in photonic integration for more than 20 years. Since 2000 the focus has shifted to silicon photonics. Further information on imec can be found at www.imec.be.

Genalyte Inc. is a privately held company focused on improving the costs and performance of diagnostic and life sciences molecular testing.  To this end, Genalyte has developed a next-generation molecular detection capable of higher levels of multiplexing, high sensitivity and faster time-to-result directly from clinical samples. Learn more at www.genalyte.com

View recent issues of the MEMS Direct newsletter

January 27, 2012 — While Apple’s release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot in smartphone brands, reports Wayne Lam, senior analyst, wireless communications at IHS in an IHS iSuppli News Flash.

Also read: Analyst: $10B more semi capex thanks to tablets, smartphones
 
2011 is Samsung’s first turn at the number 1 spot in smartphone maker rankings. Global smartphone shipments grew 54% annually to reach a record 155 million units in the fourth quarter of 2011, added Alex Spektor, associate director of research firm Strategy Analytics.

Table 1. Shipments of smartphone companies that have reported results for the fourth quarter of 2011 to date. Other major companies that haven’t reported yet are not included. Rankings by shipments in millions of units. SOURCE: IHS iSuppli January 2012.

  Company Q3 ’11 Shipments (Millions) Q4 ’11 Shipments (Millions) Q3 ’11/Q4 ’11 Quarterly Growth 2010 Shipments (Millions) 2011 Shipments (Millions) 2010/2011 Annual Growth
1 Apple 17                37 117%                47                93 96%
2 Samsung 28                36 28%                25                95 278%
3 Nokia 17                20 17%              100                77 -23%
4 Sony Ericsson 6                  6 -5%                13                20 55%
5 Motorola 5                  5 10%                14                19 35%

 

 Table 2. Global smartphone vendor shipments and market share in Q4 2011. SOURCE: Strategy Analytics January 2012. (Millions of Units)

   

 Q4 ’10     2010     Q4 ’11     2011
Samsung 10.7     23.9     36.5     97.4
Apple 16.2     47.5     37.0     93.0
Nokia 28.3     100.1     19.6     77.3
Others 45.6     128.0     61.9     220.8
Total 100.7     299.5     155.0     488.5
                     
Global smartphone vendor
market share %		 Q4 ’10     2010     Q4 ’11     2011
Samsung 10.6%     8.0%     23.5%     19.9%
Apple 16.1%     15.9%     23.9%     19.0%
Nokia 28.1%     33.4%     12.6%     15.8%
Others 45.2%     42.7%     39.9%     45.2%
Total 100.0%     100.0%     100.0%     100.0%
                     
Total growth year-over-Year % 86.8%     71.4%     53.9%     63.1%

Apple shipped 37 million smartphones worldwide in Q4, up 117% from 17 million in Q3 — the strongest sequential quarterly growth among the top 5 smartphone brands, IHS reports. Samsung shipped 36 million smartphones in the same quarter. While this put Apple back on top (Apple also shipped the most smartphones in Q2), Samsung won the year. Samsung shipped 95 million smartphones in 2011, up 278% from the prior year.
 
Samsung offers "a complete line of smartphone products," for various price points and consumer requirements, Lam said, noting that this strategy carried Samsung past Nokia and Apple. Apple has worked a successful strategy with its iPhone as well: distribution of the iPhone family expanded across numerous countries, dozens of operators and multiple price points in 2011, Strategy Analytics reported.

While Samsung shipped the most smartphones, Apple bought the most semiconductors in 2011, edging out Samsung thanks in part to Apple’s iPad tablet business. "Apple must soon make a decision on whether to jettison Samsung as one of its principal suppliers for chips, screens, and other components. While Samsung has the technology to produce Apple’s components at a high level of efficiency and quality — including the new A6 chip — its expanding role as a principal competitor leaves Apple in an untenable situation. Apple may instead turn to Taiwan Semiconductor Manufacturing Company (TSMC) to produce its A6 chips," noted the US-Taiwan Business Council in a recent report.

"Apple and Samsung continue to run neck and neck in global smartphone shipments, setting up a tight battle for leadership that will continue throughout 2012," Lam predicts. This is a "two-horse race at the forefront of one of the world’s largest and most valuable consumer electronics markets," added Neil Mawston, executive director at Strategy Analytics.

Nokia, the previous market leader, dropped to third place with a -23% decline year-over-year. Tom Kang, director at Strategy Analytics, explained, “Nokia’s global smartphone market share halved from 33% in 2010 to 16% in 2011. A lackluster touchscreen smartphone portfolio and a limited presence in the huge United States market caused Nokia’s shrinkage last year. Nokia’s partnership with Microsoft will be very much in focus during 2012, and the industry will be watching closely to see how swiftly the two companies can expand in the high-value 4G LTE market that is rapidly emerging across the United States, Japan and elsewhere.”

The market share battle between Apple and Samsung reflects the competition between the two leading smartphone operating systems and ecosystems: Apple’s iOS and Google’s Android. However, the other major Android licensees — Sony Ericsson and Motorola — did not match Samsung’s strong smartphone performance. This may indicate that "the Android smartphone market is becoming too crowded," Lam said.

IHS (NYSE: IHS) provides analysis on energy and power; design and supply chain; defense, risk and security; environmental, health and safety (EHS) and sustainability; country and industry forecasting; and commodities, pricing and cost. Learn more at www.ihs.com.

Strategy Analytics is a global, independent research and consulting firm. Visit www.strategyanalytics.com for more information.

Subscribe to Solid State Technology

January 26, 2012 — The Joint Quantum Institute (JQI), the Neils Bohr Institute in Copenhagen, and Harvard University researchers developed a theoretical method for detecting weak electrical signals, using a nanomechanical "loudspeaker" and laser-based photon signals.

"We envision coupling a nanomechanical membrane to an electrical circuit so that an electrical signal, even if exceedingly faint, will cause the membrane to quiver slightly as a function of the strength of that signal," says JQI physicist Jake Taylor. "We can then bounce photons from a laser off that membrane and read the signal by measuring the modulation of the reflected light as it is shifted by the motion of the membrane. This leads to a change in the wavelength of the light."

If demonstrated through experiment, the work could have a tremendous impact on detection of low-power radio signals, magnetic resonance imaging (MRI), and the developing field of quantum information science.

Figure. The proposed nano mechanical device detecting a signal produced by the quantum-mechanical spin of a group of atoms. The atoms generate a faint radiofrequency signal in a coil (L) connected to microscale wires that form an electrical capacitor. This vibrates the nanomembrane, which in turn affects the resonant frequency of a laser optical cavity. The output is light at frequency that is the sum of the original laser frequency plus the signal from the atoms. SOURCE: Taylor/NIST.

The ability to detect extremely faint electrical signals could improve MRI medical procedures, reducing the size of the superconducting magnets and eliminating the scan tube.

The concept could also be applied in photonics communications, according to Taylor. One popular quantum information system design uses light to transfer information among qubits, entangled particles that will exploit the inherent weirdness of quantum phenomena to perform certain calculations impossible for current computers. The ‘nanospeaker’ could be used to translate low-energy signals from a quantum processor to optical photons, where they can be detected and transmitted from one qubit to another.

According to the team’s calculations, translating the mechanical motion of the "loudspeaker" device into photons will siphon a considerable amount of heat out of the system (from room temperature to 3 kelvin or -270C), reducing noise during signal detection.

The concept is reported at: J. M. Taylor, A. S. Sørensen, C. M. Marcus and E. S. Polzik. Laser cooling and optical detection of excitations in a LC electrical circuit. Phys. Rev. Lett. 107, 273601. Published online Dec. 27, 2011. Access it here: http://link.aps.org/doi/10.1103/PhysRevLett.107.273601

The JQI is a collaborative venture of the National Institute of Standards and Technology (NIST) and the University of Maryland, College Park.

View recent issues of the MEMS Direct newsletter

January 25, 2012 — Heidelberg Instruments launched the µPG 501 table-top direct-write lithography system for prototyping micro electro mechanical system (MEMS), integrated optics, microfluidic/lab-on-a-chip, and other devices as well as mask production.

The µPG 501 can write structures down to 1μm 50mm²/min, offering an exposure time of less than one hour for a 2" x 2" pattern. μPG 501 is equipped with a high power LED light source; standard available wavelengths are 390 or 405nm (others on request). The light engine features the Digital Micromirror Device (DMD) as the imaging device. The μPG 501 can expose standard positive and negative photo resists as well as UV-resists such as SU8. Since the intensity dose is not limited, the system is suitable for applications which require thick resists. Utilizing sophisticated Gray Scale Exposure technology, the μPG 501 has the ability to create 3 dimensional structures such as blazed gratings or micro-lenses.

The system occupies a 60 x 75cm² footprint. It uses data conversion software to provide basic design operations, and features a viewer for the design data as well as for the converted pixel data. The software supports multiple data formats such as GDSII, DXF, GERBER, CIF, BMP, and STL.

The integrated metrology system enables the μPG 501 to do overlay exposures either by manual or automatic alignment to multiple targets on the substrate. Heidelberg Instruments’ Autofocus System compensates for flatness variation of the substrate in real-time. Custom made vacuum chucks can hold substrates up to 5" diameter. The stage is driven by linear motors and controlled by encoders at a resolution of 20nm.

Heidelberg Instruments produces high-precision maskless lithography systems for direct writing and photomask production. Learn more at http://www.himt.de/en/home/.

View recent issues of the MEMS Direct newsletter

January 25, 2012 — SCHOTT North America Inc. introduced MEMpax borosilicate glass for use in micro electro mechanical systems (MEMS) manufacturing, available in thicknesses from 1.1 to 0.1mm.

MEMpax glass is produced in the same way as the company’s AF32 and D 263, then finished with a fire-polished surface, for the needs of MEMS and related ultra-thin borosilicate glass applications. Fire polishing gives the glass a high-quality, pristine surface and can help reduce processing costs.

The new glass shares physical, thermal, and chemical properties with the company’s Borofloat 33. The material properties of MEMpax allow anodic bonding with silicon wafers: Under the influence of temperature and pressure, ions diffuse between silicon and glass, which results in a hermetic bond, protecting the silicon wafer elements or connecting various components. The glass boasts a coefficient of thermal expansion (CTE) corresponding to silicon’s CTE to avoid warpage in bonding.

The glass is a high-quality insulator with low alkali content. It maintains good dielectric properties up to 450°C.
 
SCHOTT North America can be found at www.us.schott.com.

View recent issues of the MEMS Direct newsletter

January 25, 2012 — 2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device (MID) flow sensor that uses Ticona’s Vectra E840i LDS laser-activated liquid crystal polymer (LCP) for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with a Laser Direct Structuring (LDS) process.

The sensor is injection molded entirely from Vectra E840i LDS, specially developed for use with the LPKF Laser & Electronics AG LDS process. The tracks on the 12 x 10 x 6mm component are etched with LPKF laser equipment that selectively activates the laser-sensitive additive in the Ticona LCP. The circuit pattern is subsequently electrolysis plated.

Vectra E840i LDS MID specialty grade is 40% mineral filled with special LDS additive, reflow solderable, and more isotropic than typical glass-filled LCP. It has a high melt temperature and its heat deflection temperature (HDT) prevents softening during reflow. Its flow characteristics enable miniaturization, reducing component weight. It has a low humidity absorption, low warpage, no flash, and high dimensional stability. Other benefits include low coeffecient of thermal expansion (CTE) and inherent UL-94 V0 compliance without fire-retardant additives.

The process offers cost-efficient, low-volume packaging for sensor, microphone module, and ring contact designs, among others. Design changes to the conductor tracks are simply implemented by reprogramming the laser.

This sensor is used in air conditioning systems. 2E mechatronic worked on the chip-based sensor project with relay and switch specialist Gruner AG, research institute HSG Hahn-Schickard-Gesellschaft and micro-sensor developer MicroMountains Applications AG, all of Germany. Harting Mitronics has developed MIDs such as a camera module MID with a Vectra E840i LDS substrate for the Sick V300 Work Station camera. Other potential applications include a laser-structured MID-LED light component for dental lamps, automats, and house and street lighting.

Ticona will showcase its Vectra LCP specialty grades for electrical and electronic components at DesignCon 2012, Jan. 31 to Feb. 1 in Santa Clara, CA, Booth #218.

Celanese Corporation is a global technology leader in the production of specialty materials and chemical products. Ticona, the engineering polymers business of Celanese Corporation, produces and markets a range of high performance products. For more information, please visit www.ticona.com or www.ticona.cn (Chinese language).

January 24, 2012 — The Commerce Department’s United States Patent and Trademark Office (USPTO) seeks nominees in the US for the 2012 National Medal of Technology and Innovation (NMTI), honoring "this nation’s creative geniuses," said Richard Maulsby, the USPTO

January 24, 2012 – PRWEB — Si-Ware Systems (SWS) debuted the Silicon integrated Micro Optical System (SiMOST) platform to fab and package single-chip optical systems with validated micro electro mechanical system (MEMS) components. Multiple optical MEMS (MOEMS) structures can be patterned and etched on silicon on insulator (SOI) wafers using deep reactive ion etching (DRIE). The structures are then wafer-level packaged and diced to create a one-chip optical system.

SiMOST eliminates alignment for optics by lithographically aligning optics on-chip. Si-Ware claims this method reduces costs and package size, and improves chip reliability under shock and vibration.

“For the first time an optical designer has the freedom to design very complex systems with as many components as necessary with no impact on cost of assembly and bill of materials,” said Bassam Saadany, Division Manager for MEMS at SWS. “With SiMOST, optical systems can achieve economies of scale that are similar to the micro-electronics industry in terms of size and cost, which opens up a range of applications and market opportunities.”

SWS has created a library of building blocks for its SiMOST platform that designers can use in creating their optical systems. Optical components include flat, cylindrical and spherical collimating mirrors; wide bandwidth beamsplitters; optical filters; and moving corner cube reflectors. MEMS components include long travel range micro-actuators and micro-motors.

SiMOST has been demonstrated, manufacturing a fully monolithic FT-IR spectrometer and a swept laser source.

The SiMOST platform is complemented by SWS’s ASIC solutions division, which provides interfacing and control circuits. These interface and control ASICs handle the MEMS control, current, voltage and capacitive sensing, data conversion via ADC/DAC, and data processing.

SWS is presenting more details on its SiMOST set of solutions at Photonics West 2012 in San Francisco bJanuary 24-26, Moscone Center, North Hall, Booth #4004. SWS will present on SiMOST technology, January 25 at 12:30PM in the North Hall.

Si-Ware Systems (SWS) is an independent fabless semiconductor company providing a wide spectrum of product design and development solutions, custom ASIC development and supply as well as standard products.

SWS leverages its highly talented teams in MEMS design and development as well as Analog/Mixed-Signal and Radio Frequency (RF) Integrated Circuits (ICs) to provide highly innovative solutions and products in different areas ranging from PLL based timing circuits, sensor interfaces, frequency synthesis, data converters, RF front-ends, and MEMS based sensor systems. For more information, please visit http://www.si-ware.com.

View recent issues of the MEMS Direct newsletter

January 24, 2012 – PRNewswire-USNewswire — 4Wave Inc., thin film equipment maker, received several orders at the end of 2011 for its 200mm Ion Beam Sputtering systems, to be used in micro electro mechanical systems (MEMS) manufacture at semiconductor foundries.

4Wave’s Ion Beam Sputtering system can atomically deposit dielectric material for MEMS devices, allowing the user to select the optical characteristics of the film deposited. 4Wave’s system is designed to process 200mm wafers in a 24/7 manufacturing environment.

Also read: Semiconductor sputtering targets headed for 2012 market peak

4Wave provides ion beam thin film processing equipment and coatings services to meet challenging thin film processing requirements. Using its atomic layer processing capabilities, 4Wave also offers multilayer device fabrication and miniature optical components. Learn more at www.4waveinc.com.

View recent issues of the MEMS Direct newsletter

January 23, 2012 – PRNewswire via COMTEX — Pure-play MEMS foundry Silex Microsystems joined "Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices," or EPAMO, which is a European Union funded program developing new technologies for high performance RF systems, energy-efficient mobile communication systems, highly miniaturized and integrated RF components, and cost-efficient mobile phone component technologies.

Silex will develop high-performance metal through-silicon vias (TSV) for RF applications, PZT piezoelectric thin film technologies for actuator manufacture, and advanced integrated passive devices (IPD) using through-wafer processing and advanced materials development. This program leverages Silex’ expertise in 3D through-wafer processing to develop new micro electro mechanical system (MEMS) capabilities, says Dr Thorbjorn Ebefors, chief technologist at Silex Microsystems. "These new techniques will be used to fabricate high-density integrated inductors, resistors and capacitors for new classes of devices," Ebefors added.

RF MEMS have gained a great deal of interest from mobile electronics followers recently, when a WiSpry RF MEMS component was identified in a major Samsung smartphone. WiSpry confirmed the design win.

EPAMO will develop new advanced wafer materials and RF component designs, combining new thin film materials and thin film technologies with CMOS solutions and advanced 3D packaging technologies. Silex is the only pure-play foundry involved in EPAMO.

EPAMO is coordinated by Dr. Thomas Metzger of EPCOS AG (RF filters and module solutions provider for the RF front-end of mobile phones). For more information see www.epamo.eu.

ENIAC JU (European Technology Platform on Nanoelectronics Joint Undertaking), a public-private partnership between the European Commission, 21 European countries and various nanoelectronics actors funds euro 2.2 M of EPAMO budget. National public funding from the participating nations covers euro 5.5 M, and euro 5.6 M comes from EPAMO partners. For more information see www.eniac.eu.

Silex Microsystems a pure-play MEMS foundry with production operations totaling 25,000 square feet and dedicated lines for both 6" and 8" wafers. For more information see www.silexmicrosystems.com