Category Archives: MEMS

July 21, 2011 — In a podcast interview at SEMICON West 2011, Tony McKie, GM of MEMSSTAR, tackled the question of how to make micro electro mechanical systems (MEMS) truly manufacturable. "Nobody builds a MEMS manufacturing line anymore," said McKie. Instead, what people do is take a CMOS line (either an outdated one or a 6" or 8" line) and revitalize it and make it into a MEMS production line, which is fine for about 70% of the processes required for MEMS. But for the remaining 30% MEMS-specific processes, one has to integrate technologies into the rest of the line with a good level of productivity, he said.

"In the past, MEMS processes have been more R&D type [processes] and few companies have made the leap from R&D to manufacturing," noted McKie. He explained that what one ends up with is 70% well-understood equipment and processes, but the 30% remaining may result in lower productivity, less reliability, and slower throughput. The challenge for both MEMS manufacturers and their equipment suppliers is to raise the standard of performance that is expected of any silicon manufacturer, whether CMOS or MEMS. "Everyone now expects 95% uptime, a level of throughput, a level of productivity — it all comes back to [return on investment] ROI," he said. "MEMS processes need to come to the level of ROI that CMOS manufacturers have enjoyed for the last 20 years."

On the topic of standardization of MEMS processes, McKie is hopeful, but realistic. "MEMS is very IP-protected — everybody is doing their own thing and nobody wants to share what they’re doing with anyone else," said McKie. But he believes that MEMS will have to go the way of standardization just as the CMOS industry did. "As more and more MEMS devices come to market and as the quantity of MEMS that is manufactured increases, the larger MEMS manufacturers will have to be willing to share their technology."

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July 19, 2011 — iNEMI and the MEMS Industry Group (MIG) will host MEMS Needs and Opportunities, a workshop running September 15-16 (following the EMPC 2011 Conference) at the Hilton Metropole Brighton, UK.

Attendees can receive an early-bird discount through August 5. iNEMI members can register for free.

iNEMI is sponsoring this workshop to discuss the challenges of developing and adopting micro electromechanical system (MEMS) technologies. Supply-chain-wide collaboration can help reduce risks and accelerate market adoption in various product segments. The workshop will gather speakers from OEMs, suppliers, and research institutions working on MEMS technology development.

Workshop participants should be working to identify challenges and gaps in the current MEMS ecosystem — technology, processing, test/reliability — that could be resolved with a collaborative approach. The workshop will then help identify the major technology areas where the electronics industry has the greatest potential impact on improving the reliability, testability, performance, and cost of MEMS–based solutions.

For high-priority challenges, MEMS workshop attendees will help identify and define collaborative projects that iNEMI and other organizations can embark upon to address the technology and supply chain gaps. They will also be able to form action groups to define and execute the required industrial collaborative programs, and define research and development needs to support these programs. Those who participate in the follow-on collaborative programs will enjoy a competitive advantage as new technologies and methodologies are developed and deployed to drive MEMS industry best practices.

iNEMI and MIG are looking for attendees who are middle management and senior executives in advanced technology development, product strategy and development, sourcing and supply chain management, and product qualification and regulatory certification.

Learn more about the workshop and register here: http://www.inemi.org/events/mems-workshop

July 19, 2011 — Multi-Scale Energy System (MuSES) Laboratory researchers at Michigan Tech have characterized the output flow power of round and square/rectangular microfluidic channels, revealing distinct improvements with round geometries.

Round microchannels are expected to work better than square ones in bubble-driven micropumps, due to corner leak flow in angular channels. Over the past two years, MuSES graduate student Ryan Lemmens accurately characterized the effect. Maximum output flow power of a valve-less bubble-driven micropump can be improved 3.6-4.6x by simply swapping the commonly used square/rectangular microchannels to round ones.

Lemmens expects the research to inform microfluidic device designers looking to save power and increase performance, for biomedical microfluidics and other applications.

The research results will be published in September 2011 in Sensors and Actuators. Access the abstract here: http://www.sciencedirect.com/science/article/pii/S0924424711002871

Learn more at www.me.mtu.edu

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July 18, 2011 – GlobeNewswire via COMTEX — Maxim Integrated Products (MXIM) acquired SensorDynamics, an Austrian semiconductor company that develops proprietary sensor and microelectromechanical system (MEMS) devices.

Maxim is paying approximately $130 million plus the assumption of approximately $34 million in debt to acquire SensorDynamics. Maxim reported revenue of approximately $2.0 billion for fiscal 2010.

MXIM will access SensorDynamics’ various MEMS sensor technology patents, along with developments in low-power interface and wireless connectivity solutions that enable MEMS devices. Maxim will parlay the acquisition into expanded automotive and high-end consumer electronics market share, where it has significant analog IC presence. While SensorDynamics currently focuses mainly on automotive sensors, Maxim expects the core MEMS technologies will transfer well to high-end consumer chips.

Automotive MEMS, which hit a record in 2010, are expected to bring in $2.1 billion in 2014. Auto and consumer MEMS were hit hardest by the recession, say some analysts. More information about new MEMS, for consumer and related apps, is available in iSuppli’s recent report, "New Killer Products Keep Consumer MEMS Bubbling."

Maxim will fuse many types of sensors with its analog technology, integrating sensing, analog processing, and low-power wireless connectivity, said Tunc Doluca, Maxim president and CEO, discussing the product possibilities post-acquisition. In the near term, SensorDynamics will focus on engineering for sensors and MEMS, tapping into MXIM’s manufacturing, distribution, and sales infrastructure for inertial sensor, wireless connectivity and sensor interface markets. Longer term, Maxim will address selected portions of the broader MEMS-based sensor market.

SensorDynamics has subsidiaries in Italy and Germany and is certified under ISO/TS 16949.

Check out Maxim’s webcast about the acquisition at http://www.maxim-ic.com/sd

Maxim Integrated Products is a publicly traded company that designs, manufactures, and sells high-performance semiconductor products.  A Fortune 1000 company, Maxim is included in the Nasdaq 100, the Russell 1000, and the MSCI USA indices. For more information, go to www.Maxim-ic.com.

SensorDynamics is a semi-fabless semiconductor company that focuses on sensors for high-volume applications in automotive and high-end consumer sectors. SensorDynamics develops and supplies fail-safe micro and wireless semiconductor products for automotive and high-end consumer key accounts. The company acts as a general contractor with in-house MEMS production and cooperates closely with leading international technology partners. Learn more at www.SensorDynamics.cc 

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July 15, 2011 — Test equipment maker Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary, added 2 MEMS testers to its product line: Pressure Test Unit (PTU) and the Acoustic Test Unit (ATU).

The test systems are meant to be flexible and run with high parallelism, testing up to 32 MEMS ICs in parallel. They boast a modular design for integration on gravity-feed, test-in-strip, and pick-and-place handlers.

The ATU tests audio devices used in a variety of consumer electronics and automotive applications.

The PTU offers high accuracy testing of integrated pressure sensors used in the automotive market.

Rasco also offers magnetic, optical and temperature sensor device testers.

The MEMS test tools debuted at Semicon West 2011.

Cohu, through its Delta Design and Rasco subsidiaries, is a supplier of test handling, burn-in, thermal subsystems and MEMS test solutions used by the global semiconductor industry. Cohu acquired Rasco in 2008. Learn more at www.cohu.com

See Rasco’s SO7100 Magnetic Test Unit (MTU), SO7200 Pressure Test Unit (PTU), SO7300 Optical Test Unit (OTU), SO7400 Acoustic Test Unit (ATU), and SO7600 Sensor Test Unit (STU) specs at http://www.rasco.de/english/produkte/contactors-mems.htm

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July 14, 2011 — The Fraunhofer Institute for Photonic Microsystems (IPMS) is helping video eyewear company Vuzix Corporation (TSX-V: VZX, OTC:BB: VUZI, FMB: V7X) develop micro electromechanical system (MEMS) devices optimized for augmented and virtual wearable displays. The goal is a MEMS device that integrates the display and optics into a monolithic display engine, aiming for "sunglass-styled" video glasses.

Fraunhofer’s MEMS devices can help create a single electro-optic device for Vuzix’ next generation HD Video Eyewear displays. Fraunhofer joins a team of technology partners working with Vuzix on the monolithic display engine. The partners report that they are already seeing promising results for near-eye mobile display technology.

Also read: Fraunhofer develops gas-based etch for MEMS fab

Vuzix provides video eyewear products to the defense, consumer and media & entertainment sectors. For more information visit www.vuzix.com.

Fraunhofer IPMS, an institute Fraunhofer-Gesellschaft, carries out customer specific developments in fields of microelectronic and micro systems technology. Fraunhofer IPMS develops and fabricates next-generation MEMS and OLED devices in its own clean room facilities, taking concepts from design and R&D to pilot production. For more information, visit www.ipms.fraunhofer.de

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by Michael A. Fury, Techcet Group

Click to Enlarge July 14, 2011 – Roaming the show floor is always a mix of nostalgia (old friends are still in the business), reassurance that a new generation has taken an interest in the industry, and just a touch of melancholy that great halls that used to have to turn away semiconductor suppliers due to over-subscription are now shared with other industries like MEMS, LEDs and other lighting, displays, and of course the sprawling PV infrastructure (Intersolar this year actually encroached into a section of the North Hall of Moscone, with the West Hall across the way full to bursting.)

Bobbi Rossi and the folks at Spartan Felt are continuing to nudge their product lines from industrial glass closer to the CMP space each year. In addition to hard pads that can compete with IC-1000 and ceria fix abrasive pads, they are producing zirconia and silicon carbide fix abrasive pads for other industries. But given the variety of new materials being using in semiconductor devices, it won’t be long before someone tries these exotic pads for some new CMP application.

SEMICON West 2011
Day 0: Market forecasts, supply-chain dynamics
Day 1: Intersolar wanderings, SEMICON West symposium
Day 2: CMP views, outlooks for breakfast
Day 2.5: Roaming the floor, LEDs, CMP pads, kudos to Napoleon
Day 3: Two eye-catching technologies in CMP slurry, printed electronics

Peter Pozniak of Malema Sensors gave me a guided tour of their Coriolis flow meters that can maintain stable liquid flow readings with 50% air entrainment, far beyond the point at which an ultrasonic flow sensor will give up in despair. The meters work equally well on clear fluids and fully loaded slurries; in the case of slurries, they can even report the density of the materials flowing through. I don’t understand enough of the fundamental operating principles to give away any state secrets, but it is based on an invention attributed to Napoleon (yes, the Bonaparte one), who noticed that cannonballs fired along east-west lines found their targets more reliably than those fired along north-south lines. The rotation of the earth was the culprit, and Napoleon learned how to compensate accurately for this Coriolis effect.

Eric Virey, LED analyst for Yole D

July 14, 2011 — Kurt J. Lesker’s new Atomic Layer Deposition system, the ALD 150LX, can operate as a stand-alone or fully integrated cluster tool system for nano, microelectronics, optics, MEMS, semiconductor, photovoltaics, photonics, catalysis & fuel cells, and OLED manufacturing. It integrates process control, pumping, pressure management, and gas delivery packages tailored for the specific application.

The ALD 150LX features proprietary perpendicular flow reactant delivery with central pump for reactant dispersion. The expandable LVP, HVP precursor delivery suits multiple ALD layer deposition, including metals, oxides and nitride layers. Remote inductively coupled plasma source is optional.

The system heats substrates to 500°C, with heated chamber walls, delivery lines and pumping lines supporting deposition.

Up to 6" wafers can be handled, and the tool offers optional Load Lock. It is fully enclosed with a standalone control console. Monitoring is acheived in-situ via standard ellipsometry ports.

John Morris Scientific installs the system and provides onsite user training. Preventative maintenance and extended warranty agreements are also available.

For further information on the ALD-150LX, visit http://www.johnmorris.com.au/home.aspx or go to http://www.lesker.com/

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July 12, 2011 — CEA-Leti acheived higher reliability in its RF MEMS switch technology via a new design for its electrostatic actuators. The dielectric-less design uses an air gap to prevent contact between the electrodes when the bridge is down, thanks to small dielectric dots placed under the mobile electrode.

Long-term tests show no pull-down voltage drift and significantly increased reliability. By replacing gold with ruthenium for the contacts, CEA-Leti reduced stiction sensitivity and improved device performance. A hermetic thin-film packaging process was developed to prevent organic contamination and lower contact resistance.

The new switch-manufacturing process has been demonstrated on 200mm silicon wafers at the MINATEC dedicated MEMS fabrication platform. Yields close to industrial standards have been achieved, providing thousands of working devices per wafer.

Leti’s industrial partners are currently evaluating samples of these switches for use in efficient reflect-array antennas and redundancy switching matrices for microwave applications.

Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on nanotechnologies and their applications, mainly NEMS and MEMS. For more information, visit www.leti.fr.

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July 12, 2011 – JCN Newswire — Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputtering, and other technologies in MEMS, LED, and 3D IC packaging.

This joint development will encompass development of technology for transferring patterns of sub-micron gold particles to a silicon wafer at one time at the low temperature of 150C on a high-volume production basis. Using the transferred pattern of gold particles, which have an effect on absorbing wafer surface roughness, it is possible to achieve metal-metal bonding on a wafer level at 200C, enabling high temperature resistant hermetic seals and electrical connections.

The pattern transfer and bonding technology enables electrical connections and hermetic seals with the minimum necessary amount of gold material while also resolving issues faced when using current technologies: plating, screen printing, and sputtering, as well as micro-bump bonding technologies. The process aims to meet high heat conductivity, high heat resistance, narrow line width and narrow pitch goals for advanced devices.

Tanaka Kikinzoku Kogyo has developed manufacturing processes of a substrate for pattern transferring of sub-micron gold particles which offer higher heat resistance and lower stress than existing joints by soldering, and able to be bonded at low temperature due to its size effect. SUSS MicroTec will develop a wafer-level transfer and bonding equipment using such transfer substrates. This technology development is being carried out with the cooperation of Professor Shuichi Shoji and Associate Professor Jun Mizuno, Nanotechnology Research Laboratory, Waseda University.

Through the joint development, the two companies aim to begin sales of the transfer substrates and the transfer and bonding equipment in March 2012.

By implementing the bonding technology in packaging and assembly processes, manufacturers of micro electro mechanical systems (MEMS) devices, light emitting diodes (LEDs) chips and small-sized chip electronic components can form fine patterns on silicon wafers for sealing frames and electrodes at once without any waste and a 100% usage rate (the ratio of material that can be mounted on a product) of expensive gold material. The process can form hermetic seals in advanced MEMS, bump electrodes for high-brightness LEDs (HB-LED), and enable 3D packaging.

Tanaka Kikinzoku Kogyo and SUSS MicroTec will have a joint booth at Exhibition Micromachine/MEMS 2011 held at Tokyo Big Sight (Ariake, Koto-ku, Tokyo) July 13-15 at East Hall 2, booth B-05.

Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. Website: http://pro.tanaka.co.jp

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.

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