Category Archives: MEMS

May 31, 2011 Micro-cantilevers can measure lipid bilayers interactions with surfactants with a new level of sensitivity, say Rice University researcher Sibani Lisa Biswal, assistant professor in chemical and biomolecular engineering, and Kai-Wei Liu, a graduate student in Biswal’s lab.

Lipid bilayer membranes surround living cells and work with specific membrane proteins as "gate keepers": letting ions, proteins and other essential molecules into the cell. Individual lipid molecules in the bilayer have a hydrophilic head and two hydrophobic tails. They aggregate into two-layered sheets, with the heads pointed out and the hydrophobic tails pointed inward.

Liu and Biswal have previously worked on attaching lipid bilayers to microcantilevers. A protective coating on the thin gold layer makes the top of the cantilever inert, so the membranes attach themselves to and spread out over the silicon dioxide bottom. The membrane’s interaction with the cantilever affects surface tension, bending the cantilever enough to be measured by a laser sensor with nanometer resolution.

In their current work, the researchers introduced varying concentrations of lysolipids to the supported lipid bilayers. Lysolipid compounds lower liquids’ surface tension, and have a hydrophilic head but only one hydrophobic tail. They are surfactants that can be used in detergents, among other applications. Based on the experimental results, measured by the micro-cantilevers, detergents could be fine tuned to better destroy stains.

"The cantilever naturally wants to bend with whatever force the membrane puts on it," Biswal said. Cantilever structures are the simplest micro-electromechanical systems (MEMS) that can be easily micromachined and mass-produced.*

In low concentrations, lysolipid molecules wedge themselves into the bilayer, while their hydrophobic tails join up to the membrane’s hydrophobic inner ring; changing the surface tension on the cantilever, Liu and Biswal found.

In high concentrations, lysolipid monomers form micelles, rings of molecules that interact with the membranes and disrupt the hydrophobic interactions that keep them together. Depending on their strength (determined by the chemical makeup of their hydrophobic tails), the micelles can either weaken the membranes by pulling lipid molecules away or destroy the membranes completely.

Biswal sees other potential for the technique. "We’re interested in using this as a general platform for looking at small molecules," she said.

Liu is studying how hepatitis C peptides behave in the presence of a microcantilever-mounted membrane. "This could be a way to probe how viruses are able to enter cell membranes or disrupt proteins on their surfaces," she said.

Biswal suggested that carbon-60 atoms — buckyballs — might also be a good subject, because they are naturally hydrophobic. Research on buckyballs could advanced understanding of nanomaterial/cell interaction.

Results were reported online in the American Chemical Society journal Analytical Chemistry. Access the article here: http://pubs.acs.org/doi/abs/10.1021/ac200401n

The Robert A. Welch Foundation funded the research.

Learn more at www.rice.edu

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May 30, 2011 – NIST Tech Beat — As smartphones usher in a host of new high-volume MEMS applications, semiconductor and electronics roadmaps are paying serious attention to the manufacturing and costs gaps in MEMS production. NIST’s Michael Gaitan and the MEMS Industry Group are helping shape iNEMI, ITRS roadmaps with MEMS in the spotlight.

The smartphone is becoming mobile electronics king, but the army supporting it is lead by micro electro mechanical systems (MEMS). MEMS create mobile speakers, projectors, gyroscopes and other devices integrated onto mobile computing platforms, notes the US National Institute of Science and Technology (NIST).

NIST reports that MEMS revenues (about $7 billion in 2010) largely come from high-volume industrial and automotive sectors: accelerometers (for airbags) and other sensors for the automotive industry, ink-jet printer head components, display and hard-disk drive technologies. MEMS devices were once seen as distantly related to computer chips and consumer electronics, said Michael Gaitan, Enabling Devices Group leader, NIST, adding that mobile computing devices like smart phones and tablets are propelling so-called ‘New MEMS’ onto the main stage in semiconductor/electronics industries with their "rapid growth."
 
The International Electronics Manufacturing Initiative (iNEMI) has produced technology roadmaps for the electronics industries since 1994. iNEMI’s recently issued nearly 2000-page technology roadmap includes a chapter, drafted by the MEMS Technology Working Group (Gaitan chaired the group), on MEMS technology evolution. Special attention went toward the technical challenges to achieving MEMS manufacturing capabilities that will be required over the next 10 years.

Challenges and gaps exist in:

  • device and reliability testing,
  • wafer-level testing,
  • modeling and simulation tools to support MEMS design, 
  • assembly and packaging standardization.

Gaitan, who is currently on assignment to the NIST Technology Innovation Program, sees cooperation as key. Test costs comprise up to half a MEMS’ manufacturing costs, he points out. Gaitan chairs the new MEMS Technology Working Group, which will contribute to the next version of the International Technology Roadmap for Semiconductors (ITRS). The working group will concentrate on microphones, accelerometers, gyroscopes, etc., in next-gen smart phones, as well as emerging MEMS for mobile opportunities. Projecting 15 years out, the working group is assessing device performance needs, design and simulation tools, packaging and integration, and testing. Conclusions will be included in the 2011 ITRS, to be issued later this year.

The MEMS Industry Group, a trade association focused on advancing MEMS across global markets, has contributed to both roadmapping activities.

NIST’s participation in the iNEMI and ITRS efforts helps to guide its laboratory programs aimed at developing the measurement capabilities that industry will require to make current and next-generation technologies.

The National Institute of Standards and Technology (NIST) is an agency of the U.S. Department of Commerce.Learn more at www.nist.gov

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May 27, 2011 — Based on COMSOL Multiphysics simulation software, the new COMSOL Inc. Microfluidics Module enables users to study microfluidic devices and rarefied gas flows. The module is designed for microfluidics and vacuum researchers and engineers.

The Microfluidics Module can be used with lab-on-chip devices, inkjet technology, digital microfluidics, electrokinetic and magnetokinetic devices, biosensors, and vacuum system designs. Tutorials and relevant models can be used for instruction or a starting point for experiments (Capillary Rise, Jet Instability, Drug Delivery System, Electrokinetic Valve, Electroosmotic Mixer, Electrowetting Lens, Lamella Mixer, Star Chip, Viscous Catenary, Vacuum Capillary, and Ion Implanter). Read more about ion implant here.

Microfluidics device simulation requires the researcher to incorporate multiple physical effects, noted Dr. James Ransley, who developed the Microfluidics Module with COMSOL. The Microfluidics Module’s toolset handles single- and multi-phase flows, transport and chemical reactions, flow in porous media, and rarefied flows. One user interface allows users to couple physics phenomena with thermal and electromagnetic effects, he added.

Interfaces for single-phase flow simulate compressible gas flows at low pressures, non-Newtonian flows (such as blood flow), and laminar and creeping flows that typically occur in lab-on-a-chip systems, and similar applications.

The module’s modeling interfaces for executing two-phase flow simulations use the level set, phase field, and moving mesh methods. It accounts for fluid-interface effects such as capillary forces, surface tension forces, and Marangoni effects.

Electrokinetic and magnetohydrodynamic models can be set up to simulate electrophoresis, magnetophoresis, electroosmosis, dielectrophoresis, and electrowetting effects. These suit research into existing and emerging passive electronic display technologies.

Chemical diffusion for multiple dilute species allows simulation of processes occurring in lab-on-chip devices and biosensors.

The Microfluidics Module’s free molecular flow interface uses the fast angular coefficient method and enables imulations where the molecular mean free path is much longer than the geometric dimensions. Vacuum system designers can use the tool in combination with COMSOL’s LiveLink interfaces for industry-standard CAD packages, running quick parametric studies of chamber geometries and pump configurations.

COMSOL Multiphysics is a software environment for the modeling and simulation of any physics-based system. Optional modules add discipline-specific tools for mechanical, fluid, electromagnetics,  and chemical simulations, as well as CAD interoperability. Learn more at www.comsol.com.

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by Els Parton, science editor, imecClick to Enlarge

May 26, 2011 — Nanoelectronics is not only about smaller transistors and more complex chips, it’s about a whole new world of opportunities and solutions to major societal challenges, underlined Luc Van de hove, president and CEO of imec, in his opening keynote at the organization’s annual technology forum.

A world of opportunities lies open for the semiconductor industry in the development of smarter and more user-friendly smartphones — 4.5 billion cell phones are in use today. This small device has altered the way we communicate and interact with our environment; it complements our senses with location information and omniscience. "One of the senses missing today is smell. Why not incorporate an electronic nose in future smart phones to check air quality, food freshness, or to perform alcohol tests," he asked, while showing a recent e-nose prototype based on MEMS.

Another key driver for the industry is the tablet PC. Market analysts predict that by the end of 2011, 54 million tablet PCs will be on the market. As many as 80 different tablet PCs were presented at the Consumer Electronics Show in Las Vegas.

3D TV is another major technology driver for the coming years. It will augment our user experience. The market shows an amazing growth rate of 80.2% with about 78 million devices expected by 2012. "Developments around holographic displays are very important in this field," Van den hove explained. Imec aims to design the ultimate 3D display: a holographic display with a 60-degree diffraction angle and a high-definition visual experience, based on NEMS technology," he noted.

And then there is organic electronics, enabling a whole new world of opportunities for ultralow-cost electronics: smart signage interacting with the environment, smart shopping displays suggesting people what to buy, and flexible light panes to stick anywhere in your home.

But nanoelectronics will also have its impact outside of information and communication technologies — e.g. on the healthcare sector, stated Van den hove. The first wave of health-based devices is on the market today assisting people during sports — however, the real challenge is to provide solutions for the aging population and the associated increasing healthcare cost," he said. "The second wave in health-based devices will be about ambulatory monitoring, bringing the doctor to your home."

And finally, there is the huge potential on the energy market to provide people with renewable energy solutions. "Of all sources of renewable energy, the sun has by far the largest potential," Van den hove said. The aim is to improve the yield of silicon PV systems, bringing down the cost per kilowatt-hour. This can be done by increasing the efficiency of the cells, using less base materials, increasing the lifetime of solar modules and by making the modules "smart" by integrating sensor functionalities. Meanwhile, organic PV will enable entirely new PV-integrated applications thanks to its flexible, low-cost and light-weight nature, he added.

From the multitude of trends and technology highlights that Van den hove showed during his presentation, one thing is clear: a world of opportunities lies ahead of us, both as a consumer and as an industrial player.

May 26, 2011 — BCC Research estimates that the sensors industry will be worth $91.5 billion in 2016. According to the research firm’s report, "Sensors: Technologies and global markets (IAS006D)," the sensors rise will translate to a five-year compound annual growth rate (CAGR) of 7.8%.

Click to Enlarge
Figure. Global sensors market, 2009-2016 in $ millions. Source: BCC Research May 2011.

Image, flow, and level sensors will grow at 8.5% CAGR to $27.2 billion in 2016, after being valued at $18.1 billion in 2011. This is considered the largest segment of the sensors market.

The second-largest segment, pressure and temperature sensors, equals roughly $14.5 billion in 2011. Expect to see that grow at 6.7% CAGR to nearly $20 billion in 2016.

Biosensors and chemical sensors are at $13.3 billion in 2011, and should hit $21 billion if the segment follows its projected 9.6% CAGR.

Position and load/torque sensors are worth $10.7 billion today. By 2016, 6.5% CAGR will drive the expected value to $14.7 billion.

The remaining "miscellaneous" sensors make up $6.1 billion of the overall sensors market. BCC Research forecasts a 6.7% CAGR through 2016.

Sensors are diversified into a range of end-use industries and products. BCC Research’s report takes into consideration various applications, sensor development and production technologies, and major market trends in terms of region and application sector. The report highlights new sensor developments with respect to continuous improvements in environmental performance.

To learn more, contact BCC Research (http://www.bccresearch.com), 35 Walnut Street, Suite 100, Wellesley, MA; Telephone: 866-285-7215

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May 25, 2011 – JCN Newswire — Specialty foundry TowerJazz will collaborate as a manufacturing partner with Singapore’s Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR) on micro-electro-mechanical systems (MEMS), packaging and ASICs. This marks another notch in TowerJazz’s Asia expansion, which includes new China offices and a potential fab buy in Japan.

TowerJazz is IME’s manufacturing partner in a three-party collaboration framework (the third party are fabless and fab-lite members). To-date, the collaboration has covered pressure sensors, inertial sensors, and micromirrors with MEMS companies. Through-silicon via (TSV) and advanced packaging, 3D IC, photonics, and nanoelectronics could drive future projects.

Existing CMOS fabrication processes can be implemented in MEMS manufacturing to bring costs down, and lead to more integration with CMOS devices, said Prof. Dim-Lee Kwong, executive director, IME. IME is an 8" (200mm) wafer technology development site for MEMS and ASICs.  MEMS fab integration into high-volume CMOS manufacturing facilities, and the promise of monolithic integration of CMOS + MEMS, could lower production costs on devices with both electronics and electromechanical functionalities.

Integrated CMOS + MEMS devices include airbag-sensor accelerometers and motion-control accelerometers in handheld gaming devices, high-performance switches for communications, fluidic devices in inkjet printer heads, and micromirrors for digital light projection (DLP, as in TVs). These four examples include highly diverse physics for the MEMS sensor, spanning mechanical motion sensing, tuning of high speed radio frequencies, actuation of fluidic valves, and optical reflection and tuning, respectively.

In addition to this Singapore-based collaboration, TowerJazz recently expanded in China, citing RF customers in the region, well as power management, CMOS image sensors (CIS), MEMS and other applications. TowerJazz is also considering buying Micron Technology’s semiconductor wafer fabrication facility in Nishiwaki City, Hyogo, Japan.

The Institute of Microelectronics (IME) is a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR). *STAR supports Singapore’s key economic clusters by providing intellectual, human and industrial capital to its partners in industry. It also supports extramural research in the universities, hospitals, research centres, and with other local and international partners. For more information, visit IME on the Internet: http://www.ime.a-star.edu.sg.

Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM) is a global specialty foundry. TSEM and its fully owned U.S. subsidiary Jazz Semiconductor operate collectively under the brand name TowerJazz, manufacturing integrated circuits with geometries ranging from 1.0 to 0.13-micron. For more information, please visit www.towerjazz.com.

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by Mieke Van Bavel, science editor, imecClick to Enlarge

May 25, 2011 – A delicious piece of salmon, nicely decorated with mashed potatoes and red cabbage. Not a foretaste of what we’ll get at the itf2011 conference dinner, but a picture out of Francesco Pessolano’s presentation to illustrate what future vision systems will be capable of.

In the world of cameras, video, and spectral tools, the future is to digital optics — take the optical path (i.e., lenses, mirrors, filters) and make it out of chips, in a digital way. Let’s get back to our piece of salmon. We can look at it with a traditional imaging system and it tells us which color, shape, and texture the salmon has, just as our own eyes do. But we can also use hyperspectral imaging. This technique zooms in on each pixel and looks at the light reflected from the pixel, from UV to IR and even deep-IR. It gives us a curve, which is characteristic for the material at that specific salmon pixel. It allows us to "see more." Hyperspectral imagers are in use by industry, but they are very slow, massive and expensive. This hinders their wide applicability in areas such as healthcare, forensic medicine and food sorting.

If we implement digital optics, however, we get a small, fast, cheap, reliable, and broadly employable hyperspectral imaging system — that’s the aim of imec’s NVision program, headed by Pessolano. The digital optics inside will be enabled by advanced CMOS, by microscale MEMS (think about micromirror arrays to make digital lenses), and on the longer-term by nanoscale MEMS. Digital optics will offer the advantages of digital imaging. And compared to traditional optics, it costs less, is easy to scale, improves what exists (such as hyperspectral imaging) and opens up a range of revolutionary applications (such as holographic video). Developing the new vision systems requires a holistic approach: we should look at the system from technology all the way to application, from exploring digital optics all the way to examining the quality of our piece of salmon.

Click to Enlarge
Setup for hyperspectral imaging. The goal of this research is to develop
building blocks for a fast, low-cost, easy-to-use and small hyperspectral
camera. This can for example be used in food sorting applications.

 

May 25, 2011 — STMicroelectronics (NYSE:STM), consumer and portable MEMS supplier, will bump up its micro electro mechanical systems (MEMS) production capacity to more than 3 million sensors a day by year’s end.

The capacity ramp is being supported by a "beefed-up manufacturing machine," said Benedetto Vigna, group VP and GM of ST’s MEMS, Sensors and High Performance Analog Division, citing the company’s high-volume fab capability and repeatable, consistent test procedure. ST Micro makes MEMS in Agrate and Catania, Italy (sensor fabrication), Rousset and Crolles, France (logic die production), and Kirkop, Malta and Calamba, Philippines (assembly and testing).

The company’s THELMA (Thick Epi-Poly Layer for Microactuators and Accelerometers) surface micro-machining process combines variably thick and thin poly-silicon layers for structures and interconnections (used in accelerometer and gyroscope MEMS fab). The complementary VENSENS (Venice Sensor) process allows STM to integrate a cavity into mono-crystalline silicon, producing an ultra-compact pressure sensor.

STMicroelectronics plans to sell these MEMS into high-growth markets as healthcare, industrial and automotive. STM began producing MEMS on 8" wafers in 2006, reducing its unit costs and accelerating development of new MEMS markets and expansion in established ones. STM’s MEMS sensors are used in smart phones, tablets, personal media players, game consoles, digital still cameras and remotes, as well as laptop computers, car airbags, and enhanced navigation systems.

STMicroelectronics provides semiconductors for multimedia convergence and power applications. Further information on ST can be found at www.st.com.

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May 25, 2011Newport Corporation, lasers and photonics technology provider, introduced the Laser µFAB tabletop laser microfabrication workstation for researchers. Equipped with submicron resolution and a large stage, the tool can perform polymerization and ablation for MEMS, microelectronics, and other applications.

Click to EnlargeThe Laser µFAB is designed for use in additive and subtractive processes, including two-photon polymerization (TPP) during 3D microfabrication, laser ablation and surface structuring of various materials, volumetric writing, and nanosurgery/microdissection. Researchers use TPP to develop photoresists for photonics, microelectronics, and MEMS. The tool ablates and structures metals, polymers, semiconductors, glasses, ceramics, and biological targets. Waveguides and microfluidics can be volumetrically written in glass or polymer substrates.

The Laser µFAB can be configured for use with femtosecond laser oscillators, amplifiers, OPAs, and other types of lasers in the visible to near-infrared (VIS-NIR) range. Sub-micron spot sizes are achieved at the sample with high numerical aperture (NA) objectives. Simple lenses can be used in applications where larger (10-20µm) spot sizes are acceptable. Computer-controlled variable attenuation integrated with the workstation prevents over or under exposure at the sample.

The standard Laser µFAB’s high-precision stages cover 100mm X/Y and 4.8mm Z, with 50nm resolution. This allows for continuous large area patterning without stitching. The top plate’s holder accomodates wafers, slides, cover slips, and other large samples.

Newport Corporation is an advanced-technology products and systems supplier to scientific research, microelectronics manufacturing, aerospace and defense/security, life and health sciences and precision industrial manufacturing markets. For additional information, visit www.newport.com/TAC-PR01

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Click to EnlargeMay 24, 2011 — Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.

The tool’s standard Zebra wafer thickness and wafer topography metrology (ZebraOptical CT-IR) is paired with an optical microscope and VIS/NIR spectrometer. Users can measure substrate, membrane, and coating thicknesses and characterize coatings’ optical properties on the same tool platform.

A sample measurement service is available now. Learn more by contacting [email protected]. Lead time is currently 1 to 3 weeks ARO for the basic configuration.

Sunrise Optical LLC is an optical metrology company specializing in design and manufacturing of spectroscopic and imaging systems. www.zebraoptical.com.

Click to Enlarge
Zebraoptical Integrated Metrology Tool (ZIMT) interferometry measurement.

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