Category Archives: LEDs

by Bob Haavind, editor-at-large, Solid State Technology

March 12, 2010 – The light-emitting diode (LED) market has gone through two cycles of major growth, but an even bigger "third cycle" based on super-efficient lighting looms ahead, perhaps around 2013, predicted speakers at a SEMI breakfast at Teradyne near Boston on March 10.

Jonathon (Jed) Dorsheimer, senior equity analyst for Canaccord Adams, discussed the three growth cycles for LEDs in a talk on the marketplace. High cost and performance issues will limit LED lighting to small specialty niches, he said, until technology and cost reduction make it competitive to alternatives such as fluorescents and halogen lamps. The boom should come about 2013, he predicted, when trigger points and value propositions should be reached in major lighting markets. Even then, as detailed in his firm’s in-depth study to be completed about mid-year, he assumes that external stimulus such as government subsidies and incentives for greener technology would account for 30% of the economic driver sparking a take-off in broad lighting markets.

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Available market for LED light bulbs (retrofit lamps). Source: Strategies Unlimited

The push for green technology will kick-start the coming boom, agreed Chuck DeMilo, director of product marketing for Luminus Devices, an LED company with a fab in Woburn, MA and an assembly facility in Billerica, MA. High-brightness LEDs provide the most efficient lighting source ever, he pointed out, with added benefits including no toxic materials. This is a big plus when compared to the problem of disposing of the mercury in the fluorescent lamps currently replacing incandescents because they are more efficient. Lifetimes of 50,000 hours also offer big advantages. He suggested that while about $50 million worth of LEDs were sold in 2009 to replace lightbulbs, demand will jump to top $1 billion by 2013 as the lighting market takes off.

However, cost remains a critical factor. Projections are for a 75% decline in cost for LED devices with a 50% cost reduction at the package level, according to the US Dept. of Energy’s solid-state lighting (SSL) R&D and manufacturing Roadmap, which should open large markets in the lighting sector.

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Source: US Department of Energy, Solid-state lighting & research development manufacturing roadmap, Sept. 2009

Dorsheimer showed a $65 bill of materials for an LED lamp, including $25 for the LED itself. This must come down to where a replacement bulb costs about $10, he suggested, before the devices can move into major lighting markets. Currently LEDs are not competitive in commercial and residential lighting where cost/lumen is low. It is expensive to use a 50-foot lift to replace halogen lamps in a workplace such as a factory or warehouse, he suggested. But if light quality is important, such as to add blue sparkle to a diamond in a jewelry display, LED lighting may be favored even with the higher cost.

Enabling technologies, market drivers

Initial markets for LEDs, including TV remotes and indicators on TV sets, auto dashboards and the like, were the first cycle. The second cycle in the 90s, including color screens on hand sets and blue screens on TV sets, led to overcapacity. Now, even with vendors operating at 40% capacity utilization, Dorsheimer predicts shortages in 2010. The main reason was notebook computers, with LEDs enabling Apple to claim, for example, that its MACs would give eight hours of battery life vs. four hours for a Dell. Going into 2009, LEDs had penetrated 15% of the notebook market; this rose to 75% penetration by the end of the year, he noted.

Now, though, he predicts, undersupply will quickly switch to oversupply, with consequent declines in average selling prices (ASPs) ahead. This will last until about 2013, he believes, when solid-state lighting should be ready to move into major commercial and residential markets.

Dorsheimer gave a cautionary note about the most popular sapphire substrates for epitaxial deposition of LED cells. A shortage of sapphire will constrain the market, he believes, with prices rising some 50%, so he recommended that LED makers stock up now. A lot of the coming cost reduction in devices will come from moving from 2-in. to 4 in. and then 6-in. wafers. The larger substrates will have greater temperature stability across the wafer, increasing the number of in-spec die, even though yields might only be in the 5% range. An in-spec die might bring $0.20, a huge advantage over an off-spec die that might be worth only $0.000002, he explained.

The moderator, Griff Resor, president of Resor Associates, echoed the advantages of going to larger wafers. Since LED devices are much smaller than IC chips, there can be 20,000 of them on a 6-in. wafer, he pointed out.

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Key end-use applications driving HB-LED growth. Long term market-drivers: general illumination and automotive. (Source: Strategies in Light)

Megatrends driving toward LEDs’ third cycle — including the push for the energy saving of green technology and the steady improvement in LED performance along with cost reduction that could make them viable for wide-scale lighting — has attracted Dow Chemical’s Electronic Materials division. James Fahey, global general manager of growth technologies, identified a broad array of materials problems that could improve processing, device performance, and packaging for LEDs that will be addressed by Dow Chemical. While the processing is simpler than for semiconductors, where Dow Chemical has extensive experience, there still remain many unknowns, Fahey pointed out. But the market potential makes it attractive to tackle these problems and bring improved solutions to the market. The development times for SSL devices is shorter than for semiconductors, he pointed out, where research on a new device may start 10 years before it becomes a commercial product. Many of the LED players in Asia in particular are focused on speed-to-market as well as being very close to customers. Fortunately, R&D costs in LEDs are lower than for semiconductors, he added.

The key enabling technology for high-brightness LEDs is epitaxial growth, but the current state of the art leaves much to be desired, Fahey pointed out. Critical issues include poor wavelength uniformity, long cycle and growth times leading to low throughput, a lack of in-situ monitoring and process control, wafer bow problems, low source efficiency, and incomplete knowledge of growth chemistries and mechanisms.

Improvements and challenges

There is great potential for improvements all up and down the value chain, the speakers agreed, including packaging methods, tools and processes, and device technology. One major hurdle the industry faces is understanding and dealing with "droop" in commercial blue LEDs, which are used in all three methods for creating white light, explained Theodore D. Moustakas, director of the fast-growing Photonics Center at Boston University. At higher current densities, the external quantum efficiency of the devices falls off rapidly. The peak efficiency is at the very low injection level of 20 mA/cm2. Since the effect is related to the current density, larger chips are used for emitters with the same drive current. Finding a way around the droop phenomenon could offer the potential for greater lighting efficiency with smaller devices.

One problem, Professor Moustakas explained, is that there is still disagreement about the science behind the effect. It could be due to polarization effects, or it might be Auger recombination due to high carrier concentrations, creating excess holes and electrons. LED films are deposited on a variety of substrates, and research indicates that nucleation proceeds through the formation and coalescence of hexagonal domains. Threading dislocations through an active device form primarily at these domain boundaries, and this is where the charge leakage occurs.

Another issue in green LEDs is that when more indium is added to strengthen the emission at green wavelengths, the efficiency drops about 10%. If there is a shift from direct bandgap to indirect bandgap in a device, it could help explain a decline in efficiency. But in the case of InGaN green LEDs, the devices remain direct bandgap even when more indium is added, he said, so the cause of the efficiency decline is unclear.

He showed evidence that leakage is much less if ordered rather than random domains can be formed. While gallium and aluminum atoms have approximately the same diameters, nitrogen atoms are about 11% smaller. The threading defects are greater for AlGaN alloys than for GaN. One strategy being tried for ultraviolet LEDs, for example, is to grow devices on AlN substrates to get a more ordered domain structure and fewer dislocations. Another technique for green LEDs is to grow them on a textured GaN template, as shown in work published by Professor Moustakas and others in 2006, suppressing polarization effects and increasing light extraction efficiency.

Some companies pushing into LED production are in the semiconductor industry, such as Samsung and Micron, with related processes and similar tools. While the chip industry evolves using Roadmaps based on Moore’s Law, players in the SSL market instead look to an alternate guide called Haitz’s Law, according to Chuck DeMilo of Luminus, which states that every 10 years the light generated by an LED device increases 20×, which the cost per lumen falls by a factor of 10.

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Haitz’ Law: Logarithmic advancements.

Hundreds of reactors from silicon fabs are being converted to LED work in South Korea, DeMilo said. The complexities of the materials science behind LED production make the transition very tricky, however, suggested Dorsheimer of Canaccord Adams. In fact, he said, some empty fabs are being filled with completely new tools specifically designed for LED processing, though he agreed that many backend tools may be applicable.

Dorsheimer’s analysis showed that 60% of the cost of LED production is in the front-end, and 5%-10% yields are not uncommon. While 40% of the cost is in back-end processing, he said that yields there may be in the 75%-80% range, with the potential to be pushed up toward 95% with process improvements.

While companies coming out of the Univ. of California at Santa Barbara are trying GaN substrates to achieve non-polarized or semi-polarized device fabrication, the cost of these substrates is too high for most commercial markets, Dorsheimer said. He suggested that a 2 in. GaN substrate might cost $2000, and although he agreed higher-quality devices are possible, he is not sure this price will go down enough. If you could achieve 80% of the performance with a sapphire substrate, that may be OK for most markets, he suggested.

Professor Moustakas explained that by going to non-polarized fabrication, quantum wells can be made wider, and the belief of UCSB researchers is that particles can escape from QWs as they narrow at the top.

Alliances and collaboration are becoming much more common in the semiconductor industry, while the LED market has been racked by law suits over intellectual property, according to Dorsheimer. A settlement in 2002 brought five companies together with shared patent licensing agreements. DeMilo discussed how his company had developed a strategic partnership with Nichia in Japan, the largest maker of wafers and phosphors for LEDs. In fact, he explained, Luminus gets its wafers from Nichia, and deconstructs them to fabricate its own devices. Luminus uses a photonic lattice method developed at MIT to fabricate larger chips that can be used as single filaments in various types of lamps. This provides high extraction efficiency, and highly uniform central light, avoiding the shadowing effects created by lamps using multi-chip sources. The optics are also simpler for the big chip approach, DeMilo said.

About a third of the SEMI audience of 70 or so raised their hands when Griff Resor asked how many were already involved in the LED industry in some way. He said he was part of an LED special interest group had been formed by SEMI and commended the program committee for choosing it as a topic. Dorsheimer commented that Applied Materials is moving into this market, and is developing a hybrid-type process for hydride vapor phase epitaxy (HVPE) that might cut processing time for this approach. Molecular beam epitaxy (MBE) and metal organic chemical vapor deposition (MOCVD) also are used for LED film processes.

One member of the audience asked about the potential of organic LEDs (OLEDs) to challenge the nitride devices currently in the marketplace. The panel agreed that OLEDs were in a stage similar to conventional LEDs a decade ago. Dorsheimer suggested that they might fit into some handsets and backplane applications, but he feels they will probably only be a niche player in the market. Some key OLED patents are due to expire in 2017, he added.

More alliances and patent exchanges are likely as the LED industry moves toward its third round of robust growth, the panelists agreed, but the wide range of problems to be tackled will make it an attractive target for those now in the semiconductor processing markets. — B.H.

by Richard Dixon, iSuppli

March 11, 2010 – Back in February 2009, iSuppli’s MEMS and sensor team reported on trends in the automotive magnetic sensor market, and has since completed a comprehensive report on the whole market for silicon magnetic sensor elements and ICs — predominantly Hall, asymmetric magnetoresistive (AMR) and giant magnetoresistive (GMR) based devices. This article provides the cliff notes of our special report and briefly compares different technologies and highlights just some of the many applications for this very pervasive sensor.

Where do these sensors play? The fields are broad and include:

  • High-cost applications like industrial motors that require accurate knowledge of rotor position to control loads
  • Mid-priced automotive sensor ICs that measure rotation speed angle, and position
  • Low-cost consumer and mobile phone products

Because of this wide variety of uses and products, pricing for such sensor ranges from less than $0.10 for simple switches to $0.50 for automotive sensors like wheel speed sensing up to several US$ for sophisticated programmable sensor ICs used in automotive or industrial motor control.

By technology, Hall sensor elements and sensor ICs make up by far the largest part of this market. A smaller proportion of the market for silicon sensors is for AMR ICs targeting higher performance markets, while a very small fraction of the market is served by GMR sensor ICs and switches, which will emerge over the next four years. iSuppli has also examined tunneling magnetoresistive (TMR) sensors and MEMS magnetic switches, but today these devices respectively serve closed markets for read-write heads or niche medical.

Hall dominates a tough market space

Silicon devices have many competitors. In particular, the Hall sensor IC — a low-cost CMOS based device that benefits from high-volume batch processing, integration of electronics, and non-contact operation — must fight on price with established, low-cost incumbents including potentiometers, microswitches, and Reed switches, not to mention inductive and optical approaches. For certain applications such as steering wheel angle measurement (used for vehicle dynamics systems), the number of competing solutions can be five or more.

But silicon solutions, whether Hall effect or magnetoresistive, are increasingly taking market share from incumbent solutions which can no longer compete as the demands on performance grow — to reduce the emissions in cars, or to make smaller, highly-integrated sensors for the densely packaged PCBs of handsets. The more exotic 2-chip magnetoresistive, e.g. AMR and GMR (which can be single-chip) devices cost more than Hall mostly for processing reasons but perform better and find their way into applications where performance outweighs cost, particularly the automotive and industrial markets, for example.

Hall devices also extend their performance using various techniques that concentrate the magnetic field and allow more axes of measurement (simple Hall is only sensitive to the perpendicular magnetic field) such as with AMR. This has led to 3D joysticks that begin to serve manual (and automotive) transmissions for gear selection, or as an advanced PC mouse or gaming interface. Another trend is the use of linear Hall sensors to replace two or more (Hall or other) switches.

Hockey stick

Following a flat period in 2007 to 2008, the silicon magnetic sensor market is set to commence a period of strong growth in 2010 as demand surges from the automotive, industrial and consumer markets. As we reported in our last issue, 2008 and especially 2009 were very bad years for sensors, and the expected inflexion would have happened earlier — in 2009 — if it were not for the recession which afflicted many markets.

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Figure 1. Market by segment for magnetic sensors 2006 to 2013. (Source: iSuppli)

Global silicon magnetic sensor revenues are projected to reach US$1.36 billion in 2013, up from $821 million in 2009, a CAGR of 13%. This equates to slightly more than five billion magnetic sensor ICs and switches, up from about 2.8 billion units in 2009. So, what is driving the market in the next four years?

Generally, the fast pick-up in shipments that began in the second half of 2009 and will now accelerate in 2010 and 2011 is a result of the refilling of inventories as the demand comes back online in automotive — but also as consumer confidence grows and sales of all kinds of consumer goods recover and indeed grow overall, as predicted by iSuppli analysts. In fact, the magnetic sensor market only fell by -6% compared to the whole silicon industry, which was down by -12% overall, largely on the strength of the varied application supply base. Some applications are covered below.

Automotive applications drive sensor sales

Many sensors are needed in today’s cars, and many more will be required in the future. The body and powertrain segments show the greatest potential for new magnetic sensor penetration and will be important target markets for silicon sensors in the future. In the automotive body segment alone, the number of magnetic sensors and switches will grow from 6.7 on average in 2008 to 9.4 in 2013.

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Figure 2. Applications for magnetic sensors in today’s cars. (Source: iSuppli)

In engine management, emissions regulations require crankshaft and camshaft rotation speed sensors to be increasingly precise — and older technology such as inductive sensors will no longer make the grade. One reason is that such devices cannot measure position at zero rotation and need high speeds for precision. This is good news for Hall and AMR sensors, and even GMR in the future. Many other sensors are needed for position sensing of turbochargers, which will grow as engine downsizing gains in popularity, in addition to exhaust gas recirculation, electronic throttle position, etc.

Hall or other sensors are used to indicate the gear position at stop in a manual transmission. As transmissions become more sophisticated and the requirements of efficient operation grow, more sensors will be used for position and ration speed, not just in automatics.

In the body (cabin) domain there are over 35 applications and growing for sensors and switches, mainly Hall is competing with low-cost microswitches, Reed switches, and potentiometers. Brushless DC motors are a major user of sensors when loads need to be measured, i.e. in an electric window. Stop/start systems are another interesting application that is gaining in significance.

Consumer electronics and appliances

Major categories for magnetic sensors include:

  • Mobile phones
  • White goods (washing machines, dishwashers, refrigerators, coffee machines….)
  • Personal electronics (cameras, camcorders, MP3 players…)
  • Audio / video / gaming
  • Desktop and mobile PCs, external HDD, servers…

Inexpensive switches are needed to indicate when a washing machine or refrigerator door is shut, or a folding display in a phone, notebook, or digital camera is open to control the display and save power, or to adjust motors that help a deliver sharp, blur-free pictures.

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Figure 3. AMR sensors attach to the spray arm in a dishwasher to detect jamming.
(Source: Danby)

Linear sensors and switches are used to provide fluid levels in automatic coffee dispensers found commercially or in the home. Meanwhile, mobile phones use sensors to control the display in clap and sliding phones and in emerging camera autofocus systems for linear position. PCs are another huge source for magnetic sensors.

Cell phones are a key device for magnetic sensor ICs and switches, especially because of the overall size of the market. The abovementioned display control is augmented by emerging applications for camera phone dust-cover status switches, angular sensors to detect the angle of a swivel display phone, and linear sensors for auto-focus and zoom functionality. Generally these are very low-cost sensors in the single-digit $US cents range.

Electronic compass is a market hit in 2009

A major new product category emerged in 2009: the electronic compass for GPS-equipped handsets. Many new GPS enabled smartphones feature 3-axis silicon magnetometers in electronic compasses. Examples include the Apple iPhone 3GS, Nokia N97 and new N900, and recent Motorola Droid and Google Nexus 1 phones, to name a few.

This represents a significant magnetic sensor market driver in the coming years, especially as the performance demands drive high prices toward the same cost structure as high-end automotive sensors today. Interest in this market is of course high and new players like STMicroelectronics have recently jumped in through a partnership with Honeywell.

The pedestrian application requires heading measurement resolution of around 5°/s or lower, which is fine for Hall sensors (e.g. from market leader Asahi Kasei Microsystems today) but also down to 1°/s or better for LBS services using pointing devices. This has allowed companies supplying high performance AMR devices like Sensitec (supplies AMR die to MEMSIC) to enter the market in volume in 2009 to help serve these applications.

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Figure 4. An electronic compass aids an augmented reality program to display
information about scenes viewed through the mobile phone camera. (Courtesy LAYAR)

Industrial and medical applications

The industrial market is smaller (in units) than those for consumer, white goods, or automotive, but the components can command much higher prices — from several dollars up to $10 depending on resolution. This allows technologies like Reed, Hall, and also higher-performance AMR and GMR sensors to play. Often one AMR sensor can replace three Halls in a motor.

Major applications include industrial encoders and HVAC valve position sensing. Encoders convert rotary motion or position to a series of electronic pulses in a great variety of applications like computer numerically controlled (CNC) machines, robotics position and factory automation.

There are numerous brushless DC motors, and while not all require magnetic sensors to measure position of the rotor (as in this case there is only constant speed operation and no load changes), many use sensors where changing loads need to be monitored and managed.

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Figure 5. Endoscopic capsule that can be swallowed. (Courtesy Given Imaging)

Medical applications are highly varied but include defibrillators and pacemakers, hearing aids, prosthetic joints, smart pills, e.g. capsule endoscope, diagnostic or drug delivery fluid flow monitoring, syringe pumps (position or level) and general automation of lab equipment (e.g. electronic pipettes) to name just a few. Prices are again higher than the mass-market applications.

Supply chain

The vast majority of unit shipments of magnetic sensors are for low-cost switches used in consumer electronics and appliances, PCs and notebooks — areas dominated by companies like AKM and Allegro.

Asahi Kasei Microsystems in 2009 stole the top spot in magnetic sensor revenues from Allegro Microsystems thanks to its leadership in the fast-growing electronic compass market. AKM is also the largest supplier in the world of Hall elements, e.g. for PC fans and all kinds of small motors used for example in DVD spindles, although the company begins to move upstream by adding addition electronics to make Hall ICs for more advanced monitoring in motors. It has a very diverse product portfolio, with only a small proportion for automotive, which helped it safely navigate the recent downturn. Likewise, Allegro splits its sales between automotive and consumer commodity markets.

Other major magnetic sensor players include Micronas, Infineon, NXP, and Melexis, as well as emerging companies like MEMSIC, Sensitec, and austriamicrosystems. The first four companies have strong automotive focus, although Melexis also serves some cell phone suppliers with switches, for example. The latter three have more diverse portfolios — e.g., Sensitec is a die supplier and partners to supply automotive applications such as wheel speed and mobile phone compasses. Unlike the MEMS market, there is little foundry offering (X-Fab and Advanced Microsensors are prominent) and cooperation often takes place among the component suppliers.

Conclusion

Silicon sensors are outgunning competition from potentiometers, Reed switches and micro-switches by eliminating issues with wear, by incorporating electronics on-chip for more intelligence per area, on robustness, and on cost and size. Hall Effect sensors ICs and switches largely dominate the silicon magnetic sensor IC market, but increasingly, AMR and also GMR sensors are used for high-performance applications. Added to this, new applications opening up and the market perspectives for magnetic sensors look very attractive bright in future.

For more information, see iSuppli’s special report from 2H09: "Magnetic sensors heading for big times."


Richard Dixon received his doctorate in semiconductor characterization from Surrey University and degree in materials science from North Kent University, and is senior analyst for MEMS at iSuppli, Spiegelstr. 2, 81241 Munich Germany; ph +49-89-207-026-070, e-mail [email protected].

February 3, 2010 – Researchers at Rice U. have figured out a way to transfer patterns of carbon nanotubes from a substrate to any other surface in a single dry room-temperature step, and then reuse the substrate with intact catalyst particles to grow more.

The research, published in ACS Nano, started with first-year postgrad Cary Pint "playing around with water vapor" to clean up amorphous carbons on some single-walled carbon nanotubes (SWNT), and discovering that the nanotubes he was extracting stuck to the tweezers — this led to investigating how the process could transfer CNTs to other surfaces. In his work, CNTs are grown via chemical vapor deposition (CVD) and etched with a mix of hydrogen gas and water vapor to weaken the bonds formed with the metal catalyst. Once stamped, the CNTs lay down and adhere via van der Waals forces to the new surface, leaving all traces of the catalyst behind.


A potassium bromide window covered by a film of single-walled carbon nanotubes, transferred from the growth substrate, which serves as a template, at right. (Source: Rice U.)


Among the results of the work: a crisscross film of nanotubes made by stamping one set of lines onto a surface and then reusing the catalyst to grow more tubes and stamping them again over the first pattern at a 90-degree angle. The process took about 15 minutes.

Eventually Pint sees the technique, which he says can scaled up "easily," can be used to embed nanotube circuitry into electronic devices. Future steps for the process are to make highly efficient optical sensing devices, and look at doping techniques to enable more precise growth of metallic (conducting) or semiconducting SWNTs.

His own goal is to develop the process to make a range of highly efficient optical-sensing devices. He’s also investigating doping techniques that will take the guesswork out of growing metallic (conducting) or semiconducting SWNTs.

The paper also describes a process for quickly and easily termining the range of diameters in a batch of nanotubes grown through chemical vapor deposition, something many spectroscopic techniques can’t do for structures >2nm in diameter. "This is important since all of the properties of the nanotubes — electrical, thermal and mechanical — change with diameter," Pint said. The good news: the method involves a Fourier transform infrared (FTIR) spectrometer, which "nearly every university has …sitting around that can do these measurements," he added.

From the ACS Nano paper abstract:

Utilizing this transfer approach, anisotropic optical properties of the SWNT films are probed via polarized absorption, Raman, and photoluminescence spectroscopies. Using a simple model to describe optical transitions in the large SWNT species present in the aligned samples, polarized absorption data are demonstrated as an effective tool for accurate assignment of the diameter distribution from broad absorption features located in the infrared. This can be performed on either well-aligned samples or unaligned doped samples, allowing simple and rapid feedback of the SWNT diameter distribution that can be challenging and time-consuming to obtain in other optical methods. Furthermore, we discuss challenges in accurately characterizing alignment in structures of long versus short carbon nanotubes through optical techniques, where SWNT length makes a difference in the information obtained in such measurements. This work provides new insight to the efficient transfer and optical properties of an emerging class of long, large diameter SWNT species typically produced in the CVD process.

(February 1, 2010) CHICAGO — ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.

The assets disclose cost-efficient wafer-level semiconductor packaging techniques applicable to high-power and high-frequency applications, including LED, MEMS, and optical communications component packaging. Key technologies of this portfolio include high-current-carrying through-wafer interconnects (through-silicon via — TSV), which enable wafer-level surface mount (SMT) chip-size packaging (WLPCSP). WLPCSP can improve manufacturability by reducing costs, increase performance, enable reduced component size, and improve product scalability.

The patents also include a high-power/brightness LED packaging solution that offers excellent thermal performance in a highly manufacturable platform and MEMS packaging technology that features flux-less hermetic sealing on the wafer level with controlled internal package atmosphere. Several of the technologies included in this portfolio have been developed to the production phase and the related know-how is included.

“Hymite is pleased with the general acceptance of its unique technology in the market – major players in high speed communications, high-power LEDs and MEMS have already engaged Hymite on developing unique products,” stated Christian Tang-Jespersen, Hymite president and CEO.

To learn more about the patents available for sale in this portfolio, contact ICAP Ocean Tomo at (866) 779-8363 or at [email protected]. ICAP Ocean Tomo is the intellectual property brokerage division of ICAP, an interdealer broker and provider of post trade services. The Group matches buyers and sellers in the wholesale markets in interest rates, credit, commodities, foreign exchange, emerging markets, equities and equity derivatives through voice and electronic networks. ICAP is also the source of global market information and research for professionals in the international financial markets. For more information, visit www.icap.com.

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by Debra Vogler, senior technical editor, Solid State Technology

January 29, 2010 – Veeco Instruments Inc. launched its TurboDisc K465i gallium nitride (GaN) metal organic chemical vapor deposition (MOCVD) system for the production of high-brightness light-emitting diodes (HB-LEDs). Multiple customers at beta sites have already qualified the system for volume production, according to Jim Jenson, VP of Veeco’s MOCVD business unit. The company has also received orders for the system from multiple LED manufacturers throughout the Asia Pacific region. Though not able to discuss details of end-user production timetables, the company anticipates that most will be transitioning to mainstream production with the new tool in 2H10.

Based on Veeco’s K-Series platform, the new system is able to achieve LED yields approaching 90% in a 5nm bin. Key to the tool’s productivity is that maintenance is needed only after about every 200 wafer runs (one platen can hold multiple wafers, with the number dependent on the wafer size). Jenson noted that competitors’ tools typically require maintenance after 1-5 wafer runs. The reason for the difference in maintenance requirements is that the system generates very few particles; the flow flange stays clean because all the chemical reactions occur down near the wafer, not near the injector surface, he explained.

The company also reports a 25% improved wavelength uniformity and a 25% improved run-to-run wavelength uniformity, both of which are critical to high-volume LED manufacturers looking for high capital efficiency — referring to the number of good wafers per day for each capital dollar.

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Figure 1. K465i Uniform FlowFlange gas flow cross-section. (Source: Veeco Instruments)

The system’s uniformity and repeatability is due in large part to the design of the Uniform FlowFlange, which creates a uniform alkyl and hydride flow pattern across all wafers. Additionally, the simplified flange design enables quick tuning for process optimization on wafer sizes up to 8 inches.

The company is looking to increase its market share in the LED manufacturing equipment sector, taking advantage of an expected increase in demand for HB-LEDs in the coming years. It cites an August 2009 report, "High-Brightness LED Market Review and Forecast 2009," by research firm Strategies Unlimited, which forecasts the HB-LED market to grow from $5.1 billion in 2008 to $14.9 billion in 2013, representing a compound annual growth rate of 24%.

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Figure 2. Uniformity across the wafer carrier in the K465i with TurboDisc laminar flow. (Source: Veeco Instruments)

 

SWeNT gets grants for new CNTs


December 18, 2009

December 18, 2009 – Southwest Nanotechnologies Inc. (SWeNT) has received two grants from the Oklahoma Center for the Advancement of Science and Technology, to help develop new single-walled carbon nanotubes (CNT) with improved electrical conductivity and transparency.

Under one of the grants, coming through the Oklahoma Applied Research Support (OARS) program, SWeNT will develop materials targeted for use in CNT-printed electrodes for next-generation LED lighting applications that consume up to a third less power; other applications beyond LED lighting could include photovoltaics, supercapacitors, batteries, and displays, according to SWeNT CEO David Arthur. The grant amount was not disclosed, though OARS describes its program’s funding levels in two types: $10K-$45K (1-2 years) or $300K (1-3 years), 1:1 matched.

The other grant, pegged at about $60K, will bring in three undergraduate interns to help work on current projects at SWeNT.

"OCAST’s support for our employment of interns to assist us in new technology development will help us on the OARS activity as well as other research activities we have planned," Arthur said in a statement, adding that "SWeNT would not be a leading carbon nanotubes producer today without OCAST support."

November 20, 2009 – Things have picked up dramatically in the past few months, according to World Semiconductor Trade Statistics (WSTS) organization, which has doubled (and in some cases, tripled) its outlook for various chip industry segments in 2010.

Like other industry watchers, the WSTS now projects 2009 chip sales to be far better than expected just a few months ago: about an -11% decline from 2008, instead of fears of a >20% decline forecasted in the Spring outlook in June. Data for the US is particularly encouraging, suggesting just a -1% drop in annual chip sales, vs. the -15% expected just five months ago. "The organization believes that the industry has bottomed and momentum is now heading in a positive direction," the WSTS said in a statement.

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Growth will return nicely in 2010 at about 12% to about $247B, 18% higher than the July estimates, as all regions surge back into growth, led by the far largest region of Asia-Pacific which will swing to 13.5% growth from -53% in 2009.

The WSTS sees 9% growth in 2011 to $270B (also 18% higher than its Spring forecast), with all technology segments bunched up around that growth pace. The three-year compound growth from 2008-2011 is pegged at 2.8%, even including the disastrous past year.

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Often when a year’s forecast is improved, it’s because positivity was shifted from the following year so the pair balance out. Not so with the WSTS’ latest forecast — though it now sees growth in the teens for nearly every segment in 2010, it has kept its 2011 outlook generally unchanged, and even improved in a few sectors. Memory and opto, for instance, are both seen with >12% growth in 2011, better than July’s outlooks of around 8%. The 2011 outlook has been lowered but only slightly for discretes (7.5%, vs. 8.3% in earlier forecast), analog (8.1% vs. 8.3%), and micro (9.2% vs. 9.8%) and logic (7.3% vs. 8.7%) — though it’s worth noting that micro and logic together make up roughly half the industry.

November 2, 2009 – Integrated Sensing Systems Inc. (ISSYS ) is expanding its production capacity in the Ann Arbor, MI region, possibly including moving to a new facility and adding 40-50 workers over the next two years, according to a local report. The proposal comes as a result of a new $18.5M financing, led by Swiss sensor supplier Endress+Hauser Flowtec AG and New York-based manufacturer Greatbatch Inc.

The company plans to invest primarily in manufacturing capacity and product development, according to founder/CEO Nader Najafi, quoted by the paper; this would include either expanding its current facility in Ypsilati Township or possibly uprooting to bigger facilities, perhaps one in Ann Arbor’s research park formerly occupied by Tecumseh. Either way, "we need more capacity," Najafi told the paper. "We’re definitely going to use the capital within the next two, two-and-a-half years," he said, adding that the company expects to add 70-80 workers by 2012.

October 29, 2009 – Students from Japan’s Kyoto University have created a system that mimics the wah-wah tones of the armchair rock star’s shredding weapon of choice: the air guitar.

The system — which uses sensors to create guitar sounds based on moving hands as if playing the instrument — took top honors at a domestic MEMS competition ahead of the IEEE-NEMS event in China in January, where it will compete against teams from the US, China, Germany, Singapore, Taiwan, and Hong Kong, notes the Nikkei daily.

Two other teams from Japan are going as well — another Kyoto group that built a toy displaying different LED light patterns depending on its rotational speed, and a group from Shinshu U. with a device that lights up when sensing fluctuations in sounds and music, the paper notes.

October 27, 2009 – A Delaware bankruptcy court has approved the sale of Electroglas’ wafer probe assets, including name and trademarks, to private financial group EG Systems — formed specifically for this purpose — for an undisclosed amount. Most employees and management have moved over, led by new president/CEO Raj Kaul, who is also president/CEO of Kensington Labs, another semiconductor automation firm (acquired by Newport in 2001 and sold in 2005).

The company plans to continue to support Electroglas’ new wafer prober systems as well as its installed base of 16,500+ systems (300mm, 200mm, and legacy) with spares, upgrades, service, and application support. Refocusing on the customers will be the key to making Electroglas successful again, Kaul noted in a statement. "Foremost, we will be bringing the company’s focus back to concentrate on our worldwide customer base, which understandably was unclear during the turbulent financial times for the company and the industry in general," he said.

Formfactor bought the company’s motion-control business a few weeks ago.