Category Archives: Packaging

Printed electronics refers to a process in which printing technology is used to produce various kinds of electronics goods, such as electronic circuits, sensors and devices. Printed electronics is emerging as a technology that will replace traditional photolithography, which requires costly materials, complex processes and expensive equipment, for the production of simple circuits or electronics components. In addition, printing technology allows patterning a desired substance on a specific location without complex processes. 

According to the “Emerging Displays Report – Printed Electronics Technology – 2013” report, published by IHS, the applied market for printed electronics is forecast to gradually grow after 2015. The total applied market created by printed electronics technology is expected to grow at a compound annual growth rate (CAGR) of 47 percent to $24.3 billion by 2020 from $3.3 billion in 2013.

The global printed electronics market is expected to grow in sync with the opening of the flexible display market. Currently, the technology is commercially applied to touch panel sensors and FPCBs, which have relatively low entry barriers. With partial application to RFIDs, smart tags, LCDs and OLEDs, the technology will gradually expand its application to the fabrication of flexible displays and thin film photovoltaics.

Bruker Corporation today announced the appointment of Thomas Bachmann as the new president of its Bruker BioSpin Group. Bachmann most recently served as CEO of Tecan Group in Switzerland, a global provider of complex laboratory instrumentation and integrated liquid-handling workflow solutions for life science research and diagnostics.

The Bruker BioSpin Group is the global market and technology leader in analytical and preclinical magnetic resonance instrumentation, with major operations in Germany, Switzerland, France and the United States, as well as numerous applications and customer service centers around the world. The Bruker BioSpin Group operates in two divisions:

  • Magnetic Resonance Spectroscopy (MRS) division, consisting of the three business units nuclear magnetic resonance (NMR), electron paramagnetic resonance (EPR) and compact magnetic resonance (CMR)
  • Preclinical Imaging (PCI) division, consisting of the preclinical imaging product lines magnetic resonance imaging (MRI), magnetic particle imaging (MPI), X-ray micro-CT, as well as optical and PET/SPECT/CT molecular imaging.

“I am very pleased to welcome Thomas Bachmann to Bruker,” said Frank Laukien, Bruker’s president and CEO. “His life-science background and his broad management experience will allow him to lead our excellent BioSpin management team in order to further accelerate our innovation, profitable growth and operational excellence initiatives. Thomas will be a valuable addition for all of Bruker due to his diversified industrial experience, his global customer and operations exposure, and his successful track record.”

“I am delighted to join Bruker, and together with an experienced management team I look forward to further developing the Bruker BioSpin Group,” Bachmann said.

Thomas Bachmann brings over twenty-five years of global experience in sales and marketing, in leading and transforming complex businesses, as well as in strategy and business development to his new role as Bruker BioSpin Group President, including experience as a CEO of two publicly traded companies. From 2005 until 2012, Bachmann served as CEO of Tecan Group, where he increased operational effectiveness, expanded into new businesses, developed emerging markets, created a solid organization, established regulatory competence and compliance, grew profitability and built a strong balance sheet. From 2002 until 2004, he was CEO of the Arbonia-Forster Group’s Steel Systems Business, a global provider of building supplies. From 1985 until 2002, Bachmann served in various roles as global Sales and Marketing Director, Business Unit Director and Senior Vice President of Corporate Development at Rieter Holding, a global provider of textile machinery and plants, as well as an automotive supplier of acoustic- and thermal insulation systems. Bachmann holds a B.Sc. in Mechanical Engineering and an Executive MBA from IMD Business School in Switzerland.

Applied Materials, Inc. announced today that its board of directors has appointed Gary E. Dickerson as president and chief executive officer and Michael R. Splinter as executive chairman of the board of directors, effective September 1, 2013. Dickerson also was elected a member of the board of directors, effective at the same time. Dickerson is currently president of Applied Materials and succeeds Splinter who has served as the company’s CEO since 2003.

Applied Materials’ Mike Splinter (L) will become executive chairman of the Board of Directors and Gary Dickerson (R) will become president and CEO and a member of the board of directors, effective Sept. 1, 2013. Dickerson has served as president since June 2012 and was previously CEO of Varian Semiconductor Equipment Associates Inc., which was acquired by Applied Materials in 2011.  Splinter has been CEO since 2003.

"As president, Gary has proved to be an outstanding leader and partner, focusing Applied on new strategies for profitable growth through our unmatched strength in precision materials engineering," said Mike Splinter.  "I welcome him to the Board and have every confidence that his vision and personal drive will translate into remarkable success in leading Applied Materials as our next CEO."

"Today, Applied Materials enjoys a stronger foundation than ever before on which to build momentum for growth," said Gary Dickerson.  "We have better and broader technology, very deep talent and the passion to drive the materials innovation that will provide the device performance and yield solutions our customers need to advance and win.  Our opportunities have never been greater and I am grateful to Mike and the board for the privilege to lead Applied into a new era of growth and success."

A long-time industry leader, Gary Dickerson, 56, has a demonstrated track record of delivering growth in revenue and profits while achieving recognition for outstanding customer satisfaction and gaining market share. Dickerson served for seven years as CEO of Varian Semiconductor Equipment Associates, Inc. until its acquisition by Applied Materials in 2011 and spent 18 years at KLA-Tencor Corporation where he held a variety of operations and product development roles before serving as president and chief operating officer.  He earned a BS degree in Engineering Management from the University of Missouri, Rolla and an MBA from the University of Missouri, Kansas City.

Mike Splinter, 62, was named president and chief executive officer of Applied Materials and a member of its board of directors in 2003, and became chairman of the board in 2009. Splinter is a 40-year veteran of the semiconductor industry and has led Applied to record revenue and profits during his tenure as CEO. This fall, he will receive the Semiconductor Industry Association’s 2013 Robert N. Noyce Award for his outstanding achievements and leadership in support of the semiconductor industry.

Read more: Applied Materials CEO receives 2013 SIA Robert N. Noyce Award

The market for semiconductors used in industrial electronics applications relished a better-than-expected first quarter as macroeconomic headwinds turned out to be less severe than initially feared, according to the latest Industrial Electronics report from information and analytics provider IHS.

Worldwide industrial electronics chip revenue in the first quarter reached $7.71 billion, up 1 percent from $7.63 billion in the final quarter of 2012. Although the uptick seemed modest, the increase marked a turnaround from the three percent decline in the fourth quarter. It also represents a major improvement compared to the 3 percent contraction of the market a year ago in the first quarter of 2011, as shown in the figure below.

 

“The industrial semiconductor market’s performance was encouraging, especially in light of continuing global economic uncertainty and the seasonal nature of the market, which typically sees slower movement in the first quarter of every year,” said Robbie Galoso, principal analyst for electronics at IHS. “Some large segments of the industry, particularly avionics and oil and gas process-automation equipment, saw muscular double-digit gains, helping to drive up overall revenue.”

In another positive development, several large industrial semiconductor suppliers also reported very lean inventories because of strong orders from customers. Infineon Technologies of Germany, Analog Devices of Massachusetts, and Dallas-based Texas Instruments all posted a sequential decline in industrial chip stockpiles as their days of inventory (DOI) measure fell well below average. Infineon achieved higher sales from increased volume in isolated-gate bipolar transistor (IGBT) chips; Analog Devices was strong in factory automation and medical instrumentation; and Texas Instruments saw growth in its analog products.

Other companies reporting sound increases during the period were Xilinx of California for its test and measurement, military aerospace and medical product lines; and Microsemi, also from California, which likewise enjoyed expansion in medical electronics along with broad-based growth for the period.

Europe’s woes inhibit industry, but China counters with growth

However, the industry was not without its challenges, with the Eurozone crisis causing the most havoc.

Read more: Regional developments to affect the growth of semiconductor industry

“The financial troubles on the continent, particularly in Greece, Italy and Spain, had the effect of stifling growth as a whole, especially in the commercial market for building and home control,” Galoso said. “As a result, the individual sectors for lighting, security, climate control and medical imaging were deleteriously impacted in the first quarter, compared to positive performance for those areas in the fourth quarter of 2012.

In contrast to Europe’s woes was China, which displayed growth momentum and much-improved demand across a number of industrial end markets. Manufacturers like Siemens of Germany, Philips of the Netherlands, Swiss-based ABB and Schneider Electric of France said their first-quarter sales in China improved from the earlier quarter.

In the rare earth industrial sector, however, China’s hold on the market loosened as rare earth prices started going south this year. China had a more than 90 percent monopoly on rare earth elements in the past, but new sources in Australia, the United States, Brazil, Canada and South Africa have opened up the market, decreasing dependence on China.

Products that incorporate rare earth materials include wind turbines, rechargeable batteries for electric vehicles and defense applications, including jet-fighter engines, missile guidance systems, and space satellites and communications systems.

Aerospace flies high; oil and gas equipment is also a winner

The military and civil aerospace market had the most robust performance among all industrial semiconductor segments in the first quarter. Avionics was especially vigorous, driven by commercial aircraft sales from pan-European entity EADS Airbus and U.S. maker Boeing, up 9 percent and 14 percent, respectively, on the quarter.

The oil and gas exploration market also saw solid revenue growth, with strong subsea systems and drilling equipment driving sales for ABB, Honeywell and GE.

In contrast to those high-performing segments, lackluster sales were reported in the markets for building and home control, for energy generation and distribution, and for test and measurement. One other market, manufacturing and process automation, reported stable growth, even though its sector for motor drives remained in negative territory.

The Storage Products Business Unit of Toshiba is pleased to announce that its solid state hybrid drive (SSHD) series has been honored with a Best of Show Award at this year’s Flash Memory Summit. The award, which recognizes excellence in innovation and flash memory consumer applications, was presented at the 8th Annual Flash Memory Summit at the Santa Clara Convention Center.

Read more: Micron 16nm NAND wins Flash Memory Summit Best of Show Award

Toshiba’s MQ01ABFH and MQ01ABDH SSHD series is equipped with Toshiba’s NAND flash and available in capacities ranging from 320GB to 1TB and in 7mm and 9.5mm form factors. The series continues Toshiba’s legacy of providing world-class storage products, and offers customers a complete lineup of 2.5-inch solid state hybrid drives for ultrathin, thin and light notebook PCs, multimedia and gaming applications, and traditional laptop PCs.

Flash memory is being used today in ways that raise the bar of innovation when coupled with hard drive technology to create hybrid storage solutions addressing applications which require accelerated performance and high capacity,” said Jay Kramer, Chairman of the Awards Program and President of Network Storage Advisors Inc. “We are proud to select Toshiba Solid State Hybrid Drive for the Best of Show Award based on bringing to market the innovation of ‘self-learning’ caching algorithms that learn the system user’s data access patterns to optimize performance and manage how user data is stored to the NAND Flash for quick response and integrated to the high capacity hard drive storage for the best of both worlds.”

“Toshiba’s SSHD series reflects our continued devotion to create innovative storage technology,” said Don Jeanette, director of product marketing at Toshiba Storage Products Business Unit. “Flash Memory Summit is one of the leading events in the storage industry, and Toshiba is honored to receive such recognition.”

Flexible thin film solar cells that can be produced by roll-to-roll manufacturing are a highly promising route to cheap solar electricity. Now scientists from Empa, the Swiss Federal Laboratories for Materials Science and Technology, have made significant progress in paving the way for the industrialization of flexible, light-weight and low-cost cadmium telluride (CdTe) solar cells on metal foils. They succeeded in increasing their efficiency from below eight to 11.5 percent by doping the cells with copper, as they report in the current issue of “Nature Communications.”

In order to make solar energy widely affordable scientists and engineers all over the world are looking for low-cost production technologies. Flexible thin film solar cells have a huge potential in this regard because they require only a minimum amount of materials and can be manufactured in large quantities by roll-to-roll processing. One such technology relies on cadmium telluride (CdTe) to convert sunlight into electricity. With a current market share that is second only to silicon-based solar cells CdTe cells already today are cheapest in terms of production costs. Grown mainly on rigid glass plates, these so-called superstrate cells have, however, one drawback: they require a transparent supporting material that lets sunlight pass through to reach the light-harvesting CdTe layer, thus limiting the choice of carriers to transparent materials.

The inversion of the solar cell’s multi-layer structure – the so-called substrate configuration – would allow further cost-cuttings by using flexible foils made of, say, metal as supporting material. Sunlight now enters the cell from the other side, without having to pass through the supporting substrate. The problem, though, is that CdTe cells in substrate configuration on metal foil thus far exhibited infamously low efficiencies well below eight percent – a modest comparison to the recently reported record efficiency of 19.6 percent for a lab-scale superstrate CdTe cell on glass. (Commercially available CdTe superstrate modules reach efficiencies of between 11 and 12 percent.)

Copper doping for solar cells

One way to increase the low energy conversion efficiency of substrate CdTe cells is p-type doping of the semiconductor layer with minute amounts of metals such as copper (Cu). This would lead to an increase in the density of “holes” (positive charge carriers) as well as their lifetimes, and thus result in a high photovoltaic power, the amount of sunlight that is turned into electrical energy. A perfect idea – if CdTe weren’t so notoriously hard to dope. “People have tried to dope CdTe cells in substrate configuration before but failed time and again,” explains Ayodhya Nath Tiwari, head of Empa’s laboratory for Thin Films and Photovoltaics.

His team decided to try nonetheless using high-vacuum Cu evaporation onto the CdTe layer with a subsequent heat treatment to allow the Cu atoms to penetrate into the CdTe. They soon realized that the amount of Cu had to be painstakingly controlled: if they used too little, the efficiency wouldn’t improve much; the very same happened if they “over-doped.”

The electronic properties improved significantly, however, when Lukas Kranz, a PhD student in Tiwari’s lab, together with Christina Gretener and Julian Perrenoud fine-tuned the amount of Cu evaporation so that a mono-atomic layer of Cu would be deposited on the CdTe.

“Efficiencies increased dramatically, from just under one percent to above 12,” says Kranz. Their best value was 13.6 percent for a CdTe cell grown on glass; on metal foils Tiwari’s team reached efficiencies up to 11.5 percent.

Increasingly ambitious targets: hitting the 20 percent ceiling

For now, the highest efficiencies of flexible CdTe solar cells on metal foil are still somewhat lower than those of flexible solar cells in superstrate configuration on a special (and expensive) transparent polyimide foil, developed by Tiwari’s team in 2011. But, says co-author Stephan Buecheler, a group leader in the lab: “Our results indicate that the substrate configuration technology has a great potential for improving the efficiency even further in the future.” Their short-term goal is to reach 15 percent.

“But I’m convinced that the material has the potential for efficiencies exceeding 20 percent.”

The next steps will focus on decreasing the thickness of the so-called window layer above the CdTe, including the electrical front contact. This would reduce light absorption and, therefore, allow more sunlight to be harvested by the CdTe layer.

“Cutting the optical losses” is how Tiwari calls it.

The study was supported by the Swiss National Science Foundation (SNSF) and the Competence Center Energy and Mobility of the ETH Domain (CCEM-Dursol).

Jon Peddie Research (JPR) announced estimated graphics chip shipments and suppliers’ market share for 2013 2Q.

While the news was disappointing year-to-year, the news was encouraging quarter-to-quarter.

AMD overall unit shipments increased 10.9 percent, quarter-to-quarter, Intel increased 6.2 percent, and Nvidia decreased by 8 percent.

Read more: In first quarter, Nvidia is clear winner but bad news for Intel

The overall PC market declined 2.5 percent quarter-to-quarter while the graphics market increased 4.6 percent. Overall this net 7.1 percent increase reflects an interest on the part of consumers for double-attach—the adding of a discrete GPU to a system with integrated processor graphics, and to a lesser extent dual AIBs in performance desktop machines.

On a year-to-year basis we found that total graphics shipments during Q2’13 dropped 6.8 percent while PC shipments which declined by at a faster rate of 11.2 percent overall. GPUs are traditionally a leading indicator of the market, since a GPU goes into every system before it is shipped and most of the PC vendors are guiding down to flat for Q3’13.

The popularity of tablets and the persistent economic slowness are the most often mentioned reasons for the decline in the PC market and the CAGR for PC graphics from 2012 to 2016 is -1.4 percent; JPR expects the total shipments of graphics chips in 2016 to be 319 million units.

JPR’s findings include discrete and integrated graphics (CPU and chipset) for Desktops, Notebooks (and Netbooks), and PC-based commercial (i.e., POS) and industrial/scientific and embedded. This report does not include handhelds (i.e., mobile phones), x86 Servers or ARM-based Tablets (i.e. iPad and Android-based Tablets), Smartbooks, or ARM-based Servers. It does include x86-based tablets.

The quarter in review:

  • AMD’s shipments of desktop heterogeneous GPU/CPUs, i.e., APUs declined 9.6 percent from Q1 and increased an astounding 47.1 percent in notebooks. The company’s overall PC graphics shipments increased 10.9 percent.
  • Intel’s desktop processor-graphics EPG shipments decreased from last quarter by 1.4 percent, and Notebooks increased by 12.13 percent. The company’s overall PC graphics shipments increased 6.2 percent.
  • Nvidia’s desktop discrete shipments were down 8.9 percent from last quarter; and, the company’s mobile discrete shipments decreased 7.1 percent. The company’s overall PC graphics shipments declined 8.0 percent.
  • Year-to-year this quarter AMD overall PC shipments declined 15.8 percent, Intel dropped 12.9 percent, Nvidia declined 5.1 percent, and VIA fell 12.4 percent from last year.
  • Total discrete GPUs (desktop and notebook) were down 5.5 percent from the last quarter and were down 5.2 percent from last year for the same quarter due to the same problems plaguing the overall PC industry. Overall the trend for discrete GPUs is up with a CAGR to 2016 of -2.2 percent.
  • Ninety nine percent of Intel’s non-server processors have graphics, and over 67 percent of AMD’s non-server processors contain integrated graphics; AMD still ships IGPs.

Year-to-year for the quarter the graphics market decreased. Shipments were down 16.1 million units from this quarter last year.

Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.

 Samsung V-NAND SSD

Read more: Samsung starts mass producing industry’s first 3D vertical NAND flash

“By applying our 3D V-NAND – which has overcome the formidable hurdle of scaling beyond the 10-nanometer (nm) class, Samsung is providing its global customers with high density and exceptional reliability, as well as an over 20 percent performance increase and an over 40 percent improvement in power consumption,” said E.S. Jung, executive vice president, semiconductor R&D center at Samsung Electronics and a keynote speaker at the Flash Memory Summit. “As we pioneer a new era of memory technology, we will continue to introduce differentiated green memory products and solutions for the server, mobile and PC markets to help reduce energy waste and to create greater shared value in the enterprise and for consumers.”

Read more: SSD market scores big in Q1

Samsung’s V-NAND SSD comes in 960 gigabyte (GB) and 480GB versions. The 960GB version boasts the highest level of performance, offering more than 20 percent increase in sequential and random write speeds by utilizing 64 dies of MLC 3D V-NAND flash, each offering 128 gigabits (Gb) of storage, with a six-gigabit-per-second SATA interface controller. The new V-NAND SSD also offers 35K program erase cycles and is available in a 2.5 inch form factor with x, y and z-heights of 10cm, 7cm and 7mm, which provides server manufacturers with more design flexibility and scalability.

Samsung’s proprietary 3D V-NAND technology achieves manufacturing productivity improvements over twice that of 20nm-class planar NAND flash, by using cylinder-shaped 3D Charge Trap Flash cell structures and vertical interconnect process technology to link the 24 layers comprising the 3D cell array. During his keynote remarks, EVP E.S. Jung emphasized that “The 3D V-NAND will drive disruptive innovation that can be compared to a Digital Big Bang in the global IT industry, and contribute to much more significant growth in the memory market.”

Samsung will continue to introduce next-generation V-NAND products with enhanced performance to meet diverse customer needs for NAND flash-based storage. These customer focuses will range from large data centers that can realize higher investment potential based on greater performance and energy efficiency to PC applications that place a high priority on cost-effectiveness and high density, further strengthening Samsung’s business competitiveness.

Samsung said it began producing its new V-NAND SSDs earlier this month.

Read more: How Samsung is climbing the charts

Primoceler, a microfabrication company specializing in laser micro welding and scribing of transparent materials, has developed the first sapphire-to-sapphire welding process.

“At Primoceler, we constantly expand technological boundaries,” said Ville Hevonkorpi, Primoceler’s managing director. “We were the first to weld glass to glass, glass to silicon and now sapphire to sapphire. Sapphire-to-sapphire welding is even more difficult than glass-to-glass welding, and no one has been able to do it before.”

Sapphire’s cost-effectiveness, durability, high melting point, chemical inertness, transparency and capacity for optical transmission in visible, ultra-violet and near-infrared light make it a highly desirable material in several industries. For example, because of the material’s resistance to heat and chemical erosion, sapphire substrates are currently used in the manufacturing of many LEDs for mobile handsets, televisions, automobile headlights and general lighting. “Now that we have developed this totally new technology, we’re anticipating that it will open new possibilities for industries, just as our glass-glass welding technology did,” said Hevonkorpi.

Hevonkorpi was referring to one of Primoceler’s previous innovations, a laser micro welding methodology that produced an extremely small heat-affected zone (HAZ), expanding the potential for packaging fragile components, including under or inside glass, which had been a challenge for manufacturers. “We recently learned the benefits of glass to welding glass in medical devices,” he continued. “As glass is transparent to infrared light and radio frequency waves, it makes new kind of implants possible. Also glass is highly bio-compatible and so better for patients.”

Sapphire has also yielded a great deal of benefits for medical devices. As an optical material, its durability is second only to diamond, which, in addition to the fact that it is chemically inert and non-thrombogenic (will not cause blood clots), makes it an excellent material for surgical tools, implants, braces as well as endoscopes and laser windows.

“Sapphire is widely used in sensors, different types of lenses and other devices, so there is a range of potential for this new technology,” said Hevonkorpi. “Companies that use sapphire for their products will come to us with ideas of how sapphire-to-sapphire welding technology can benefit them. We always welcome customers to challenge us and test their products.”

The machine that Primoceler developed for the new process is somewhat similar to the laser-based welding machine previously created to produce a small HAZ. The new machine contains a fiber laser unit specially optimized for the welding process by Corelase and also features software and components developed in-house.

Worldwide microprocessor sales are on pace to reach a record-high $61.0 billion in 2013 mostly due to strong demand for tablet computers and cellphones that connect to the Internet, but the ongoing slump in standard personal computers-including notebook PCs-is once again dragging down overall MPU growth this year.  Total microprocessor sales are now expected to increase eight percent in 2013 after rising just two percent in 2012, according to a new forecast in IC Insights’ Mid-Year Update of The McClean Report 2013.

IC Insights’ mid-year forecast trims the marketshare of x86 microprocessors primarily sold by Intel and rival Advanced Micro Devices for PCs and servers to 56 percent  of total MPU sales in 2013 compared to the previous estimate of 58 percent.  Figure 1 shows embedded microprocessors are now expected to account for 11 percent of MPU sales in 2013 (versus nine percent previously), while tablet processors are projected to be six percent of the total (compared to five percent in the original January forecast).  The new forecast keeps cellphone application processors at 26 percent of total MPU sales in 2013 but lowers the marketshare of non-x86 central processing units (CPUs) in computers outside of tablets to one percent (from two percent previously).

The proliferation of multimedia cellphones and the surge in popularity of touch-screen tablet computers are fueling strong double-digit growth rates of MPU sales and unit shipments in these two systems categories. The vast majority of these systems are built with mobile processors based on 32-bit CPU architectures licensed from ARM in the U.K.  Many MPU suppliers serve smartphone and tablet applications with the same processor platform design.   The falloff in standard PC shipments is a major problem for Intel and AMD since they have supplied more than 95 percent of the x86-based MPUs used in personal computers since the 1980s.

Read more: Qualcomm and Samsung pass AMD in MPU ranking

The new mid-year forecast raises tablet processor sales in 2013 to nearly $3.5 billion, which is a 54 percent increase from $2.3 billion in 2012.  Cellphone application processor sales are now expected to grow 30 percent in 2013 to $16.1 billion from $12.4 billion in 2012.  At the start of this year, sales of mobile processors in tablet computers and cellphones were forecast to grow 50 percent and 28 percent, respectively.  Stronger unit shipment growth in mobile processors has lifted the revenue forecast in these MPU market segments.

 mpu sales

 Figure 1

Meanwhile, the larger market segment of MPUs used in PCs, servers, and embedded-microprocessor applications continues to contract, albeit at a slower rate than in 2012.  The mid-year forecast shows sales of MPUs in PCs, servers, large computers, and embedded applications slipping by one percent to $41.4 billion in 2013 from $41.9 billion in 2012, when revenues dropped  six percent.  This large MPU market segment was previously forecast to rebound with sales increasing five percent, but the anticipated bounce back has been blocked by weak shipments of standard PCs, which IC Insights believes will fall by five percent in 2013 to 327 million systems.

While the mid-year outlook lowers total MPU revenues in 2013, it slightly increases the growth in microprocessor unit shipments to 10 percent this year from a projection of nine percent in the January forecast.  Total MPU shipments are now expected to reach 2.15 billion devices in 2013, with tablet processors growing 62 percent to 190 million units and cellphone application processors increasing 11 percent to 1.50 billion this year.  IC Insights’ microprocessor category does not include cellular radio-frequency baseband processors or stand-alone graphics processing units (GPUs), which are counted in the special-purpose logic/MPR category of the IC market.