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June 22, 2012 — SEMICON West is taking place July 10-12 at the Moscone Center in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.

Automated temporary bonding/debonding system

The EVG850 TB/DB XT Frame from EV Group is an automated temporary bonding and debonding system for thin wafer handling, configured to address high-volume 3D IC and TSV manufacturing. The system temporarily bonds a device wafer to a rigid carrier wafer for safe and efficient processing of the device wafer. After subsequent processing (back thinning, lithography, metallization, etching, through via processing, etc.), the device wafer is debonded from the carrier substrate using various techniques dependent of the intermediate material. The system can be configured for LowTemp debonding methods like ZoneBOND technology with the required EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules. A thermal-activated, mechanical slide-off is utilized for thermo-plast materials, while UV-exposure and lift-off debond is utilized for UV-activated tapes. It accommodates up to 9 process modules and boasts a continuous-mode operation with an ultra-fast handling system, up to 4 FOUP load ports, a material buffer in the form of a local FOUP storage system holding up to 10 additional FOUPs, and in-line metrology module option. EV Group, South Hall, Booth 719.

Electrochemical deposition tool

TEL NEXX’s new plating tool, Stratus Thunder, is used for electrochemical deposition of TSV, middle and interposer, lead-free, copper pillar, and RDL advanced packaging materials. Stratus Thunder features a low-cost vertical plating architecture and additional features improve its productivity by up to 50%. TEL, South Hall, Booth 1531.

Spray coater

The MAX-800 is a large format, high speed X-Y-Z spray coating system designed for the thin, uniform application of a variety of coatings and suspensions used in semiconductor packaging, display manufacturing, fuel cell manufacturing and medical device manufacturing applications.  The system features USI

June 22, 2012 — North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI. 

The three-month average of worldwide bookings in May 2012, $1.61 billion, crept 0.6% above the final April 2012 level of $1.60 billion. May 2012 saw <1% decline year-over-year, down 0.7% from May 2011’s $1.62 billion in orders.

The three-month average of worldwide billings in May 2012, $1.54 billion, grew 5.3% over the final April 2012 level of $1.46 billion. May 2012 billings fell 8.0% from May 2011’s billings of $1.67 billion.

Chipmakers are adding capacity and process technologies to meet demand for chips in mobile applications — namely smart phones and tablets, said Denny McGuirk, president and CEO at SEMI. "Bookings a re at the highest levels since May 2011 and this is the fourth consecutive month that new orders have outpaced billings."

Table. The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings (3-mo. avg)

Bookings (3-mo.

avg)

Book-to-bill ratio

 

 

 

 

Dec 2011

1,300.0

1,102.9

0.85

Jan 2012

1,239.9

1,187.5

0.96

Feb 2012

1,322.8

1,336.9

1.01

March 2012

1,287.6

1,445.7

1.12

April 2012 (final)

1,458.7

1,602.8

1.10

May 2012 (prelim)

1,536.0

1,611.9

1.05

Source: SEMI June 2012

A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Also read: Semiconductor fab tool makers see sequential increase in Q1

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS).

SEMI is a global industry association serving the nano- and micro-electronic manufacturing supply chains. For more information, visit www.semi.org.

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June 21, 2012 – PRNewswire — Metrology system supplier MicroSense LLC reports an increase in orders for its magnetoresistive random access memory (MRAM) magnetic metrology systems. The metrology tools characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.

MicroSense offers a new 300mm Polar Kerr (out-of-plane) MRAM metrology system, the KerrMapper (in-plane) tool and Vibrating Sample Magnetometers (VSM) for MRAM makers. The 300mm full-wafer non-contact magnetic metrology systems can be used for process control on perpendicular and in-plane MRAM.

Also read: Micron begins STT-MRAM dev partnership at A*STAR

While MicroSense shipped a number of gen-1 MRAM metrology tools since 2004, the MRAM industry did not scale up to high volumes until the development of  spin transfer torque MRAM (STT-MRAM), said Tom McNabb, president and COO of MicroSense. STT-MRAM’s ascent has resulted in a number of new MRAM tool orders for MicroSense, he said.

MicroSense is a leading manufacturer of magnetic metrology tools and Vibrating Sample Magnetometers (VSM), which are utilized in high-resolution metrology applications, such as hard disk drive disks & read/write head wafers, semiconductor wafers, and fundamental magnetic material characterization. MicroSense just acquired SigmaTech in June 2012. Learn more at www.microsense.net.

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June 20, 2012 — PLANSEE has developed a pressed-sintered tungsten crucible with an ultra-smooth surface to avoid sapphire ingot or crucible damage in the Kyropoulos method.

When the sapphire crystal is extracted from the crucible, surface adherence can result in cracks or faults in the crystal, as well as damage to the crucible walls. Easier extraction results in higher-quality, higher-yield sapphire ingots for light-emitting diode (LED) wafers. It also enables longer crucible lifetimes.

PLANSEE developed the fully automated crucible manufacturing process with precise control over the material properties of refractory metals. The pressed-sintered tungsten crucible has surface roughness of less than 0.8µm. The smooth surface is less susceptible to corrosion caused by the aggressive melted sapphire, in addition to preventing sapphire cracks and damage.

The tungsten crucible from PLANSEE is high-density, 93%, to retain its shape in high temperatures and rapid temperature changes. PLANSEE tunes the sintering process for the crucibles at very high temperatures and under a uniform temperature distribution to increase density with an extremely homogeneous density distribution.

The crucibles are manufactured in ultra-clean environments and materials supplied in-house to prevent contaminants — iron, titanium, chromium, etc — that can transfer to the sapphire wafers. Purity is in excess of 99.97 %.

Crucibles can be made for 35 to 100kg sapphire ingots, and PLANSEE is process-ready for 200kg sapphire production.

Plansee provides molybdenum, tungsten, tantalum, niobium and chromium products for electronics manufacturing. Learn more at www.plansee.com.

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June 20, 2012 — Mitutoyo America Corporation launched the Surftest SJ-411/412 portable surface roughness tester, conforming to roughness standards JIS-B0601-2001, JIS-B0601-1994, JIS-B0601-1982, VDA, ISO-1997 and ANSI.

Also read: Eliminating micro-cracks, crystal dislocations with single-wafer surface conditioning

The instrument includes a 5.7" color LCD touchscreen display. After measurement is performed, a waveform with scale and ruler options is displayed for detailed analysis. The presentation corresponds to cissoidal calculations whereby one measurement can evaluate two different conditions. A simple contour analysis function is included (4 types: step, step amount, area and coordinate difference). In addition, a digital adjustment tilting (DAT) function is included for work piece leveling.

A manual column stand works with three new optional accessories (auto set unit, tilting adjustment unit and X-axis adjustment unit) to assist in setup and to enhance operability.

The Surftest SJ-411/412 enables statistic measurements of up to 3 parameters each for as many as 300 samples providing average, standard deviation, max, min, pass rate and histogram. Up to 10 measurement conditions and the stored data can be called up, displayed and printed using a built-in thermal printer. Also, the SJ-411/412 can store up to 10 measuring conditions in its on-board memory.

The system supports a micro-SD card (option) for storage of up to 10,000 text data, 500 measuring conditions, 1000 measuring data, 500 images (BMP), 500 statistic data or auto-save up to the last 10 measuring data. Total and sectional measurement results can be displayed in addition to evaluation and BAC/ADC curves.

The SJ-411/412 includes 16 selectable languages. A maximum of 5 custom styli can be recorded and calibrated independently.

The tool provides SPC output; RS-232C and external SW connectivity is also supported while available Mitutoyo software packages enable integration into high-level network environments for enterprise-wide functionality. Security is managed via a password lock.

Mitutoyo Corporation provides measurement and inspection solutions. Internet: www.mitutoyo.com

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Driven by the volume consumer business, the maturing MEMS sector starts to look at ways to reduce costs and speed time to market by coming together on things like easing integration, common test methods, and tool replacement parts. Fast-moving high-volume markets may also drive MEMS makers toward paring down the vast diversity of  processes and packages used, and into more collaboration on a mature ecosystem.

June 19, 2012 — The micro electro mechanical systems (MEMS) sector is poised for a multiyear period of steady double digit growth, with 20% average annual increases in unit demand, as systems makers find ever more uses for low cost, easy-to-integrate silicon sensors and actuators, reports Jean Christophe Eloy, founder and CEO of Yole Développement.  That means that even with steady price declines, the MEMS market will double, to reach $21 billion by 2017.  Volume consumer markets are driving much of this growth, as consumer applications accounted for more than 50% of total MEMS industry revenue in 2011.  “But growth will depend in part on how well MEMS makers manage to make these devices easier to use,” he notes. “A strong collective push will be needed to create a MEMS ecosystem to simplify the integration of MEMS into larger modules and systems, enabling non-specialists to use them without a steep learning curve.”

Measuring the same things in the same way

In another sign of the growing maturity of the MEMS industry, there’s been some real progress on agreement on measuring the same things in the same ways, to be able to compare results and agree on dimensional and property specifications. 

The US National Institute of Standards and Technology (NIST) is working with the MEMS community towards standard measurement methods for eight key parameters, to allow validation of in-house measurements, and enable meaningful comparisons of parameters measured by different tools, different labs, or different companies, to ease characterizing and trouble-shooting processes, calibrating instruments, and communicating among partners.

NIST will start to offer MEMS test chips with cantilevers, fixed-fixed beams, and structures for measuring step height, in-plane length and thickness, with reference data for parameters such as Young’s modulus, residual strain, strain gradient, step height and in-plane length and thickness measured on these structures by NIST, using SEMI and ASTM standard test methods, the consensus best practices developed by industry committees at these organizations.  Companies can then validate their own measurements on these chips against those made by NIST, supported by a user guide, the data analysis sheets for each measurement, a MEMS parameter calculator and additional information accessible online via the NIST Data Gateway (http://srdata.nist.gov/gateway/) with the keyword “MEMS Calculator”. 

At least one inspection and metrology equipment supplier is considering supplying the test chips and including software to automate running of the standard tests with its tools.

“We want to work with the MEMS community to facilitate widespread adoption and consistent usage of these standard test methods, and to make the reference materials available to as many people as possible,” says Janet Cassard, electronics engineer in NIST’s Semiconductor and Dimensional Metrology Division, who will explain these tools at the MEMS session at SEMICON West. “Developing the best practices and reference materials are typically prohibitively expensive for a single company to invest in on its own.”

The reference materials measure Young’s modulus, residual stress and stress gradient using the method in SEMI MS4, step height and thickness with SEMI MS2, residual strain with ASTM E 2245, strain gradient with ASTM E 2246, and in-plane length with ASTM E 2244. One test chip covers  material and dimensional properties for a composite oxide layer fabricated in a multi-user 1.5 µm CMOS process followed by a bulk-micromachining etch.  The other uses a polysilicon layer fabricated in a polysilicon multi-user surface-micromachining MEMS process with a backside etch. 

Maturing industry may move towards more commonality

Consumer markets, with their fast product iterations and price pressures, may be driving MEMS makers towards more common platforms and consistent package families to speed time to market and reduce costs.  “The high cost of packaging and test is a big challenge for the industry,” notes Micralyne director of strategic technology Peter Hrudey. “So we, as a MEMS community, should be starting the discussion about ways to increase commonality.”  He suggests the best near term possibility could be cooperative co-funding of research for base technology for emerging market needs. Could something like the model employed for the ARM common platform, licensed at reasonable rates for wide use and then further individually enhanced by users be a model for MEMS?   Or perhaps a combination of equipment makers and product designers can drive a move toward process commonality.  As product designers better understand the process characteristics they can design for manufacture more effectively, while the equipment manufacturers may tend toward increasing commonality through a desire to meet the needs of the biggest MEMS manufacturers.  “In a maturing industry the base technology becomes more common. No one player can drive the entire market forward on their own,” he notes.

Keeping legacy tools up and running by identifying common needs

Volume manufacture also means the MEMS industry will need start to think more about keeping its legacy equipment up and running.  While most parts can be relatively easily replaced with something similar, replacing the obsolete printed circuit boards that fail is more of a problem, especially for the more complex boards in 200mm tools that can no longer be fixed in house.  “The aftermarket of scavenged boards of unknown quality, unknown software version, and unknown availability is not a functional supply chain,” says SEMATECH ISMI obsolescent equipment program manager Bill Ross. “Plus chopping it up for parts takes a 200mm tool out of the available inventory forever.”

To help keep the 200mm tool base viable for the wider semiconductor industry, ISMI aims to facilitate the re-manufacture of critical boards, by identifying the key parts needs, then bringing together the original tool makers who have the IP but no longer support the parts, and potential re-manufacturers who could then make the needed quantities of the boards, if they had license to the IP and a market of potential users.  The organization is also setting up an online exchange for its members to speed the search for needed legacy parts.  Ross and others will be discussing this and other legacy tool issues in the Secondary Market session Wednesday afternoon, July 11 at SEMICON West.

These speakers from Yole, NIST and Micralyne join those from Hanking Electronics, IDT, Teledyne DALSA, Coventor, Applied Materials, Nikon and Scannano to talk about solutions for growing the MEMS sector to the next level at SEMICON West, July 10-12 in San Francisco. See http://semiconwest.org/Segments/MEMS for the complete agenda, and http://semiconwest.org/Participate/RegisterNow to register.

More on SEMICON West:

SEMICON West 2012 exhibits preview: Wafer processing and handling

SEMICON West preview: Conference keynotes and "Extreme Electronics"

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!

June 18, 2012 — Following are some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.

High-current ion implant

The Applied Varian VIISta Trident single-wafer, high-current ion implant system embeds dopant atoms on 20nm wafers at high yields. The VIISta Trident precisely tailors dopant concentration and depth profile to optimizing dopant activation and suppress defects in the extension, source/drain junction and contact regions at 20nm. The tool has a proprietary dual-magnet ribbon beam architecture for enhanced performance at low energy. The system’s Energy Purity Module virtually eliminates high-energy species that can "smear" the transistor channel. Integrated cryogenic technology enables production implants as low as -100°C. Applied Materials Inc., South Hall, Booths 407, 552, 847, 1135, 2051, 2219.

 

Ion beam system

MicroSystems’ new IonSys 800 precision ion beam tool provides structuring and finishing processes down to a sub-nanometer scale. It features proprietary ion beam sources and is fully compatible with reactive ion beam processing based on fluorine and chlorine gas chemistry. The IonSys 800 system suits industrial ion beam etching and deposition processes with high quality and productivity requirements. Its automatic handling robot features a cassette load-look and can be configured in cluster layouts. MicroSystems, South Hall, Booth 1924.

 

Fluid dispenser

GPD Global will give live demonstrations of the new Island 3S benchtop manufacturing solution for LED manufacturing. The dispense system features a large work area of 12" x 16", an easy-to-use touchscreen interface and will be configured with a PCD dispense pump. GPD will have a display of dispense pumps to cover a wide range of dispensing applications. The Hyflow dispense pump suits heavy fluids such as thermal grease, the MicroDot valve will be on display for precision small volume dispensing such as conductive adhesives and solder pastes. Additionally, the Syringe mixing system format enables homogeneity of fluids such as silicone with phosphor. GPD Global, North Hall, Booth 6085.

 

MOCVD trap

Nor-Cal Products provides MOCVD device manufacturers increased up time with their new three-stage trap. Features include a removable water coil assembly and particle filter with 50% greater capacity. The trap proffers lower initial cost, lower cost of ownership, high capacity for extended PM, and ease of cleaning in GaN MOCVD reactors; AsP MOCVD reactors; and Aixtron G3, G4 and G5 systems. Nor-Cal Products, South Hall, Booth 2441.

Manual wafer handling tool

Virtual Industries Inc.’s new WV-9000 WAFER-VAC System handles wafers and solar cells without requiring in-house air plumbing. The compact, general-purpose wafer vacuum handling tool plugs directly into 110 Volt 50/60 Hz, and is ESD safe and Class-100 cleanroom compatible. Its diaphragm vacuum pump generates up to 10” of mercury with an open air flow of 2.3 lpm. The WV-9000 comes with a push-button wafer tip pen VWP-500-2.5mm, and a 6 foot clear coiled vacuum hose (VCH-2.5mm-6). Virtual Industries, South Hall, Booth 2427.

 

Aluminum transfer valves

HVA’s new high-performance aluminum slit valve range offer a slim profile and low vibration/particle levels, with reportedly light weight and high strength. Each valve component meets the throughput requirements of coating systems with up to 3 million cycles before maintenance. The valves are available in a range of sizes up to 2000mm as well as standard MESC 200/300/450mm sizes. HVA, South Hall, Booth 2625.

 

Gas blending system

Blixer from SEMI-GAS Systems is a custom gas blender that provides a continuous flow of precisely blended gases. It can blend two component-forming gas mixtures or mix three, four or more gas components into uniform, controlled mixtures. Blixer gas blenders meet application-specific requirements for flow, pressure, mixture percentage and blending accuracy. The gas mixture percentages can be adjusted by the operator during use via the onboard touchscreen interface. Blixer can support fluctuating usage and variable flow rates from multiple points, each with independent duty cycles. It uses mass flow controllers and offers an optional gas analyzer. Blending routines are completely automated. Blixer continuously monitors system performance and safety conditions with auto shutdown or notifications on alarms. SEMI-GAS Systems, a division of Applied Energy Systems Inc., South Hall, Booth 810.

Integrated vertical and rotation stage

Newport Corporation’s ZVR specialized Integrated Vertical and Rotation Stage, the ZVR-PP with a stepper motor or the ZVR-PC with a servo-driven DC motor, is used for semiconductor wafer positioning, metrology, inspection, and repair, it is also useful in LED production and applications such as 3D scanning, digitizing models, and validation. Newport’s ZVR features a compact and rigid design with improved cantilevered load capacity. With significantly lower cross-talk than earlier designs, the new stage delivers higher dynamic system performance in a low-profile footprint. The low mass, along with a high natural frequency, accommodates a variety of rapid step-and-settle positioning applications. The ZVR vertical platform has a wide, 3-point base with a stepper-motor-driven 10mm Z-stage. The integrated stainless steel rotation stage features smooth operation with stainless steel ball bearings. The rotation stages provide continuous 360° rotation for angular travel. An optional linear encoder for the Z-stage, or the Z-stage without the rotation stage, are also available. The three-point bottom interface permits mounting to any XY stage or other platform. A large, clear aperture through the center of the stage simplifies electrical cable and vacuum-chuck cable/hose management. All electrical and vacuum chuck utility connections are located together. Newport Corporation, South Hall, Booth 1507.

Transfer valves for 200-450mm semiconductor wafers and LED wafers

VAT Vakuumventile AG launched a transfer valve designed for semiconductor applications handling 200mm, 300mm and 450mm wafers and HB-LED applications. VAT REAL L-MOTION valves handle corrosive process environments in etch and CVD tools. The actuator has integrated, mechanically triggered sequence control with a fully protected bellows feedthrough. VAT REAL L-MOTION valves allow for easy access gate exchange through the top cover; no adjustment is required after service. Uniform sealing compression is achieved due to Real L-motion movement and an adjustable closing force (depending on elastomer), minimizing particle generation from the seal. The valve is pneumatically operated and locked in closed and open position. VAT offers standard and customized valves. VAT, South Hall, Booth 919.

 

FKM+PTFE seal for vacuums

VICTRA-ER from VALQUA is an advanced “hybrid” FKM+PTFE seal, combining semiconductor-grade FKM (fluoroelastomer) for high-vacuum sealing with a PTFE “liner” for radical resistance. VICTRA-ER suits harsh RF and microwave-based plasma environments, with the vacuum seal maintained by the high-performance FKM material, and plasma radicals resisted by high-purity PTFE that won’t introduce particles or metallic elements into the process. VICTRA-ER withstands operating temperatures up to 200°C. It can be used in semiconductor applications: plasma etching (metal, poly, oxide), CVD (PECVD, HDP-CVD), PVD, plasma ashers/strippers, and other plasma-based IC manufacturing processes. VICTRA-ER seals are available in AS568A-, KF-, and NW-standard sizes or special sizes upon request. VALQUA offers seal designs based on specific groove designs, counterface materials, and location within the chamber (e.g. lid area, wafer chuck, gas injector, showerhead, foreline/exhaust line, etc.). VALQUA, Booth 1430.

Vacuum pumps and abatement systems

Edwards will showcase dry vacuum pumps at SEMICON West that use less energy and need less maintenance than oil-sealed pumps. Edwards’ abatement systems also reduce operating expenses and maintenance requirements while maintaining a minimal environmental footprint, the company says. Edwards will feature the STP-iXR1606 series of magnetically-levitated turbomolecular pumps (TMP), which offer 40% improvement in throughput and an increase of nearly 90% in maximum gas flow, compared to existing products. Also highlighted in the booth are the GXS 450 and 750 series of dry vacuum pumps that meet high-throughput solar lamination process needs. Edwards, Booth 5351.

SiC tool components

Bridgestone is launching high-performance silicon carbide (SiC): PureBeta for peripheral semiconductor processing equipment components. The precision-machined components are made of ultra-high-purity sintered SiC with high thermal conductivity, high electrical conductivity, and durability in chemicals. Products include wafer process components such as wafer-holder plate for SiC-Epi/MOCVD, dummy wafers, disc plates, rings and heater filaments etc. 450mm parts are now available. Bridgestone, South Hall, Booth 447.

Ultra-high-purity gas analyzer

The newest addition to Tiger’s HALO family line, the HALO KA, provides a compact, ultra-high-purity gas analyzer. Its modular construction features ease-of-use with freedom from calibration, consumables, and routine maintenance costs. The laser-based HALO KA offers sensitivity, stability and low detection levels for ultra-high-purity analysis. Various gases can be detected in the most complex matrices, including hydrides, fluorides and corrosive gases. The new ALOHA+ H2O trace moisture analyzer for ultra-high-purity gases offers HB-LEDs manufacturers extreme sensitivity to moisture in ammonia. Tiger Optics, Booth 1201.

Low-cost plasma etching system

Plasma Etch Inc.’s low-cost benchtop plasma cleaning system, the PE-50, for semiconductor and similar applications is now available in an expanded chamber version with high rate etching capabilities, the PE50XL-HF. The PE-50XL-HF uses a new expanded 8" x 8" x 4" aluminum vacuum chamber for accommodating substrates/wafers up to 6" diameter. The system incorporates a 100W 13.56 MHz RF power supply with automatic RF tuning. The PE-50XL-HF also includes 2 gas meters for independent gas flow control or gas mixing introduction into the vacuum chamber. A 5 CFM vacuum pump charged with Krytox oil for Oxygen compatibility is included, with a dry pump optional. Plasma Etch Systems uses PLC control systems for automatic process sequencing. A keypad is used for operator entry and one complete process recipe can be displayed and stored in memory for reliable operation and repeatable results. Applications include photoresist ashing, etching of Si/Oxides/Nitrides and polymer etching. The plasma process also increases surface energy enabling a hydrophilic surface improving bond strength. Plasma Etch Inc., Booth 6566.

 

Springless diaphragm valves

The Swagelok DE series ultra-high-purity springless diaphragm valves features a formed aluminum housing on a 1.125 in. footprint. The valve is designed for modular gas systems. Swagelok eliminated the threads that typically connect the actuator components and attach the actuator to the valve body, allowing larger-diameter pistons in the same standard footprint. The center cylinder of the actuator design provides an additional active piston to increase the force output of the actuator. The formed actuator also reduces the valve height. A smaller body in the design efficiently uses 316L VIM-VAR material. A fully contained seat design minimizes chemical and thermal swelling. Swagelok provides corner chamfers on the outlet side of the body to indicate flow direction (top view) and match actuator orientation for installation. The DE series has a high-integrity all-welded seal to atmosphere. After undergoing SC-01 ultrahigh-purity cleaning, the diaphragm is hermetically sealed in the clean room environment. Stresses are reduced on the welded seal at high flow rates. A proprietary weld isolation ring protects the weld from the cyclic actuation load of the valve.  Available with pneumatic or manual actuators, the DE series can be ordered in two- or three-port configurations. The pneumatic actuator is permanently attached to the body assembly. Normally closed and normally open models have a color-coded indicator button. The manual actuator offers one-quarter turn window handle for quick actuation. The handle orientation to body is fixed for ease of installation. The valve is available in both C-seal and W-seal designs. The W-seal features a specially designed bolt retention ring that rolls down on the cylinder to keep bolts in place during assembly and reassembly. Swagelok, South Hall, Booth 1431.

Upcoming SEMICON West previews: Metrology, inspection and test products, packaging products, lithography tools, and more.

June 18, 2012 — H-Square Corp introduced its 450mm Ergolift for handling new 450mm semiconductor wafer front opening shipping boxes/multi-application carriers (FOSB/MACs), which can weigh more than 60lbs.

With 450mm still under development, OEMs and tool developers do not have automated systems in place to transport 450mm FOSB/MACs. The 450mm Ergolift uses a battery-powered end effector to lift and lower the FOSB/MACs by their robotic flange, easing loading/unloading. Removable safety pins keep carriers from sliding on end effector during transportation.

Ergolifts can be custom fitted to mate with a variety of equipment front-end modules (EFEMs), load ports and storage areas.

H-Square Corporation specializes in providing high quality, wafer and substrate fabrication handling tools and equipment to the Semiconductor, MEMS, LED, Flat Panel Display, Storage Media, Biotech, Photolithography and Solar Industries. Learn more at www.h-square.com.

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June 15, 2012 – BUSINESS WIRE — Digital imaging technology company Canon U.S.A. Inc. introduced the FPA-6300ES6a deep ultra-violet (DUV) stepping scanner, a lithography tool with a KrF excimer laser light source for the high-volume production of memory, logic and image-processing devices.

The tool targets high productivity, precision, reliability and capacity utilization patterning dynamic random access memory (DRAM), flash and other memory; logic such as microprocessors; and color filters and other imaging sensor wafers. Canon recently introduced a lithography tool for advance packaging as well, the FPA-5510iV.

The FPA-6300ES6a model realizes 200 wafers per hour (WPH) throughput (300mm wafers, 98 shots with High-Throughput Upgrade Option applied), approximately 60% faster than its predecessor. The DUV scanner incorporates a newly designed Reticle Stage and Wafer Stage that achieve accelerated exposure processes, reducing exposure times. The wafer alignment sequence is also optimized, along with wafer handling

Overlay accuracy is 5nm thanks to sophisticated stage-control technologies, an improved alignment scope and precise temperature control, such as air-flow stabilization. To reduce image distortion, the FPA-6300ES6a adopts advanced synchronous controls and high-level damping technology to control Reticle and Wafer Stage vibration. It offers an advanced 0.86 numerical aperature (NA) projection optical system and several options for throughput and overlay.

The model also features improved base durability and maintenance requirements in the series.

Canon U.S.A. Inc. provides digital imaging solutions, with parent company Canon Inc. (NYSE:CAJ). Canon U.S.A. Semiconductor website: www.usa.canon.com/semiconductor_equipment.

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June 15, 2012 — Cache solid state drives (SSD) will remain the mainstream ultrabook storage solution, according to IHS, even as hybrid hard disk drives (HDD) offer some consolidated storage advantage. Hybrid HDDs use a built-in layer of NAND flash memory.

Cache SSDs are the leading storage form factor in ultrabooks, growing to 23.9 million units shipped in 2012, a 2,660% increase over 2011.

Figure. Worldwide shipments of storage drives with a solid-state drive component.
SOURCE: IHS iSuppli Research.

 (Millions of units)

2011

2012

2013

Hybrid HDDs

1.0

2.0

4.0

Consumer SSDs

12.4

18.0

26.6

Cache SSDs

0.86

23.9

67.7

Cache SSDs are a discrete, separate memory component alongside the device’s HDD, with both elements housed separately. A sample cache SSD configuration from Acer’s Aspire S3 ultrabook carried a 20GB SSD next to 320GB of hard disk space. Cache SSD shipments will jump to 67.7 million units next year, exceed 100 million in 2015, and hit 163 million by 2016.

The new combination of a traditional HDD and integrated NAND flash layer in one form factor is tailored for ultra-thin computing applications like ultrabooks. The Momentus XT hybrid product from Seagate Technology has up to 8GB of single-level-cell (SLC) NAND and 750GB of memory on two 2.5” platters. Western Digital Corp. and Toshiba Corp. are also considering hybrid HDD products, with drives containing 8GB or more of NAND cache. Hybrid HDDs will see 2.0 million units shipped this year, doubling 2011’s count, then ramp to 25.0 million units by 2016.

Dedicated SSDs, a flash storage architecture that contain no cache component, will hit 18.0 million units shipped in 2012 for consumer applications, gradually ramping up to 69.0 million units in 2016.

Cache SSD came about because dedicated solid state drives were too expensive for PC designs, said Ryan Chien, analyst for memory & storage at IHS. However, a combined physical HDD with a smaller cache component provided faster responsiveness and larger capacities without prohibitive pricing.

Cache SSDs offer more advantages than consolidated hybrid HDDs. Discrete cache SSDs and HDDs are much more scalable and efficient for mainstream storage, with a broad selection of drive manufacturers. SSDs and HDDs have lately been focused on more mobile sizes, requiring few changes for cache SSDs or thin HDDs to keep their manufacturing processes cost effective.

Moreover, the expected evolution of cache SSDs to a swappable mSATA form factor not only helps narrow the convenience advantage currently enjoyed by hybrid HDDs but also facilitates upgradability akin to DRAM modules or USB drives. HDDs sized 7mm are available with 500GB in 2.5-inch platters, with a 5-mm z-height as the next step, while hybrid HDDs are still 9-mm high. SATA solid state drives are also getting denser, and NAND on the motherboard is becoming more feasible. Such benefits overall highlight the strength of discrete, dedicated hardware emblematic of cache SSDs over those of hybrids, which tend to make compromises in exchange for volume implementation.

Cost concerns, longer design cycles and tighter engineering tolerances in the case of hybrid HDDs also add to their difficulty of use in ultrabooks. As a result, the gain achieved through a consolidated form factor supposed to be a strength of hybrid HDDs will actually be a weakness in a few years as cache SSDs overcome that advantage. For their part, cache SSDs will remain as the favored storage solution in ultrabooks, with penetration of the desktop and the rest of the notebook segments anticipated to follow.

Also read: HDD industry hits reset on prices, markets, technologies post-floods

Learn more in the IHS iSuppli Storage Market Brief report.

IHS (NYSE: IHS) provides information, insight and analytics in critical areas that shape today’s business landscape. For more information, visit www.ihs.com.

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