Device Architecture

DEVICE ARCHITECTURE ARTICLES



ISS draws to a close with innovation on the mind

01/18/2012 

Michael A. Fury, Ph.D., Techcet Group, reports from SEMI’s International Semiconductor Strategy meeting, with a closing day focused on innovation and new applications.

SEMI award honors quantum dot research at QD Vision

01/18/2012 

SEMI presented its annual SEMI Award for North America to QD Vision. QD Vision team members made significant progress on the integration and manufacturing processes essential to the commercialization of quantum dot (QD) technology.

ISS day 2: Cloud computing to drive 450mm, closer collaboration

01/18/2012 

Day 2 of SEMI’s Industry Strategy Symposium (ISS) 2012 included talks by Mike Splinter of Applied Materials, Mark Thirsk of Linx Consulting, Tim Hendry of Intel, David Lazovsky of Intermolecular, a panel session on could computing run by Harvey Frye of TEL, Handel Jones of IBS and another panel session focused on 450mm, moderated by G. Dan Hutcheson of VLSI Research. Michael A. Fury of Techcet reports.

Advanced NAND flash memory scaling prompts ECC acquisitions

01/17/2012 

NAND flash memories are scaling below 2Xnm process nodes and bit errors are increasing. Research and Markets sees this as the reason for Apple buying Anobit Technologies and Micron buying Storage Genetics (both startups were developing advanced ECC and signal processing technologies).

ISS kicks off with IC industry reality talks

01/17/2012 

The Industry Strategy Symposium (ISS) kicked off today in Half Moon Bay, CA under blustery skies with choppy seas, an apt metaphor for the information about to be shared inside, says blogger Michael A. Fury, Techcet.

Organic printed electronics roadmap recognizes market entry

01/16/2012 

The Organic Electronics Association released its "OE-A Roadmap for Organic and Printed Electronics," covering application clusters such as flexible displays and smart systems, as well as the outlook on materials, substrates, and patterning processes.

Apple shares list of suppliers

01/13/2012 

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.

Renesas Electronics America taps company veteran as president and CEO

01/13/2012 

Renesas Electronics America Inc. named Ali Sebt, who has served 20 years at the company, as its new president and CEO. Sebt succeeds the retiring Daniel Mahoney.

DRAM oversupply could worsen in 2012

01/13/2012 

The dynamic random access memory (DRAM) market is encountering an "alarming" rise in inventory, low capex, and reduced demand from end-market applications, show analysts from IHS iSuppli, Deutsche Bank, and Barclays Capital.

IBM discovers magnetic storage limit at 12 atoms

01/13/2012 

IBM Research demonstrated the ability to store information in as few as 12 magnetic atoms, 100-10,000x less than today's information storage technologies.

Intel's CES keynote: Highlights from Otellini's talk

01/11/2012 

Intel's Paul Otellini spoke at the International CES in Las Vegas, providing information on Intel's smartphone moves and ultrabook momentum, and debuting the 32nm Intel Atom SoC for tablets and hybrids.

Ramtron builds 1st 3V F-RAM on IBM fab line

01/11/2012 

Ramtron International Corporation shipped 50,000 initial low-energy, custom, nonvolatile ferroelectric random access memory (F-RAM) devices built on its new IBM manufacturing line in Burlington, VT.

SEMI names Stanley Myers a director emeritus

01/11/2012 

Former SEMI president and CEO Stanley T. Myers was named a director emeritus of the association by itsl Board of Directors. Myers led SEMI for 15 years, was a board member for 24, and has been part of the semiconductor industry for more than 50.

ORNL finds nano-metallic conductivity in ferroelectrics

01/09/2012 

Researchers at Oak Ridge National Laboratory have observed metallic conductance in ferroelectric nanodomains, using piezoresponse force microscopy.

GaAs trends: Foundry outsourcing, rapid market upswing

01/08/2012 

The GaAs device market recovered sharply in 2010, driven mobile handsets. Increased use of pure-play foundries met the surge in demand and was in-line with a trend toward outsourcing, says Strategy Analytics.

7 semiconductor and display suppliers to benefit from tablet wars

01/06/2012 

Turner Investments shares the 7 display and semiconductor/microelectronics makers it expects to benefit the most from tablet PC proliferation out of Apple, Samsung, and Amazon.com.

GaN branches out from military apps

01/06/2012 

Gallium nitride (GaN) technology isn't shrinking from military applications any time soon, but GaN adoption is increasing in the commercial sector, from less than $1 million in 2010 to $58 million in 2015, shows Strategy Analytics.

JEDEC publishes wide-I/O mobile DRAM standard

01/05/2012 

JEDEC Solid State Technology Association released a new standard for wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate. Wide I/O mobile DRAM increases die integration -- stacking chips with TSV interconnects with a SoC -- and improves bandwidth, latency, power, weight, and form factor.

Graphene nanowiggles exhibit specific bandgap and magnetic properties

01/05/2012 

RPI scientists studying a promising form of graphene -- graphene nanowiggles -- with exceptionally different properties for each nanowiggle structure. All of the nanoribbon-edge structures have a wiggly appearance like a caterpillar inching across a leaf.

SuVolta raises $17.6M for IC power-control tech

01/05/2012 

SuVolta Inc. secured $17.6 million in venture funding from all existing investors as well as new investor Bright Capital. SuVolta developed the PowerShrink low-power IC technology, which cuts chip power consumption by 50-90%.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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