Device Architecture

DEVICE ARCHITECTURE ARTICLES



New power MOSFET package from IRF minimizes form factor

06/13/2011 

ternational Rectifier, (IR, NYSE:IRF), power management technology provider, introduced a PQFN 2 x 2mm with <1mm profile package featuring its latest HEXFET MOSFET silicon. The new package is ultra-compact, high density and efficient for lower-power applications.

IBM builds IC with graphene transistor

06/13/2011 

IBM researchers built an integrated circuit (IC) fabricated from wafer-scale graphene on SiC, integrating a graphene transistor with other electronics circuits.

FEI plasma FIB tool targets packaging apps

06/13/2011 

High-speed sectioning of TSVs with plasma FIB. The device was located, cross-sectioned, polished, and imaged with PFIB. SOURCE: FEI FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.

Apple spends most on semiconductors; 61% for wireless products

06/09/2011 

Top 10 OEM semiconductor buyers (Ranking by revenue in millions of US dollars). SOURCE: IHS iSuppli.Apple bought the most semiconductors of all original equipment manufacturers (OEMs) in 2010, largely to build iPhones and iPads, according to IHS iSuppli (NYSE: IHS) research. This is Apple's first trip to the #1 spot, after being third in 2009 and sixth in 2008.

FormFactor next-gen DRAM tester contacts 850+ die in parallel

06/08/2011 

FormFactor (NASDAQ:FORM) introduced its new generation of the SmartMatrix 300mm full wafer contact probe cards for DRAM device test. The SmartMatrix 100XP probe card uses FORM's MicroSpring 3D MEMS contact technology and increases probe card parallelism to over 850 die, enabling single touchdown DRAM wafer test.

Mobile SoCs can have low power without dopants, says SuVolta

06/06/2011 

SuVolta Vt variation reduction in perspective, 65nm bulk CMOS Vt variation.SuVolta is tackling the low-power challenge of mobile SoC devices with its PowerShrink platform and undoped, deeply depleted channel (DDC) technology. Scott Thompson, SuVolta, says DDC technology produces high performance at low voltage because it enables inversion charge to move from source to drain without scattering with dopants. The undoped channel and screening regions provide threshold voltage variation as good as the best fully-depleted SOI and fully-depleted FinFET research devices.

Phase-change memory module debuts at DAC

06/03/2011 

Inside the Moneta storage array with PCM modules installed. Image courtesy of Jacobs School of Engineering. All rights reservedUC San Diego researchers developed a phase change memory (PCM) solid-state storage device (SSD) that claims 7x speed improvement over current SSDs. The project has backing from Micron Technology, BEEcube, and Xilinx.

NXP assembles RF power transistors in plastic packages

06/03/2011 

NXP Semiconductors N.V. (NASDAQ: NXPI) launched overmolded plastic (OMP) RF power devices with 2.5-200W peak power. The plastic packages are a lower-cost option alongside NXP's ceramic package RF devices.

Elpida, PTI, UMC finalize 3D IC partnership

06/01/2011 

Updating on plans announced a year ago, Elpida, Powertech, and UMC say they have finalized their partnership to develop a "one-chip" logic+DRAM 3D IC solution incorporating 28nm interface design, through-silicon via (TSV) formation, wafer thinning, testing, and chip stacking assembly.

Silicon interposers: building blocks for 3D-ICs

06/01/2011  Silicon interposers seem set to stay as a valid alternative implementation to full 3D-IC designs. Matthew Hogan, Mentor Graphics, Wilsonville, OR

Key takeaways from AMAT's 3Q: "Uphill" 2011 goals, memory comeback, solar concern

05/31/2011 

Building "cumulative headwinds" -- inflation, consumer skepticism, energy costs, and Japan recovery -- are causing semiconductors and display manufacturers to push out near-term orders, according to Applied Materials execs laying out their 2Q11 books and future projections. They also describe who's spending and who's not, why solar equipment is a concern, and what are three keys for bridging the 450mm wafer-size transition.

Silicon-ize photonics to satisfy terabit/s cravings

05/26/2011 

In an SST-exclusive blog series, Mieke Van Bavel, science editor, imec, writes from the research organization's International Technology Forum (ITF) this week in Brussels. Van Bavel reports on a talk by Mario J. Paniccia, Intel: Bridging photonics and computing.

Evolution or revolution? Experts debate new directions in memory tech

05/26/2011 

Computer memory has come a long way from mercury-filled tubes to 100Gb flash memory cards sold at supermarkets -- but how long can the industry keep this pace going? A panel of experts at this week's IEEE International Memory Workshop explored both societal and technical trends driving memory technology development.

ASICs and FPGAs could take a lesson from autos, says Xilinx

05/26/2011 

Ivo Bolsens, Xilinx, compares crossover cars -- sports car performance with station wagon utility -- to semiconductor ASICs (high-performance) and FPGAs (flexible, easy to use, less NRE). The semiconductor industry needs a programmable platform that has ASICs' capabilities.

Imec ITF: Vision systems entering a new era of digital optics

05/25/2011 

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Francesco Pessolano, manager of imec's NVision program, reviews how digital optics can make future vision systems smaller, faster, cheaper, and more reliable.

Virginia schools launch nanotech center, coin "Oxide Hills" moniker

05/25/2011 

The University of Virginia, in partnership with the College of William & Mary and Old Dominion University, has launched the Virginia Nanoelectronics Center (ViNC) for nano-electronics research

3D stacked IC design flow gets boost from imec, Atrenta partnership

05/25/2011 

imec's 3D integration industrial affiliation program (IIAP) partnered with Atrenta Inc., SoC realization products provider to semiconductor and electronic systems industries, to developed an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs.

Imec ITF: The next wave of applications, with chips designed in 3D

05/25/2011 

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Here, Jan Provoost looks at Pol Marchal's presentation on 3D integration and its impact on systems design -- and why sensors that smell are coming next.

Potential $45B power device market looks to new substrates, packaging, process flows

05/24/2011 

SEMICON West preview: Alternative energy applications are poised to help drive the power semiconductor market over the next few years, and devicemakers are taking a close look at key issues to meet those market needs.

Big chip firms get bigger, quicker in 1Q11

05/23/2011 

The top 20 semiconductor firms paced at 11% growth in 1Q11, raking in $54.8B in sales, led by the usual suspects, according to rankings from IC Insights.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts