Issue

By 2030, more than 1 billion people in the world will be 65 years of age or older, according to Luc Van den Hove, the CEO of imec, the research consortium based in Belgium.

The hype surrounding a new technology can hide the real story. It is hard to know what's real and what's not.

The barrier for competitive display technologies is increasing because of the substantial improvements taking place in LCD technology.

After a seemingly interminable run of being ???a year away,??? it is clear that 3D integration (or at least the silicon-interposer-enabled 2.5D version) now offers a viable path to achieve the performance, cost, and feature integration required of next-generation mobile devices.

The WSTS' newest version of its twice-a-year semiconductor industry outlook shows some softer segments than just six months ago in its midsummer update.

AKHAN Technologies has developed a shallow n-type diamond material over silicon that has characteristics such as a shallow ionization energy (250meV), high carrier mobility (>1000cm²/Vs in nanocrystalline diamond thin films), and no graphitic phases.

A new generation of nanotechnology-based wet-process films provides process simplification, performance boost and cost reduction beyond TSVs. Claudio Truzzi, Alchimer, Massy, France

A comprehensive EUVL model that includes both the most important optical effects (mask shadowing and flare) and the most important resist effects (exposure yield, photoelectron blur, and LWR) is presented. Mark D. Smith, Trey Graves, John Biafore, Stewart Robertson, KLA-Tencor Corp., Austin, TX USA; Cheolkyun Kim, James Moon, Jaeheon Kim, Cheolkyu Bok, Donggyu Yim, Hynix Semiconductor Corp., Icheon-si Kyoungki-do, Korea

Correlation between worldwide economic growth and semiconductor market growth in 2012 will be very strong. That, plus supply side factors, will likely mean slow single digit growth in  semiconductor sales for 2012 and reduced capital spending on new capacity. The good news is that demand for more connectivity or simply even more "cool" products seems relentless. Here, we provide the outlook from three leading analysts: Bill McClean, President, IC Insights, Scottsdale, AZ USA

To understand the challenges associated with the industry's move to 22nm and smaller geometries, we asked leading industry experts to give us their perspectives on what we can expect.