Lithography

LITHOGRAPHY ARTICLES



Intel venture arm invests in extreme ultraviolet lithography

01/26/2006  XTREME Technologies GmbH, based in Gottingen and Jena, Germany, announced it has received funding from Intel Capital, Intel Corp.'s strategic investment arm, to accelerate development of its extreme ultraviolet light source for photolithography applications.

Intel, DNP extend mask pact to 32nm

01/23/2006  January 23, 2006 - Intel Corp. and Dai Nippon Printing Co. Ltd. have extended a mask development collaboration to cover mask technologies, including optical lithography (ArF excimer laser) and extreme ultraviolet (EUV), for the 32nm node and beyond.

Sematech tightens belt to fight "onerous" infrastructure investments

01/19/2006  January 19, 2006 - In a move to reduce expenses and tighten focus on its technical programs, Sematech is eliminating about 15% of its cost structure, restructuring various support and administrative functions and reshaping its interconnect program.

New eMetron.com Web site dramatically boosts efficiency of buying cleanroom consumables

01/17/2006  January 17, 2006 -- /BUSINESS WIRE/ -- SAN JOSE, Calif. -- Metron Technology has launched its new eMetron.com online ordering capability designed to optimize the efficiency of purchasing cleanroom consumables for customers in the U.S.

Nanozone progress means focus and tough choices

01/10/2006  By Bob Haavind, Group Editorial Director

While exotic properties of materials in the nanozone (1-100nm) promise a host of new devices and applications, success in the marketplace will depend on making tough choices and focusing on developing products offering sustainable profits.

ACT's Tobey receives SEMI's Bob Graham award

01/10/2006  January 10, 2006 - Aubrey "Bill" Tobey, president of ACT International, has been presented with the seventh annual Bob Graham award for "outstanding contributions in semiconductor equipment and materials marketing" by SEMI.

Photronics eyes Korea site for sub-65nm maskmaking

01/10/2006  January 10, 2006 - Photronics Inc., Brookfield, CT, plans to build a new photomask fabrication facility in South Korea, to support R&D and volume production of photomask technologies for semiconductors using 65nm- and below process technologies.

Mentor Graphics debuts OPC tool

01/10/2006  January 10, 2006 - Mentor Graphics Corp., Wilsonville, OR, has unveiled a new product to help verify post-optical-proximity correction (OPC) output, and help chipmakers minimize costly mask respins and delays getting products through production.

SEMATECH announces 2006 SEMATECH Knowledge Series

01/06/2006  January 5, 2006 -- /MARKET WIRE/ -- AUSTIN, Texas -- SEMATECH today announced the 2006 SEMATECH Knowledge Series (SKS), a set of public, single-focused industry meetings designed to increase global knowledge in key areas of semiconductor R&D.

Fluidigm’s fab anchors Singapore’s biotech hub

01/01/2006  Gajus Worthington knew three years ago that he needed to find a manufacturing site for Fluidigm Corp.

Euro EUV program touts power output milestone

12/09/2005  December 9, 2005 - A European Commission-sponsored research project said it has achieved a significant breakthrough with development of a 800W EUV light source.

IMEC, TEL prep EUV, immersion lineup

12/08/2005  December 8, 2005 - European R&D consortium IMEC is installing two 300mm coater/developer tools from Tokyo Electron Ltd. for use in EUV and 193nm immersion lithography work.

ASML receiving EUV parts, sets 2006 litho tools schedule

12/08/2005  December 8, 2005 - ASML said it plans to ship 20-25 immersion lithography systems in 2006, including shipments to Japan, and is now receiving components for its first EUV alpha tools being delivered next year to IMEC and Albany NanoTech.

Toppan Photomasks delivers EUV masks to ASML

12/01/2005  December 1, 2005




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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