03/08/2012 

Researchers at the University of Massachusetts Amherst have developed a new tool for manufacturing three-dimensional shapes easily and cheaply, to aid advances in biomedicine, robotics and tunable micro-optics.

03/07/2012 

Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.

03/06/2012 

AEPI and CEA-Leti will co-host a site visit to CEA-Leti and other facilities on the MINATEC campus, Grenoble, following MEMS Executive Congress Europe on March 23.

03/05/2012 

The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.

03/02/2012 

Tessera Technologies Inc. (NASDAQ:TSRA), through its wholly owned subsidiary, DigitalOptics Corporation (DOC) will acquire certain assets of Vista Point Technologies, a Tier-One-qualified camera module manufacturing business of Flextronics.

03/01/2012 

After reporting Q4 2011 results, MEMS supplier MEMSIC Inc. (NasdaqGM: MEMS) discussed its 2 main goals for 2012.

02/29/2012 

MIT researchers have come up with a new approach to MEMS design that enables engineers to design 3D configurations using existing fabrication processes. They built a MEMS device that enables 3D sensing on a single chip.

02/27/2012 

Luxtera closed $21.7 million in Round C financing, with participation from NEA, August Capital, Sevin Rosen, Funds, and Lux Capital, as well as new investor Tokyo Electron (TEL), and personal investment from an industry titan.

02/24/2012 

STMicroelectronics has shipped 2 billion MEMS sensors to date, after hitting 1 billion only 15 months ago. The company recently increased its MEMS production capacity to 3 million+ sensors a day.

02/23/2012 

STMicroelectronics (STM) is implementing shape memory alloys (SMA) in its optical image stabilization (OIS) motion sensor designs. Actuators made of SMAs contract upon heating.

02/23/2012 

poLight collaborated with Texas Instruments to produce the optical MEMS component of poLight's TLens, aiming for faster focus time and lower power consumption in high volumes.

02/22/2012 

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.

02/21/2012 

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.

02/21/2012 

CEA-Leti unveiled a 40Gbit/s optical modulator in silicon with a record extinction ratio of 10dB, developed by the HELIOS Project members.

02/20/2012 

At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.

02/17/2012 

At MM/MEMS/NANO Live USA, Professor Yogesh Gianchandani, University of Michigan Wireless Integrated Microsystems and Sensors Center, will keynote the MEMS Commercialization: From Lab to Fab to the Market session.

02/16/2012 

Picosun Oy announced record particle levels -- 1-2 added particles (>70nm) per wafer -- with its PICOSUN P-300B ALD batch tool installed at Fraunhofer IPMS.

02/13/2012 

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

02/13/2012 

MagnaChip Semiconductor Corporation (NYSE:MX) began ramping its 0.35µm mixed-signal foundry service process for MEMS accelerometers.

02/09/2012 

MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.