|
|
WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
Sponsored By:
Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
Sponsored By:
More Webcasts
|
Newport Corporation, lasers and photonics technology provider, introduced the Laser µFAB tabletop laser microfabrication workstation for researchers. Equipped with submicron resolution and a large stage, the tool can perform polymerization and ablation for MEMS, microelectronics, and other applications.
SolMateS received investments for the final development of the PiezoFlare 1200 piezoelectric thin film deposition machine. PiezoFlare 1200 is an automated deposition system for PZT thin films on 6" or 8" wafers, based on pulsed laser deposition.
To significantly reduce size and power consumption and increase performance of micromirror devices, Lemoptix used semiconductor-like equipment to build micromirrors with actuation based on magnetic and heat-dissipating principles instead of gearings.
Engineers at Oregon State University have invented a new way to use surface-mount adhesives (SMAs) in the production of low-temperature, microchannel heat exchangers. University officials are now seeking a commercial partner in private industry to continue development and marketing of the technology.
Yale's Jan Schroers and his team are using a new processing technique to fabricate miniature resonators for microelectromechanical systems (MEMS) as well as gyroscopes and other resonator applications from bulk metallic glasses (BMGs) twice as strong as steel.
USHIO America will start marketing the nano-imprint vacuum ultra violet (VUV) ashing system "CHIPs (Compact HiPower System)" in the US. Incorporated into nano-imprint lithography (NIL) equipment, the CHIPs allows non-contact and damage-free cleaning, surface improvement, and ashing of templates and workpieces.
Researchers at imec -- Danae Delbeke and Francesco Pessolano -- discuss announcements made in conjunction with Photonics West regarding the research consortium's NVISION program (for advanced imaging solutions) and silicon. Imec's silicon photonics platform allows for the miniaturization of complex photonic functions on a single chip.
Aerotech ANT95-R and ANT130-R direct-drive rotary stages offer in-position stability of 0.005 arc sec and incremental motion of 0.01 arc sec using the company's direct-drive technology. They suit disk-drive and MEMS manufacture and test, fiber-optic device alignment, as well as laboratory R&D applications.
Yole Développement released details of its upcoming report, MEMS Manufacturing & Packaging. This report analyzes the main MEMS manufacturing evolution. MEMS drivers include size, cost, and performance, though in different ways than ICs. New MEMS manufacturing and packaging technologies and specific materials are necessary.
Techcet's Michael A. Fury reports in-depth from sessions at IEDM 2010, looking at paper 18.3, "Prospects for MEM Logic Switch Technology," on a reverse trend from electronic switching back to mechanical switching in the form of MEMS devices.