09/18/2013  A wide array of package level integration technologies now available to chip and system designers are reviewed.

09/18/2013  At The ConFab conference in Las Vegas in June, Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.” In his presentation “The expanding Role of OSATS in the Era of System Integration,” Ma looked at the obstacles to 2.5/3D implementation and came up with the conclusion that cost is still a significant deterrent to all segments.

09/13/2013  Brewer Science announced today that the next generation of carbon nanotube materials, the CNTRENE 1020 material series, is officially qualified for NRAM nanotube random access memory device manufacturing by Nantero Inc.

09/13/2013  Itty bitty computers, smart phones, ipods, and more – these “must have” small electronic devices that Apple Computer and other companies have popularized, are forcing the hand of IC package designers to shrink the package to fit within these little hand-held gadgets.

09/06/2013  Advanced packaging of semiconductor chips has emerged as a key enabler in many of today’s electronic system products.

08/27/2013 

RFMD today announced it has shipped more than one million RF7196D high-power, high-efficiency CMOS power amplifiers (PAs).

08/01/2013 

Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.

07/31/2013 

Toshiba Corporation and Amkor Technology, Inc. today announced that the companies have completed Amkor’s acquisition of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s semiconductor packaging operation in Malaysia.

07/30/2013 

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

07/22/2013 

Cree, Inc. announces that its 1200 V SiC MOSFETs are being incorporated into the latest advanced power supplies from Delta Elektronika BV.

07/17/2013 

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

07/09/2013 

Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume manufacturing.

07/02/2013 

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

07/02/2013 

This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.

06/14/2013 

In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.

06/10/2013 

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

05/31/2013 

The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.

05/29/2013 

The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.

05/28/2013 

Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea.