09/22/2011 

X-RAY WorX GmbH introduced electronically controlled venting valves for open X-ray tubes. This avoids the manual venting typically performed during X-ray tool maintenance.

09/16/2011 

In video blogs from this week's TECHCON 2011, students share their current research projects from lead-free solder to graphene for new transistors, and members of industry giants like IBM share how SRC-supported research benefits the industry.

09/15/2011 

Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner

09/14/2011 

IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.

09/07/2011 

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.

09/07/2011 

Forget "3D stacking" -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be much faster and more efficient than current chip technology.

09/06/2011 

Alchimer's AquiVia film-deposition technology promises to cut fill deposition times and cost even with complex through-silicon via (TSV) 3D packaging structures. The product targets TSV ramp-up at production levels, according to the company.

09/01/2011 

The PDC concept on the Multitest MT2168 uses sensor-based alignment in the standard pick-and-place processes to reduce small package misplacements and test system jams.

09/01/2011 

SelectConnect Technologies introduced 3D design capabilities to create electromechanical functionality on molded interconnect devices (MID).

08/31/2011 

With PC demand waning, reports indicate Intel is rethinking part of its 22nm investment plans, which would dent industrywide capex forecasts for 2012.

08/26/2011 

Attend the Nanomanufacturing Summit 2011 to hear Dave Arthur, CEO of SouthWest NanoTechnologies (SWeNT), discuss carbon nanotube commercialization, as well as the roles of nano inks and coatings in broad applications.

08/24/2011 

The SMTA will host conference events with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.

08/23/2011 

The U.S. Court of Appeals for the Federal Circuit issued an opinion yesterday vacating the adverse judgment against Camtek in a patent infringement case brought against it by August Technology Corp., now Rudolph Technologies Inc.

08/23/2011 

Assembl

08/19/2011 

Argonne Lab researchers have created an e-beam lithography process that boosts resist layers to eliminate the hard mask application. It results in more precise features and deeper etch for semiconductor, solar energy, and other products.

08/19/2011 

North America-based manufacturers of semiconductor equipment posted $1.30 billion in orders in July 2011 and a book-to-bill ratio of 0.86, according to SEMI. The book-to-bill for the Japanese chipmaking equipment sector dropped to 0.84 in July, the Semiconductor Equipment Association of Japan reported.

08/19/2011 

How will heavy demand for tablets and smartphones translate into chipmaking capacity investments over the next few years? Citi's Tim Arcuri runs some numbers to come up with the answer: $10B annually.

08/18/2011 

An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production package testing.

08/17/2011 

The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration."

08/16/2011 

The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.