07/13/2011 

SUSS MicroTec unveiled MaskTrack Pro InSync, a holistic in-fab EUVL mask management product that synchronizes mask cleaning, handling, inspection, and storage.

07/13/2011 

Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for scalable, adaptable leadframe packaging.

07/10/2011 

SPP Process Technology Systems (SPTS) received the investment backing of private equity firm Bridgepoint for a management buyout from parent company SPP.

07/08/2011 

Canon Inc. made its first foray into the semiconductor back-end packaging equipment market with the new FPA-5510iV for through silicon via (TSV) and bump lithography.

07/08/2011 

The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.

07/07/2011 

Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.

07/06/2011 

Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.

07/05/2011 

SmartKem Limited tested its advanced semiconductor materials against amorphous silicon at the National Printable Electronics Technology Centre, where it achieved better thin-film transistor (TFT) mobility rating.

07/05/2011 

Elpida Memory is now sampling a new 8Gb TSV DRAM consisting of four 2Gb layers based on TSV stacking technology.

07/04/2011 

Multiest released data from an international IDM's high-volume production site, tracking its DuraKelvin test contactor's FPY and cleaning downtime.

06/29/2011 

At this week's AVS/ALD Conference, Intermolecular's Chi-I Lang reports on Day 2 highlights: faster and more flexible approaches to ALD processing, integration challenges with platinum ALD, a peek behind the curtain of equipment development, and the unique challenge of vendor support for high-volume manufacturing.

06/28/2011 

NEXX Systems installed 2 300mm Stratus deposition at a Korean IDM for high-volume wafer-level packaging processes.

06/28/2011 

Intermolecular's Chi-I Lang reviews highlights from the opening day of this week's AVS/ALD Conference, with key themes in interface engineering, the need for better control, and monitoring interface quality using in-situ STEM.

06/24/2011 

Heidelberg Instruments optioned University of Colorado Boulder's technique for shrinking copper circuits by zapping a substrate with two separate colors of light beams.

06/24/2011 

SouthWest NanoTechnologies' single-wall carbon nanotubes demonstrated absorption of indocyanine green, a functional dye with unique photomechanical, photochemical, and photobiological properties

06/21/2011 

KLA-Tencor will join SEMATECH-led efforts to identify and eliminate defects in EUV lithography, including mask metrology infrastructure and metrology source development.

06/20/2011 

SEMATECH, SRC, and UT Dallas have identified and removed a toxic contaminant in one type of single-walled carbon nanotube (CNT). The process could easily be moved into semiconductor fabs.

06/16/2011 

The global graphene-based product market value will grow to $67 million in 2015, and $675.1 million in 2020, according to BCC Research's new report, "Graphene: Technologies, Applications, and Markets" (Report ID: AVM075A).

06/15/2011 

LORD Corporation launched the ME-555 underfill encapsulant for semiconductor packaging and assembly. LORD ME-555 is a high-purity, semiconductor-grade epoxy underfill for encapsulating flip chips.

06/14/2011 

Metryx will work with IMEC and Intel via the joint European Semiconductor Equipment Assessment Leveraging Innovation (SEAL) project to assess high-resolution mass metrology viability at 20nm and smaller nodes.