Metrology

METROLOGY ARTICLES



DuPont Expands in Taiwan

08/07/2006  DuPont Electronic Technologies established a Semiconductor Materials Technical Center in Taiwan's Hsinchu Science Park, as part of its long-term growth plan. The Semiconductor Materials Technical Center is DuPont Taiwan Technical Center's (DTTC's) third Taiwan facility. The facility includes single wafer processing capability, analytical and metrology tools, and a semiconductor process technology research staff.

Brion adds marketing, bizdev, sales execs

08/04/2006  August 4, 2006 - Brion Technologies says it is expanding its management roster following "considerable" growth over the past year, to help support work with partners spanning design to manufacturing and wafer metrology.

Therma-Wave extends $15M credit line

08/01/2006  August 1, 2006 - Therma-Wave Inc., Fremont, CA, said it has tacked on a year to its $15 million line of credit from SVB Silicon Valley Bank, which is now available to finance working capital needs through June 2008.

Two-year Metrology Research Program Initiated

07/28/2006  ICOS Vision Systems Corporation NV and IMEC, an independent research center for nanoelectronics and nanotechnology, will undertake a two-year joint exploration and development program (JEDP) into 3-D packaging inspection and metrology. The inspection solution supplier will provide technology and equipment for the research, which will be performed at IMEC's laboratories.

ICOS, IMEC to develop 3D packaging metrology

07/27/2006  July 27, 2006 - ICOS Vision Systems Corp. NV and European R&D center IMEC have agreed to collaborate on development of metrology methods targeting 3D packaging processes for ICs, including wafer-level packaging, flip-chip, systems-in-package, and microelectromechanical systems (MEMS).

Logical succession: Kania brings Veeco experience to FEI

07/25/2006  FEI Co. of Hillsboro, Ore., announced on Monday that Don Kania has been named president, chief executive officer and a board member. He is expected to start at FEI Co., which makes tools for nanoscale characterization and research, in mid August. The appointment marks the end of a search that began with the stepping down of previous CEO Vahe Sarkissian, who left FEI in April.

Veeco announces new PVD order, record automated AFM orders

07/25/2006  Veeco Instruments Inc. announced that it received an order during the second quarter of 2006 for its new NEXUS Physical Vapor Deposition (PVD) Multi-Target Sensor tool from a leading manufacturer of thin film magnetic heads. The system is used to deposit high-quality, extremely uniform, thin film multi-layer stacks and will be used by the customer to manufacture high areal density Tunneling Magneto-Resistive heads.

Modular metrology, strain engineering, and managing waste

07/18/2006  Spanning the SEMICON West show floor, SST Senior Ed Korczynski reports on equipment providers' merger progress, market strategies, and new and improved technology offerings ranging from metrology to wafer cleaning to liquid waste abatement.

OnWafer extends plasma process control offerings with AE unit deal

07/10/2006  July 10, 2006 - OnWafer Technologies, Pleasanton, CA, has acquired the plasma management division of Advanced Energy Industries Inc., including IP and technology-related assets, in a move to extend its position in plasma process control and diagnostics wireless metrology technology. Terms of the deal were not disclosed.

SEMICON West preview: Applying beer technology to slurry, and rethinking thin film metrology

07/05/2006  Among this year's crop of companies in the spotlight at this year's SEMICON West Technology Innovation Showcase include a Swiss company controlling the beer flow at the World Cup stadium, thinking controlling slurry flow will be less demanding; a trio of metrology startups pushing radical new approaches to thin-film metrology; and a familiar face touting a new tungsten slurry for better yields at 45nm.

Ultratech paves metrology inroads with Oraxion buy

07/03/2006  July 3, 2006 - Ultratech Inc., San Jose, CA, a supplier of lithography and laser-processing systems, has entered into a nonbinding letter of intent to purchase the assets of Oraxion Inc., a startup developer of wafer stress metrology tools. Financial terms of the deal, which is subject to "the negotiation of definitive agreements and other standard conditions," were not disclosed.

CMP outsourcing firm beefs up service lineup

06/19/2006  June 19, 2006 - Entrepix Inc., Tempe, AZ, a provider of chemical mechanical polishing services for foundries and equipment providers, has launched a new suite of services and technologies targeting the "fab-light" manufacturing model.

Therma-Wave resounds "going concern" alarm

06/19/2006  June 19, 2006 - Therma-Wave Inc., Fremont, CA, a provider of process control metrology systems, says its independent accounting firm has cited the company as a "going concern" in its recent financial reports for the fiscal year ended in March, due to recurring net losses and negative cash flows. The company received a similar "going concern" warning a year ago.

Cabot buys polishing firm, seeks optics inroads

06/16/2006  June 16, 2006 - Cabot Microelectronics Corp. Aurora, IL, a developer of chemical mechanical planarization (CMP) polishing slurries, has agreed to purchase all the assets of QED Technologies Inc., a developer of polishing and metrology systems for high precision optics, in an effort to expand its "engineered surface finishes" lines outside the semiconductor market.

Toshiba Orders Metrology Systems from Camtek

06/16/2006  Camtek Ltd. announced they have received an order from Toshiba Corp. for multiple Falcon 830 bumped-wafer metrology systems. Toshiba will use the systems in their Oita, Japan, manufacturing plant for in-line bump inspection of 300-mm wafers.

Nova buys ex-ATMI x-ray metrology biz

04/25/2006  April 25, 2006 - Nova Measuring Instruments Ltd., Rehovoth, Israel, has agreed to acquire former ATMI subsidiary HyperNex, a developer of x-ray diffraction metrology systems, for approximately $4.5 million.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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