11/15/2011 

Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.

11/10/2011 

Shanghai Simgui Technology Co. Ltd., a Chinese wafer manufacturer, placed a follow-on order for an EVG850 automated production bonding system for SOI wafer bonding. Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production.

11/08/2011 

The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.

11/07/2011 

SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.

11/07/2011 

MEMS foundry Micralyne Inc. brought Nanoshift LLC, a product development firm specializing in emerging technologies, on board for design, process development, fabrication and packaging partnerships.

11/07/2011 

MEMS foundry Silex Microsystems and MEMS development firm A.M. Fitzgerald & Associates completed a multi-year collaboration on medical and biotech MEMS development, halving device development time.

11/04/2011 

Yole Développement's new report, "Inertial Combo Sensors for Consumer & Automotive" shows that supply chains need to adapt to the "very large market opportunity" for inertial combo sensors.

11/03/2011 

Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.

11/02/2011 

Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.

11/01/2011 

Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.

10/26/2011 

North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.

10/21/2011 

Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.

10/19/2011 

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.

10/11/2011 

STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.

10/06/2011 

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

09/22/2011 

Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.

09/21/2011 

A MEMS oscillator maker chose the MT9928 xm tri-temp test handler from Multitest for a novel oscillator application. The MEMS device required extremely accurate temperature calibration.

09/15/2011 

The InPhone microphone test system can be combined with the Multitest InStrip test handler for highly parallel MEMS test and the calibration of MEMS microphones.

09/07/2011 

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.

08/30/2011 

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.