05/24/2011 

Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.

05/17/2011 

Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.

04/13/2011 

Dolomite launched a range of optical systems that capture high-quality still and moving images of microfluidic experiments. Applications include testing various microfluidic chips for droplet generation and particle imaging, etc.

04/07/2011 

NanoSuite 6.0 promises speed, flexibility, ease of use and new application methods for nanomechanical properties measurements involving polymers, composites, thin film materials, MEMS, surface topology, stiffness mapping, and scratch testing.

03/08/2011 

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.

02/14/2011 

Dolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of microfluidic chips without any disruptions to the fluid flow.

02/02/2011 

Helios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component LED that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.

01/24/2011 

E M Optomechanical Inc. (EMOpto) developed a new low-cost version of its OPTOPro line of 3D MEMS Optical Profilers for use in testing and characterizing MEMS devices. The OPTOPro Model 622-Xe enables capital equipment purchase at less than $20K.

01/01/2011  Wafer-level packages that use a glass cover over the package cavity and through-silicon vias to interconnect the die bond pads satisfy the packaging requirements for CMOS image sensors: compact, reliable, low cost, and accommodate both front- and back-illuminated image sensors with no external changes. Giles Humpston, Tessera Inc., San Jose, California, USA

12/28/2010 

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.

12/28/2010 

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.

12/21/2010 

Micross Components, Inc. and SemiSouth Laboratories, Inc. announced a collaborative effort to expand SemiSouth's line of Silicon Carbide (SiC) Power JFETs and Schottky Diodes. SemiSouth will provide select JFET and diode die to Micross for packaging and test in metal hermetic packages

10/22/2010 

At the upcoming IEDM conference in December, researchers from NoblePeak Vision will explain how they achieved the first large-scale integration of a single-crystal germanium photodiode into a silicon imager, creating a CMOS sensor that offers high-resolution night imaging under moonless conditions.

08/23/2010 

Sensonor Technologies is developing SAR500, a novel high-precision, low-noise, high-stability, calibrated and compensated digital oscillatory gyroscope with SPI interface housed in a custom-made ceramic package.

08/19/2010 

16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accepted, rewarding imec’s multidisciplinary R&D platform (featuring two state-of-the-art R&D fabs).

01/10/2010 

01/10/2010 

02/21/2009  February 20, 2009: EPCOS AG is introducing what the Munich-based company is calling the world's most compact packaged sensors for barometric pressure measurement, and it comes with the firm's chip-sized MEMS packaging.

12/01/2008  AlSiC hermetic packaging assemblies from CPS Technologies offer an alternative to traditional thermal management hermetic packaging materials such as CuMo and CuW. The combinations of lightweight, high thermal conductivity, CTE matching, and low cost make it appropriate for applications in which thermal management and/or weight are important.

09/10/2008  September 10, 2008: Centipede Systems, an emerging supplier of advanced connectors for electronics, announced that Silicon Microstructures Inc. (SMI), has ordered a Centipede Systems tester to speed micro-electromechanical systems (MEMS) and improve quality at its Milpitas, CA fabrication facility.