01/30/2013 

Renesas and J-Devices signed a memorandum of understanding regarding the transfer of the semiconductor back-end production business of three facilities operated by Renesas’ wholly owned manufacturing subsidiaries

01/28/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc., blogs about the evolution of 3D technology seen at the International Electron Devices Meeting.  

01/24/2013 

Imec and PVA Tepla say they have achieved void detection in through-silicon vias at wafer level, after TSV copper plating, thanks to a nondestructive high-frequency scanning acoustic microscopy (SAM) technique.

01/24/2013  The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

01/24/2013  Looking at 2014, we see challenges and innovations in both the front-end semiconductor and 3D TSV markets.

01/24/2013  Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

01/24/2013  For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

01/24/2013  As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.

01/24/2013  Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

01/24/2013  For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

01/24/2013  We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

01/24/2013  In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

01/18/2013 

Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking services and test to customers.

01/11/2013 

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."

01/03/2013 

In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.

01/03/2013 

The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.

01/03/2013 

80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.

01/03/2013 

In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments.

01/02/2013 

Advanced packaging requirements are driving the evolution of back end manufacturing to become more similar to the front end.

01/02/2013 

The development of innovative technologies that solve the critical issues for the transition and adoption of 450-mm manufacturing will be the defining factor for whether a company merely survives or thrives.