Packaging

PACKAGING ARTICLES

Invensas face-down die packaging replaces SODIMM

04/11/2012

Invensas Corporation, a wholly owned subsidiary of Tessera, unveiled a DIMM-IN-A-PACKAGE multi-die face-down (xFD) packaging architecture for memory semiconductors in low-profile devices.

Agilent nanomechanical materials tester makes 100 indents in 100 seconds

04/11/2012

Agilent launched Express Test for ultra-fast, high-precision nanomechanical testing on thin films, low-k materials, composites, and more. It allows 100 indents on 100 surface sites in 100 seconds.

Conference report: MRS Spring 2012, Day 2

04/11/2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.

Attend joint sessions at VLSI Technology and Circuits

04/10/2012

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

ALD enables 3D capacitors for CEA-Leti and IPDiA

04/10/2012

CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.

Endicott Interconnect names David Van Rossum new CFO

04/10/2012

Endicott Interconnect Technologies has appointed David W. Van Rossum to the position of Chief Financial Officer, effective immediately.

Semiconductor wafer fab equipment trends: Test

04/10/2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.

ONNN

04/09/2012

ON Semiconductor (Nasdaq: ONNN) will develop a next-generation star tracker CMOS image sensor with the European Space Agency. The sensor will be used in star trackers, sun sensors and other scientific applications.

Rogers restructures to better serve power electronics, PCB, foam customers

04/09/2012

Rogers Corporation (NYSE: ROG) shared an update on its restructuring and streamlining initiatives, which are expected to save about $13 million (annualized savings) by Q4.

MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel

04/05/2012

MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.

Georgia Tech increases interposer development work

04/04/2012

Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon and glass interposers for 2.5D semiconductor packaging.

Henkel surface mount adhesive validated for non-contact dispensing

04/04/2012

Henkel

Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components

04/04/2012

Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.

Ferro expands LTCC offering with cost-sensitive materials set

04/03/2012

Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability.

Terepac builds miniaturized embedded circuits with wireless connectivity

04/03/2012

Terepac Corporation, developer of tiny digital electronics, has launched the TereTag miniaturized circuit design that is embedded in items to enable the "Internet of Things."

Semiconductor makers spend record amount on materials for second straight year

04/03/2012

The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.

SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

04/02/2012

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.

Bruker bolsters CT imaging line with SkyScan buy

04/02/2012

Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.

Yamaichi enables embedded module test and programming with new test adapter

03/30/2012

Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM.

Amkor licenses 3D packaging tech to SHINKO

03/30/2012

Amkor Technology Inc. granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold Via (TMV) semiconductor packaging technology.

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

PACKAGING ARTICLES

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