12/11/2018  As the Silicon Valley in California and the West Coast continue to be the hub of the semiconductor manufacturing in the U.S., HEIDENHAIN has expanded its motion systems support by establishing an ETEL facility in Fremont, CA.

12/10/2018  Ever-growing data generation driven by mobile devices, the cloud, the IoT , and big data, as well as novel AI applications, all part of the megatrends, requires continuous advancements in memory technologies.

12/10/2018  Synopsys, Inc. announced today another milestone in its longstanding partnership with imec.

12/05/2018  The semiconductor manufacturing industry is fighting to attract, educate, and retain the necessary talent for its continued growth.

12/04/2018  Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.

12/03/2018  Mutliferroics are promising candidates for new type of memory and logic circuits.

12/03/2018  Leti and Silvaco Inc. today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.

11/30/2018  Keith Jackson, President, CEO, and Director of ON Semiconductor, elected SIA Vice Chair.

11/26/2018  MagnaChip Semiconductor announced that volume production has commenced for an IGBT product for power module targeted to high-voltage industrial applications.

11/20/2018  Mentor, a Siemens business, today announced that DECA Technologies has become the latest member of Mentor's (outsourced assembly and test) OSAT Alliance.

11/19/2018  Toshiba Machine Co., Ltd. has developed the new DC-KT Series Die Casting Machines to meet the needs of the Southeast Asian market and has started sales and production at its plant in Thailand.

11/19/2018  The secret ingredient for the next generation of more powerful electronics could be air, according to new research.

11/15/2018  IHS Markit’s Jérémie Bouchaud provided a closer look at and outlook for this key market at the MEMS and Sensors Executive Congress in late October in Napa. Following are key takeaways from his presentation.

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

11/14/2018  Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles.

11/12/2018  EVG ComBond enables wafer-level packaging and heterogeneous integration for advanced MEMS, high-performance logic, power and "Beyond CMOS" devices with micron-level alignment accuracy.

11/12/2018  GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash) technology.

11/09/2018  X-ray photon correlation spectroscopy at NSLS-II's CSX beamline used to understand electrical conductivity transitions in magnetite.

11/09/2018  MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China.

11/08/2018  SRC research focused on next-generation semiconductor technology continues to attract the world's leading semiconductor design and manufacturing companies.