09/14/2018  Mentor, a Siemens business, today announced LightSuite Photonic Compiler -- the industry's first integrated photonic automated layout system.

09/12/2018  Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan.

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

09/11/2018  This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.

09/07/2018  Educate the industry about the latest in advanced processes and materials.

09/06/2018  SEMI and TechSearch International database also revises facility technology capabilities and offerings.

09/05/2018  The arrival of Fan-Out Panel Level Packaging (FO-PLP) appears to be at a perfect time: This technology will leverage processes developed for Three Dimensional Stacked Integrated Circuits (3DS-IC) as well as panel processing technologies developed for industries such as solar panels and large-screen TVs.

09/04/2018  Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials.

08/31/2018  KLA-Tencor Corporation announced two new defect inspection products designed to address a wide variety of integrated circuit (IC) packaging challenges.

08/30/2018  The Micron Foundation announced that it will commit $1 million to higher education institutions in Virginia as it invests in the next generation of technicians, scientists and engineers with a focus on women and underrepresented minorities in these fields.

08/29/2018  Flash memory is forecast to represent the largest share of capital spending while DRAM capex grows at the highest rate this year.

08/29/2018  Election reflects growing influence of vertical integration in IC design.

08/29/2018  Rudolph Technologies, Inc. today announced its new Dragonfly G2 platform, which incorporates many of the benefits of the Firefly system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind Technology.

08/28/2018  GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.

08/24/2018  Watlow, a designer and manufacturer of complete thermal systems, announced that it has acquired Yarbrough Solutions Worldwide of Austin, Texas.

08/24/2018  On August 3, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), the largest chip fabricator globally introduced a WannaCry Ransomware cryptowormvariant onto its information technology/operational technology (IT/OT) networks.

08/23/2018  The 35 must-watch technologies represented on the Gartner Inc. Hype Cycle for Emerging Technologies, 2018 revealed five distinct emerging technology trends that will blur the lines between humans and machines.

08/23/2018  Lacey succeeds Carl Schlachte, the company’s prior Interim CEO, who is resigning as a director of Immersion.

08/23/2018  A new NIST analysis reveals a heated source of potentially expensive errors.

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.