Semicon West

SEMICON WEST ARTICLES



Semiconductor advances could enable endless complexity increase

07/11/2017  Speaking at imec’s International Technology Forum USA yesterday afternoon at the Marriott Marquis, Luc Van den Hove, president and CEO of imec, provided a glimpse of society’s future and explained how semiconductor technology will play a key role.

Brewer Science partners with Arkema to develop high-chi DSA materials for advanced node patterning

07/10/2017  Brewer Science Inc. today announced from SEMICON West the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers.

Imec demonstrates electrically functional 5nm solution for back-end-of-line

07/10/2017  At its annual Imec Technology Forum USA in San Francisco, imec today presented an electrically functional solution for the 5nm back-end-of-line (BEOL).

SEMICON West preview: New “Meet the Experts” program

07/07/2017  SEMI adds a new speaker program called “Meet the Experts” at SEMICON West (July 11-13) in San Francisco this year.

SUNY Poly-led AIM Photonics and NY-Power Electronics Manufacturing Consortium to highlight research, collaboration at SEMICON West 2017

07/06/2017  Prominent New York State Tech Pavilion and Nanotech Summit at SEMICON West Exhibition to showcase innovation-based business growth opportunities

SEMICON West to highlight China growth surge

06/14/2017  SEMI today announced the addition of a new high-profile program on China to its 2017 conference lineup for SEMICON West (July 11-13).

SEMICON West preview: Equipment components and subsystems

06/08/2017  Attention turns to subcomponents to improve yields at advanced nodes.

Supply chain needs paradigm shift in how to look at defect control

06/07/2017  The future of contamination control in the next-generation supply chain for beyond 14nm-node semiconductor processes faces stringent challenges.

The danger that lurks below

07/19/2016  The semiconductor industry is moving quickly to adopt a variety of new materials in an effort to increase chip performance.

Three-in-one tool speeds bump inspection

07/19/2016  Last year, Rudolph Technologies, Inc. announced the widespread adoption and success of its newest macro defect inspection tool, the NSX 330 Series.

NSTAR Global Services announces facilities management services

07/14/2016  NSTAR Global Services is now offering facilities management services for operations and maintenance (O&M) of installed OEM facility equipment or previously constructed systems that support fab operations in high-tech industries.

Sono-Tek introduces photoresist ultrasonic coating system

07/14/2016  Sono-Tek Corp. unveiled a new photoresist ultrasonic coating system in Booth #2146.

Pall intros 5nm PTFE filtration membrane

07/14/2016  Pall Corporation announced this week the availability of its new 5nm XpressKleen filter.

Flexible medical device manufacturing developments

07/14/2016  The SEMICON West 2016 Flexible Electronics Forum provided two days of excellent presentations by industry experts on these topics, and the second day focused on the medical applications of flexible circuits.

Busch launches re-manufacturing capabilities

07/14/2016  Busch LLC has launched a new program where, at key sites around the world, they have the ability to re-manufacture any major brand of vacuum pump, including high vacuum turbos and cryos.

SEMICON West Day 3: Don't Miss

07/14/2016  Don’t miss these big events today at SEMICON West!

Coventor wins "Best of West" Award

07/13/2016  Solid State Technology and SEMI today announced the recipient of the 2016 "Best of West" Award — Coventor — for its SEMulator3D.

New materials need new handling approaches

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.

Packaging and displays drive new litho requirements

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

Standards industry leaders honored at SEMICON West 2016

07/13/2016  SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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