06/01/2011  Silicon interposers seem set to stay as a valid alternative implementation to full 3D-IC designs. Matthew Hogan, Mentor Graphics, Wilsonville, OR

06/01/2011  Utilizing a high-productivity combinatorial technique, the best formulation and process window for post-via etch residue removers was determined. Rekha Rajaram, et al., Intermolecular Inc.; Barry Chen, et al.,ATMI, Inc., Danbury, CT and Round Rock, TX

06/01/2011  Using complementary metrology techniques, the authors determined the thickness, composition and relaxation of SiGe and Si:C layers. Paul Ryan, et al., Jordan Valley Semiconductors, Durham, UK

06/01/2011  As the global supply chain deals with wafer size transition, pre-competitive collaboration will continue to be the best path towards economic efficiency and industry rationality, and Standards play a major role. Jonathan Davis, SEMI, San Jose, CA.

06/01/2011  The capabilities of advanced motion controllers enable OEMs to achieve high-performance requirements. Cameron Sheikholeslami, ACS Motion Control, Eden Prairie, MN

05/31/2011 

Mike Besnard, ATMI, speaks about evolving the high-productivity combinatorial research method to vet wafer processing tools for the ramp to high-volume, not just to screen semiconductor materials. He caught up with ElectroIQ.com at The ConFab.

05/31/2011 

STATS ChipPAC says integrating through-silicon vias with passive devices and its eWLB technology addresses complex design issues, shrinking lithography nodes, and increased performance demands for mobile and consumer applications.

05/31/2011 

Building "cumulative headwinds" -- inflation, consumer skepticism, energy costs, and Japan recovery -- are causing semiconductors and display manufacturers to push out near-term orders, according to Applied Materials execs laying out their 2Q11 books and future projections. They also describe who's spending and who's not, why solar equipment is a concern, and what are three keys for bridging the 450mm wafer-size transition.

05/26/2011 

In an SST-exclusive blog series, Mieke Van Bavel, science editor, imec, writes from the research organization's International Technology Forum (ITF) this week in Brussels. Van Bavel reports on a talk by Mario J. Paniccia, Intel: Bridging photonics and computing.

05/26/2011 

Computer memory has come a long way from mercury-filled tubes to 100Gb flash memory cards sold at supermarkets -- but how long can the industry keep this pace going? A panel of experts at this week's IEEE International Memory Workshop explored both societal and technical trends driving memory technology development.

05/26/2011 

Camtek Ltd. (NASDAQ and TASE: CAMT) received repeat automatic optical inspection (AOI) orders from an Asia-based foundry doing advanced micro bump inspection and metrology. Challenges arise in measuring such small bumps used in advanced packages, including efficiently handling huge amounts of data.

05/26/2011 

Ivo Bolsens, Xilinx, compares crossover cars -- sports car performance with station wagon utility -- to semiconductor ASICs (high-performance) and FPGAs (flexible, easy to use, less NRE). The semiconductor industry needs a programmable platform that has ASICs' capabilities.

05/25/2011 

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Francesco Pessolano, manager of imec's NVision program, reviews how digital optics can make future vision systems smaller, faster, cheaper, and more reliable.

05/25/2011 

The University of Virginia, in partnership with the College of William & Mary and Old Dominion University, has launched the Virginia Nanoelectronics Center (ViNC) for nano-electronics research

05/25/2011 

imec's 3D integration industrial affiliation program (IIAP) partnered with Atrenta Inc., SoC realization products provider to semiconductor and electronic systems industries, to developed an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs.

05/25/2011 

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Geert Vandenberghe talks about how EUV lithography is at a readiness crossroads, but he feels "fairly secure" about its current capabilities.

05/25/2011 

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Here, Jan Provoost looks at Pol Marchal's presentation on 3D integration and its impact on systems design -- and why sensors that smell are coming next.

05/25/2011 

Semiconductor die and packaging specialist Chip Supply Inc. is changing its name to Micross Components, which reflects the acquisition of Chip Supply last November by Micross Components. Micross provides specialist products and services for high-reliability and state-of-the-art electronics for high-reliability, industrial, and commercial applications.

05/24/2011 

Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.

05/24/2011 

SEMICON West preview: Alternative energy applications are poised to help drive the power semiconductor market over the next few years, and devicemakers are taking a close look at key issues to meet those market needs.