Semiconductors

SEMICONDUCTORS ARTICLES



Analyst take: Why Intel/Micron's 20nm NAND flash is a big deal

04/15/2011 

IM Flash's newly announced 20nm NAND flash chip pushes the memory envelope even further, but it's a very big deal for several reasons.

MRAM improvement from graphene's magnetic vacancies

04/15/2011 

Image. Schematic of a graphene transistor showing graphene (red), gold electrodes (yellow), silicon dioxide (clear) and silicon substrate (black). Inset shows the graphene lattice with vacancy defects. Vacancies (missing atoms) are shown surrounded by blue carbon atoms. Graphic by Jianhao Chen and Michael S. Fuhrer, University of Maryland. University of Maryland researchers found the Kondo effect in graphene without magnetic additives. With "defect engineering" of graphene, nanoscale magnetic sensors, magnetic storage, and magnetic random access memory applications could be possible.

Tunable laser replaces monochromatic light beam for thin film metrology

04/14/2011 

Figure 2. Faraday rotation vs wavelength.Magneto-optical (MO) effects can be used for a wide range of applications, from data storage and processing to thin films characterizations or even remote magnetic field sensors. Gabriel Monette, Université de Montréal and Marc Verhaegen, Photon etc., performed measurements of spectral dependence of the Faraday MO effect in the visible part of the electromagnetic spectrum along with temperature dependence measurements on a semiconductor 2µm epilayer (GaP) grown with embedded metallic ferromagnetic nanoclusters (MnP).

IBM's double-exposure patterning creates BEOL interconnects beyond 22nm

04/14/2011 

Figure. Via chain SEM cross-section along M1 line direction (upper) and along M2 line direction (lower).Shyng-Tsong Chen, lead integrator for back-end integration at IBM (Albany Nanotechnology Center), will be presenting "64nm pitch Cu dual-damascene interconnects using pitch-split double-exposure patterning scheme" at the IITC 2011 Conference. This technology will be needed for BEOL interconnects beyond 22nm devices.

RRAM developer joins SEMATECH to prototype NVM technologies

04/14/2011 

4DS will collaborate with engineers from SEMATECH's memory program to build a full transistor-memory, demonstrating a working prototype of a low-power RRAM device.

Beyond ball shear test Microprobing chip/package stress at Stanford

04/13/2011 

IITC paper, Stanford UniversityNew work from Stanford goes beyond simple bump shear testing to allow simulation of stresses exerted on chips during semiconductor packaging. The researchers are able to explore how the stresses affect back-end structures. Alex Hsing, a PhD student in Professor Reinhold Dauskardt's Group at Stanford University, summarizes the group's approach.

Secondary semiconductor equipment market is complex, and growing

04/13/2011 

At 13% of the total equipment spending for semiconductor manufacturing, secondary equipment and services are gaining importance at both 300 and 200mm fabs. SEMI and Semico announce results of their Secondary Semiconductor Equipment Market Study.

AMAT touch panel fab system enables simultaneous film stack processing

04/13/2011 

Applied AKT-Aristo Twin system for manufacturing touch-enabled displaysApplied Materials Inc. (AMAT) launched the Applied AKT-Aristo Twin system for manufacturing touch-enabled displays. Featuring two independent processing tracks on a single system, the AKT-Aristo Twin enables simultaneous fabrication of two different film stacks.

HDD and Flash combine in paired storage: Where is it working?

04/12/2011 

Research and Markets released the "HDDs and Flash Memory: A Marriage of Convenience" report, which examines a new storage architecture that has been named Paired Storage: the combination of flash memory with conventional rotating storage. There are many approaches to paired storage, and several application areas.

Optoelectronics, sensors and discretes sight another record year

04/12/2011 

Figure. Sales changes in the economic downturn and recovery. SOURCE: IC InsightsSlightly above average growth rates in 2011 will lift sales of optoelectronics, sensors and actuators, and discrete semiconductors to new record-high levels again this year, thanks to growth in MEMS and LED markets, says IC Insights.

The ConFab 2011 Keynotes to Address Disaster in Japan

04/12/2011 

Two keynote talks at The ConFab 2011 will address the impact of the ongoing disaster in Japan, including the state of Japan’s semiconductor manufacturing operations and the impact of lost production on the supply chain. Keenan Evans, the Senior Vice President for Quality, Reliability & EHS for ON Semiconductor, will give the keynote on the first day of the conference, May 16th. Bill McClean, President of IC Insights, will give the keynote on the second day, May 17th.

Crossing Automation wins 300mm Spartan sorter orders

04/12/2011 

Crossing Automation received both new and follow-on orders for multiple 300mm Spartan Sorters. The orders were received from a single foundry customer and the systems will be installed in two of its leading-edge semiconductor manufacturing facilities for use in volume production.

Flip chip still in growth phase, even at $16B

04/11/2011 

2010 total flip chip market value. Split by cost-of-ownership supply chain segments (substrates for LCD drivers excluded, service margin included). SOURCE: Flip Chip report, Yole Développement, April 2011.Yole reports on the flip chip market, and finds that this $16 billion industry, with diverse applications, is still growing. New flip chip technologies, such as copper pillars, and technology demands, such as fragile 28nm chips, are driving demand.

Semiconductor capex not slowing down in 2011, say analysts

04/11/2011 

Two analyst reports review just how prosperous 2010 was for most (but not all) semiconductor capital companies, and how 2011 is shaping up to be even better -- even with ramifications from Japan's earthquake/tsunami disaster.

ACS drive module enhances wafer handling, inspection

04/11/2011 

ACS Motion Control developed an EtherCAT slave Universal Drive Module that directly drives one or two axes. The product suits use in wafer handling robots and positioning stages and optical wafer inspection as well as FPD inspection machines, custom robotics, and medical CT Scanning machines.

Electrografting fills high-aspect ratio TSV

04/08/2011 

Alchimer's Erik Smith explains the molecular growth and building method of electrografting, and how electrolytic and electroless electrografting can grow isolation liners, fill through silicon vias (TSVs), and save money in the process.

STMicro installs Heidelberg litho system for lab on chip development

04/07/2011 

ST Microelectronics has installed a µPG101 from Heidelberg Instruments in the "More Than Moore" Research Labs in Agrate Brianza to develop prototypes of new microfluidics devices for medical diagnostic, and lab-on-chip applications.

Tsunami disaster to boost 2011 worldwide semiconductor revenue

04/06/2011 

Figure. Revised and previous quarterly 2011 semiconductor forecasts (Millions of U.S. Dollars). SOURCE: IHS iSuppli April 2011.Supply disruptions and potential shortages following the March 11 earthquake and tsunami in Japan have uplifted semiconductor prices, especially in the memory sector. This means increased semiconductor revenues in 2011, says IHS iSuppli.

TI acquires NSM: Picking apart the deal

04/05/2011 

Analysts break down Texas Instruments' proposed acquisition of National Semiconductor: Key factors, where both companies benefit, whether TI is overpaying, and if more analog M&A is imminent.

The-evolution-of-a-memory-revolution

04/05/2011 

Rambus Inc. memory podcastSharon Holt, Rambus, makes the case for a kind of evolutionary revolution in memory -- one that essentially unifies the memory requirements of PCs/servers as well as smart phones/tablets. Holt says that continuing to increase the speeds of LPDDR while staying within power requirements can be a way to buy time before moving to wide I/O memory with TSV.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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