|
|
WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
Sponsored By:
Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
Sponsored By:
More Webcasts
|
Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.
Sonix Inc., scanning acoustic microscope designer and manufacturer, introduced its Stacked Die Imaging (SDI) enhancement, which effectively inspects for defects in semiconductor stacked die and wafer level packages (WLP) by selectively increasing the ultrasonic signal gain for deeper interfaces of interest.
András Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.
Reticle Labs released RS-Mini, an enterprise-class highly compact mask inspection defect management framework for mask and wafer fabrication plant infrastructure. It allows fabs to share inspection results, track defect trends, summarize inspection results from multiple systems, and more.
Applied Materials Inc. (AMAT) debuted the Applied DFinder darkfield inspection system, which uses deep ultraviolet (DUV) laser scanning for particle sensitivity down to 40nm on patterned wafers. The product suits inspecting the interconnect layers in 22nm and below memory and logic chips.
Synopsys introduced the Proteus LRC for lithography verification at the SPIE Advanced Lithography Conference. It is targeted for 28nm and below and includes EUV as well as double-patterning (DPT) capabilities. George Bailey, director, technical marketing at Synopsys, describes the data flow process.
Novellus Systems (NASDAQ: NVLS) debuted the VECTOR Excel for pre- and/or post-processing of dielectric films, such as diffusion barriers. New interface engineering reduces the RC delay constant without incorporating new materials into the back-end-of line (BEOL) integration scheme. 
U-M researchers, with several collaborators, developed a method to spontaneously form nanoscale spirals of electric polarization at controllable intervals in ferroelectric memory. This natural "budding" reduces the power needed to flip each bit.
KLA-Tencor Corporation (Nasdaq: KLAC) introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.