12/07/2009 

Speaking at the International Electron Devices Meeting (IEDM) in Baltimore, IMEC’s Thomas Hoffman outlined challenges and possible options of high-k metal-gate (HKMG) transistor stack materials and processes for future device generations.

12/04/2009 

Tokyo Electron Ltd. has raised its expectations for chip tool orders in the current quarter, and reportedly will resume plans to build a new factory near Sendai, according to local reports.

12/03/2009 

Samsung says it has ramped to volume production on a "30nm-class" 3-bit multilevel cell (MLC) NAND flash memory and an asynchronous DDR version, to be used in modules initially for 8GB microSD memory cards.

12/03/2009 

Scottish foundry Semefab says it is investing £6.6M (US $11M) ina new wafer fab for frontend processing of MEMS structures.

12/03/2009 

Researchers at the California Institute of Technology have combined the self-assembly ability of DNA with electronic properties of carbon nanotubes to address the problem of organizing CNTs into nanoscale electronic circuits.

12/03/2009 

Researchers at Cornell say they've come up with a way to make graphene devices more simply, by growing the material directly onto a silicon wafer.

12/01/2009 

X-Fab Silicon Foundries Group has agreed to transfer ownership of its wafer fab in Plymouth, UK, to Swindon, UK-based Plus Semi, reuniting two former Plessey operations and avoiding feared shutdown/layoffs.

12/01/2009 

Applied Materials is making a splash at this year's SEMICON Japan with the release of three new tools: a dual-wafer CMP platform, a system for NiSi contact-layer annealing, and an integrated abatement/pumping system for emissions control.

12/01/2009 

Researchers at Argonne National Laboratory and the University of Chicago have created a new way to target cancer cells with nanotechnology: tiny magnetic discs that deliver a 90% cell destruction rate.

11/30/2009 

Giving the keynote address at the Silicon Valley Engineering Council's Nov.10 open house, HP senior Fellow Stan Williams discussed research by his group and others on memristors, and hinted on upcoming developments in this area.

11/30/2009 

Presentations at this year's International Symposium on Microelectronics (IMAPS, San Jose, Nov. 1-5) included discussion of TSV/3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked multi-chip package (MCP) for a MEMS variable capacitor and control IC chip.

11/20/2009 

Researchers at the Department of Energy's Lawrence Berkeley National Labs have come up with a tool to gauge a semiconductor facility's energy and water consumption, and compare against similar facilities, to identify areas of improvement -- all toward the pursuit of a "greener" industry.

11/20/2009 

The good news continues to shine in semiconductor equipment demand for suppliers in North America and Japan, according to the latest monthly data from SEMI and the SEAJ, though some softness may warrant some attention heading into the holiday season.

11/19/2009 

E-beam direct write lithography using character projection capability has the potential to enable maskless production for systems-on-chip at leading-edge technology nodes. Advantest and D2S describe their collaborative work that yielded a 4× increase in the number of characters available on EBDW stencil masks, a key factor in achieving the throughput increase needed to make maskless SoCs practical.

11/18/2009 

Toshiba Corp. says it has developed a high-resolution photoresist specifically for extreme ultraviolet (EUV) lithography, viable to the 20nm-scale generation.

11/17/2009 

Gartner has added its updated chip forecast to the chorus of renewed optimistic outlooks. The firm is reducing its 2009 decline expectations to -11.4% (vs. -17%), and says 2010 chip growth will bounce back 13% to 2008 levels of $255B.

11/17/2009 

Execs from Applied Materials and Semitool discuss the motivations behind AMAT's $364M acquisition, to solidify and widen a presence in two key growth segments: advanced packaging and copper interconnects for memory.

11/14/2009 

Updates to a pair of reports from Yole Developpement aim to help better identify remaining integration challenges and high-volume production implementation strategies for 3D ICs and through-silicon vias (TSV).

11/13/2009 

Taiwan's efforts to consolidate its memory chip industry have hit another roadblock, with the government's denial of an application for funding -- leaving the future of the effort even more in doubt.

11/10/2009 

After losing a court case, Chinese flagship foundry SMIC is giving 8% ownership to rival foundry TSMC and installing a new CEO -- changes that might suggest bigger changes ahead for both companies.