Semiconductors

SEMICONDUCTORS ARTICLES



EV Group Sets Installation of UV Nanoimprint Stepper for Q1

12/16/2004  (December 16, 2004) Scharding, Austria — EV Group (EVG) says that it will install the first example of a new fully automated UV step-and-repeat nanoimprint lithography (UV-NIL) system at non-profit research organization, AMO GmbH in Germany, during the first quarter of 2005. AMO has been participating in joint-development programs with EVG in the area of UV-NIL since 1997.

Applied Materials Licenses AmberWave IP

12/15/2004  (December 15, 2004) Santa Clara, Calif. — Applied Materials announces that it has signed an agreement with AmberWave Systems Corp., based in Salem, N.H., to license AmberWave's strained silicon intellectual property for Applied's use on its Centura RP Epi system. Applied Materials has already sampled 300-mm strained silicon epi wafers to a chip maker for development work.

Building a strong nanotech workforce

12/15/2004  But there also is a growing concern that a shortage of a trained workforce could slow this booming industry. A number of centers and institutes are being created to meet the demand for research and training. Restructuring traditional curricula can be a major step toward providing trained professionals.

Samsung unveils tiny cell-phone memory card

12/14/2004  Dec. 14, 2004 -- Samsung Electronics has developed a fingernail-sized, low-power multimedia memory card (MMC) for mobile phones, about one-third the size of typical multimedia memory cards.

IMEC reports record in tall triple-gate device SRAM cell for 45nm node

12/13/2004  December 13, 2004 - At today's IEEE International Electron Devices Meeting in San Francisco, IMEC is expected to announce that it has achieved the smallest triple-gate device SRAM cell reported to date. IMEC's device is a fully working 6-transistor SRAM cell with an area of only 0.314 x 0.314 mm.

Eastman offers efficient, non-HAP replacement for MEK solvents

12/13/2004  A staple industrial cleaner and solvent for coatings, MEK (methyl ethyl ketone) is currently in short supply, according to industry analysts. To help meet market demand for MEK replacements, Eastman Chemical Company offers Eastman MPK (methyl propyl ketone), its low-density, non-HAP solvent for coatings and industrial cleaning and surface preparation applications.

Chipmakers' mid-quarter outlooks mixed

12/09/2004  December 9, 2004 - Several chipmaking firms have tightened their projections, mostly in line with sentiments that a slowdown continues--but with one big exception.

Japanese equipment demand slides, but still clinging to Y-Y growth

12/08/2004  December 8, 2004 - Demand for Japanese semiconductor manufacturing equipment continues to slide as the market sinks further into a lull entering the end of the calendar year, according to data from the Semiconductor Equipment Association of Japan (SEAJ).

Toshiba Announces Expansion of Power MOSFET Packaging Solution

12/08/2004  (December 8, 2004) Irvine, Calif. — Demonstrating its ongoing commitment to innovation in power semiconductors, Toshiba America Electronic Components Inc. (TAEC) announces TSSOP Advance, a new, smaller packaging technology that extends the company's diverse packaging options for power MOSFETs.

2004 IWLPC Announces Best Paper Award

12/08/2004  (December 8, 2004) Minneapolis, Minn. — Speakers at the first International Wafer-Level Packaging Congress (IWLPC), held October 10-12, 2004, in San Jose, Calif., addressed leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging. As rated by the attendees, the Best Paper Award was presented to Dr. Udo E. Frank of FEINFOCUS GmbH.

EV Group launches global consortium on nanoimprint litho

12/07/2004  December 7, 2004 - EV Group today announced the launch of a global consortium, NILCom, dedicated to commercializing advanced nanoimprint lithography (NIL) technologies. The consortium will have a technology platform supported by an established infrastructure and qualified processes, including leading technology companies and research centers.

Study Shows Capacity Expansion Required to Meet Growth in Flip Chip and Wafer-level Package Demand

12/06/2004  (December 6, 2004) Austin, Texas — TechSearch International's new study, Flip Chip and Wafer Level Packaging Trends and Market Forecasts, projects a compound growth rate of over 28% in this market between 2004 and 2009. The report profiles drivers for the demand and requirements by market, investigates the state of the technology, and details the supply base.

EV Group, Komag Inc. collaborate on high-volume nanoimprint lithography

12/03/2004  December 3, 2004 - EV Group (EVG) has said that it has signed an agreement with Komag Inc. to develop, license, and sell a high-volume nanoimprint lithography (NIL) application for mass data storage.

SIA launches nanoelectronics research initiative

12/02/2004  December 2, 2004 - Noting that the laws of physics will eventually limit the implementation of CMOS scaling technology, the Semiconductor Industry Association (SIA) has announced a research program -- called the Nanoelectronics Research Initiative (NRI) -- aimed at assuring US leadership in information technology well into the future.

Applied Materials, ASML bring immersion litho to Maydan Technology Center

12/02/2004  December 2, 2004 - Applied Materials Inc. and ASML intend to collaborate to speed the development of 65nm and below process equipment technology for the semiconductor industry, the companies said.

Applied Materials, DuPont Photomasks collaborate for 90nm, 65nm Masks

12/02/2004  December 2, 2004 - Applied Materials Inc. and DuPont Photomasks Inc. have agreed to a joint development program (JDP) for advanced photomasks supporting 90nm and 65nm technology.

SEZ to expand Japan demo facility

12/01/2004  December 1, 2004 - The SEZ Group, Zurich, Switzerland, has announced it will expand its Yokohama, Japan-based customer application lab, which opened in July.

electronica 2004 Boosts Industry Optimism

12/01/2004  (December 1, 2004) Munich, Germany — electronica 2004, a trade show for components, assemblies, and high-growth applications, signalled increased momentum in the global electronics industry as international visitors and exhibitors once again flocked to the New Munich Trade Fair Centre.

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12/01/2004  DELIVERING TRUE KNOWN GOOD DIE




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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