Semiconductors

SEMICONDUCTORS ARTICLES



Using wafer-level probing to assess reliability

09/19/2003  Getting a handle on the reliability of devices using new low-k materials and copper interconnects is key to successful integration efforts. Recently, Applied Materials announced it has developed benchmarks for testing the electrical reliability of copper and low-k materials using Agilent Technologies' Parallel Parametric Reliability (PPR) test system.

Chartered takes wraps off 90nm

09/19/2003  September 18, 2003 - Singapore's Chartered Semiconductor Manufacturing has taken the wraps off its "NanoAccess" 90nm SoC process technology, based on its development work with IBM.

Japanese equipment numbers shrug summer lull, post gains

09/19/2003  September 18, 2003 - Japan continues to push for an industry rebound by posting strong semiconductor equipment sales in July, according to the latest figures from the Semiconductor Equipment Association of Japan (SEAJ).

August book-to-bill reflects chipmakers' caution

09/19/2003  September 18, 2003 - Those anxiously awaiting a market turnaround may be disappointed by the latest semiconductor equipment figures from VLSI -- and downright upset by VLSI's chilly analysis of the numbers.

Veeco sues Asylum Research

09/19/2003  Sept. 19, 2003 – Veeco Instruments Inc., a Woodbury, N.Y., provider of metrology products and process equipment tools, filed a lawsuit against Asylum Research Inc. of Santa Barbara, Calif., according to a Veeco news release.

Big scare creates big market for nanoparticle masks

09/18/2003  At the height of the SARS outbreak last spring, Doug Beplate's Emergency Filtration Products Inc. was scrambling to produce as many of its nanoparticle filtration masks as possible, particularly in the Asian markets hardest hit by the communicable virus. Demand has subsided temporarily, but Beplate believes the market for the technology will grow.

THE WEEKLY WRAP FROM WAFER NEWS

09/17/2003  Privacy groups could slow down RFID chip growth The optimism surrounding Wal-Mart's June announcement that strongly encouraged its top 100 suppliers to start using radio frequency identification (RFID) tags by 2005 (see WaferNews, V10n24, June 16, 2003) may have been premature.
(September 17)
Click here for these and more WaferNews briefs.

Silicon Microstructures completes fab expansion

09/17/2003  Sept. 17, 2003 – Silicon Microstructures Inc., a Milpitas, Calif., developer and manufacturer of MEMS-based silicon pressure sensors and custom microstructures, announced the completion of its MEMS fab expansion and renovation.

Silicon Integrated to spin off plant

09/16/2003  September 15, 2003 - Taiwanese chipset maker Silicon Integrated Systems Corp. has proposed a plan to spin off its 8-in. wafer fab into a fully-owned subsidiary, stifling rumors of a possible sale to major shareholder United Microelectronics Corp.

SMIC eyeing Motorola plant

09/16/2003  September 15, 2003 - Semiconductor Manufacturing International (SMIC), Shanghai, China, is reportedly considering buying a stake in an idle chip plant owned by Motorola in Tianjin, China.

Cascade Microtech opens Singapore office

09/16/2003  September 15, 2003 - Cascade Microtech, Beaverton, OR, a supplier of wafer test solutions, is opening a new sales office in Singapore.

Toshiba aims for 4x productivity

09/16/2003  September 15, 2003 - Toshiba Corp. plans to quadruple productivity at its new 300mm plant in Oita, Japan, according to local media.

Bookham consolidates fabs

09/16/2003  September 15, 2003 - Bookham Technology, Oxfordshire, UK, has finished consolidating its wafer fab facilities in Caswell, UK, four months ahead of schedule.

Semitool takes 4Q charge

09/16/2003  September 15, 2003 - Semitool, Kalispell, MT, a supplier of wafer surface prep and deposition systems, says it will take a $15-$17 million charge in 4Q03 related to inventory writedowns.

Fab consolidation completed

09/16/2003  SEPT. 16--OXFORDSHIRE, England--Bookham Technology plc, a provider of optical components, modules and subsystems for fiber optic communication networks, has completed the consolidation of its two main wafer fab facilities, following the acquisition of the Nortel Networks Optical Components businesses (NNOC).

Renesas, PointChips aim for USB 2.0

09/12/2003  September 11. 2003 - Renesas Technology Corp., the chipmaking JV between Hitachi Ltd. and Mitsubishi Electric Corp., and PointChips, a fabless USB flash drive controller provider, have announced plans to jointly deliver an ASIC combining Renesas' USB 2.0 technology with PointChips flash controller design.

Sunny mid-quarter reports brighten industry outlook

09/11/2003  Halfway through the third quarter, many big-name chipmaking firms are upping their 3Q performance estimates, and for the most part, Wall Street is cheering. Here's a rundown of recent mid-quarter revelations.

Schlumberger sells verification assets

09/11/2003  September 9, 2003 - Schlumberger Technologies, Inc. has transferred its verification systems unit, which develops metrology capital equipment, to Soluris, Concord, MA, a new company formed by the division's management team.

Nantero wins funding

09/11/2003  September 9, 2003 - Nantero, Woburn, MA, a developer of nonvolatile random access memory (NRAM) chips using nanotechnology, has completed a second round of investments totaling $10.5 million.

IBM forges new chip technologies

09/11/2003  September 9, 2003 - IBM says it has developed two new chip manufacturing technologies that could improve CMOS performance by more than 60%.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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