01/24/2002  Jan. 24, 2002 - Allentown, PA - Agere Systems is trying to find a buyer for its wafer fab in Orlando, FL.

01/24/2002  Manila, Philippines - Intel Philippines is set to invest an additional $78 to $97.5 million at its plant to produce Pentium 4 microprocessors made on 0.13-micron technology, and other microprocessors, on Intel's 300mm wafer fab technology.

01/24/2002  Chemists at U-Cal, San Diego have discovered that silicon wafers can be easily made into tiny explosives that might be used one day to chemically analyze samples in the field or serve as power sources for teensy electronic sensors the size of a speck of dust.

01/22/2002  Ottawa, Canada - Zarlink Semiconductor has signed a definitive agreement with DALSA Corp. to sell its foundry facility in Bromont, Quebec, and related business to DALSA for CDN$27 million.

01/22/2002  Jan. 22, 2002 - Campbell, CA - Silicon Genesis Corp. (SiGen), a developer of SOI wafer technologies, and Umicore, a Belgian-based metals and materials supplier, are collaborating to manufacture thick silicon-on-insulator wafers for electronic, photonic, and MEMS applications.

01/21/2002  Two more potential big users have signed on to the Low Energy E-Beam Projection Lithography consortium (Leepl). Matsushita Electric Industrial and Sharp will now join Sony, Rohm, NEC, and Texas Instruments in working on developing the low-cost alternative next generation lithography technology.

01/18/2002  Jan. 18, 2002 - San Jose, CA - Toshiba America Electronic Components Inc. (TAEC) has unveiled a new 32-bit MIPS-based microprocessor (MPU) targeted at automotive information display applications such as instrument clusters, dashboard graphics, and navigation systems.

01/17/2002  Jan. 17, 2002 - Fremont, CA - Therma-Wave Inc., a worldwide developer and manufacturer of process control metrology systems, has completed its acquisition of Sensys Instruments Corp.

01/17/2002  Jan. 17, 2002 - Migdal Haemek, Israel - Tower Semiconductor has successfully completed the installation of a pilot production line for its new 0.18-micron process technology.

01/17/2002 
Inkjet technology, one of the first applications of microfluidics, is finding many uses beyond the printed page. Microjets are being put to work printing "plastic" circuitry, fabricating display screens from organic light-emitting diodes and laying down microarrays for DNA research and drug discovery.

01/16/2002  Looking for an application that will bring the IC industry out of its current slump? Consider the projected growth of broadband and in particular the microelectronics necessary to establish "residential gateways" and "simple to use home networks."

01/16/2002  Jan. 16, 2002 - Taipei, Taiwan - IC assembly and testing service providers Walton Advanced Electronics Ltd., Walsin Advanced Electronics Ltd., and Powertech Technology Inc. have decided to halt their merger plans.

01/16/2002  Jan. 16, 2002 - Tokyo, Japan - Worldwide orders for Japanese semiconductor manufacturing equipment fell for the 11th straight month in November.

01/11/2002  January 10, 2002 -- HONG KONG -- Technology giant Motorola Inc. announced today that will cut 1,200 to 1,300 chip manufacturing jobs in Austin, Texas, and Sendai, Japan, as part of a cost-cutting move to consolidate production at its other plants.

01/11/2002  Jan. 11, 2002 - Santa Clara, CA - Integrated Device Technology Inc. (IDT) will consolidate its wafer fab operations into the company's Hillsboro, OR manufacturing facility by 2H02.

01/10/2002  Jan. 10, 2002 - San Diego, CA - Cymer Inc. has unveiled its latest krypton fluoride (KrF) production light source-the ELS-7000.

01/10/2002  A new technology dubbed "resistive quartz" shows promise of providing advantages over conventional methods of heating fluids used in wafer processing without contaminating them. In addition, this technology is better able to handle changing process flow demands reliably.

01/10/2002  Jan. 10, 2002 - Schaumburg, IL - Motorola Inc. is set to cut 1,200 to 1,300 chip manufacturing jobs in Austin, TX, and Japan. The job cuts, to take place over nine to 15 months, are among the 4,000 semiconductor job cuts previously announced, spokeswoman Gloria Shiu said in Hong Kong.

01/10/2002  Jan. 10, 2002 - Seoul, Korea - Employees who were laid off from Hynix Semiconductor Inc.'s Eugene, OR, plant last summer could be back at work next week.

01/10/2002  Jan. 10. 2002 - Utsunomiya, Japan - MEMC Electronic Materials Inc. has completed the transition of its center of excellence (COE) from a pilot line to a full-scale 300mm silicon manufacturing site.