Table of Contents
Solid State Technology
Year 2010
Issue 1
 | COLUMNS
Editorial
Life after the
Pete Singer, Editor-in-Chief
Industry Forum_2
Innovation on the interface between disciplines
The semiconductor industry is positioning itself on the plane of two complementary axes—the traditional scaling or More Moore axis, and the More than Moore axis. Luc Van den hove, IMEC, Leuven, Belgium
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DEPARTMENTS
World News.html
World News
Tech News
IMAPS 2009: Fusion bonding for 3D/TSV, wafer-level/multichip packaging for MEMS
Tech News
Getting greener: New fab EHS benchmark tool debuts
Tech News
Improved tungsten deposition for 3Xnm logic, memory
Product News.html
Product News
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FEATURES
Cover Article
All-wet stripping process for highly implanted photoresist
An all-wet photoresist removal process has been developed that reduces the number of process steps and eliminates the potential for plasma-induced substrate damage, while minimizing substrate material loss. Ron Nan, Freda Lee, Jey Hung, SMIC, Shanghai, P.R.C.; James. M.M. Chu, Jack Yuan, David Yang, FSI International, Hsinchu, Taiwan R.O.C., Jeffery W. Butterbaugh, FSI International, Chaska, MN USA
Technical Forecast
Executive viewpoints: The recovery has arrived!
The conventional wisdom is that scaling will continue at the traditional pace defined by Moore's Law well into the future. To gain insight into what technologies will be required , and what impact the recent downturn had on technology development, leading executives provide their perspectives on what 2010 will bring.
Technical Forecast0
For 2010, marketplace optimism abounds
Booming. Recovery. Upturn. Choose your favorite optimistic word, and that is what many analysts surveyed by Solid State Technology are projecting for the semiconductor market in 2010.
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