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January 27, 2012 — Straight outta Purdue University, a miniaturized implantable medical micro electro mechanical (MEMS) pressure sensor chip can be recharged with the block-rockin beats — acoustic waves — of rap music. The device could help regulate conditions like aneurysms, or incontinence due to paralysis.

Figure 1. The principles behind the operation of a miniature medical sensor powered by acoustic waves, notably from rap music. SOURCE: Birck Nanotechnology Center, Purdue University.

The sensor uses a cantilever that vibrates to the rhythm of the boogie at 200-500 hertz. Acoustic energy from a strong bass component reaches this frequency, and can pass through popping & locking body tissue. These vibrations generate electricity, storing a charge in a capacitor, said Babak Ziaie, a Purdue University professor of electrical and computer engineering and biomedical engineering. When the frequency falls outside of the proper range, the cantilever stops vibrating, automatically sending the electrical charge to the sensor, which takes a pressure reading and transmits data as radio signals. As the bass line drops, the frequency is continually changing, inducing the sensor to repeatedly alternate intervals of storing charge and transmitting data.

Figure 2. The miniature pressure sensor designed to be implanted in the human body. Good vibrations from music or plain tones drive a vibrating cantilever, generating a charge to power the sensor. SOURCE: Birck Nanotechnology Center, Purdue University.

The cantilever beam is lead zirconate titanate PZT by nature, a piezoelectric ceramic material that generates electricity when compressed. The sensor is about 2cm long.

A receiver that picks up the data from the sensor could be placed several inches from the patient. "You would only need to do this for a couple of minutes every hour or so to monitor either blood pressure or pressure of urine in the bladder," Ziaie said. "It doesn’t take long to do the measurement."

Playing tones within a certain frequency range also can be used instead of music. "A plain tone is a very annoying sound," Ziaie said. "We thought it would be novel and also more aesthetically pleasing to use music." Researchers experimented with four types of music: rap, blues, jazz and rock. "Rap is the best because it contains a lot of low frequency sound, notably the bass," Ziaie said.

Researchers tested the device in a water-filled balloon. The sensor is capable of monitoring pressure in the urinary bladder and in the sack of a blood vessel damaged by an aneurism. Such a technology could be used in a system for treating incontinence in people with paralysis by checking bladder pressure and stimulating the spinal cord to close the sphincter that controls urine flow from the bladder. More immediately, it could be used to diagnose incontinence. The conventional diagnostic method now is to insert a probe with a catheter, which must be in place for several hours while the patient remains at the hospital.

"A wireless implantable device could be inserted and left in place," Ziaie said, allowing patients to be monitored with fewer restrictions. Conventional implantable devices are powered by batteries or inductance coils and transmitters that must be precisely and closely aligned..

The MEMS device was created in the Birck Nanotechnology Center at Purdue University’s Discovery Park. A patent application has been filed for the design.

Findings are detailed in a paper to be presented during the IEEE MEMS conference, which will be Jan. 29 to Feb. 2 in Paris. The paper was written by doctoral student Albert Kim, research scientist Teimour Maleki and Ziaie.

Learn more at www.purdue.edu.

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January 27, 2012 — Genalyte developed and produced a set of disposable silicon photonics biosensor chips with research body imec, for use in its diagnostic and molecular detection equipment. The chips use imec’s standard silicon photonic waveguide devices, modified for bio-compatibility.

These chips allow for high levels of multiplexed biosensing due to the high integration level of Si photonics.

A bio-compatible passivation technology was developed on 200mm wafers with high yields. The chips contain up to 128 proprietary ring resonator sensors coated by Genalyte with application-specific chemistry to create very sensitive molecular detection capability. On-chip grating couplers are used to couple the infrared light from and to Genalyte’s diagnostic equipment. The chips were tested in the field.

More Si photonics work at imec:

Imec’s silicon photonics platform densely integrates photonics and electronics, manufactured on standard microelectronic CMOS manufacturing processes. The high quality and reproducibility of the photonic waveguides and devices with features measuring 100-500nm requiring nm-scale accuracy are the keys to high yield. Genalyte first made a proof-of-concept using Multi-Project Wafers access to imec’s Silicon Photonics technology under ePIXfab (www.epixfab.eu).

The Si-photonics biosensor chips were made as part of imec’s silicon photonics CMORE service. Via this initiative, imec offers companies all the services needed to turn innovative ideas into smart packaged microsystem products. The CMORE toolbox includes 200mm CMOS, Si-photonics, MEMS, image sensors and device packaging. Services also cover design, testing and reliability, bringing products from feasibility studies to design, technology development, prototyping and low-volume manufacturing. Imec also is able to guide companies in tranferring to volume production at a foundry.
 
Imec performs world-leading research in nanoelectronics. Imec’s research activities in the field of silicon photonics are coordinated closely with those at Ghent University. The Photonics Research Group in the Department of Information Technology of Ghent University has been active in photonic integration for more than 20 years. Since 2000 the focus has shifted to silicon photonics. Further information on imec can be found at www.imec.be.

Genalyte Inc. is a privately held company focused on improving the costs and performance of diagnostic and life sciences molecular testing.  To this end, Genalyte has developed a next-generation molecular detection capable of higher levels of multiplexing, high sensitivity and faster time-to-result directly from clinical samples. Learn more at www.genalyte.com

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January 26, 2012 — The Joint Quantum Institute (JQI), the Neils Bohr Institute in Copenhagen, and Harvard University researchers developed a theoretical method for detecting weak electrical signals, using a nanomechanical "loudspeaker" and laser-based photon signals.

"We envision coupling a nanomechanical membrane to an electrical circuit so that an electrical signal, even if exceedingly faint, will cause the membrane to quiver slightly as a function of the strength of that signal," says JQI physicist Jake Taylor. "We can then bounce photons from a laser off that membrane and read the signal by measuring the modulation of the reflected light as it is shifted by the motion of the membrane. This leads to a change in the wavelength of the light."

If demonstrated through experiment, the work could have a tremendous impact on detection of low-power radio signals, magnetic resonance imaging (MRI), and the developing field of quantum information science.

Figure. The proposed nano mechanical device detecting a signal produced by the quantum-mechanical spin of a group of atoms. The atoms generate a faint radiofrequency signal in a coil (L) connected to microscale wires that form an electrical capacitor. This vibrates the nanomembrane, which in turn affects the resonant frequency of a laser optical cavity. The output is light at frequency that is the sum of the original laser frequency plus the signal from the atoms. SOURCE: Taylor/NIST.

The ability to detect extremely faint electrical signals could improve MRI medical procedures, reducing the size of the superconducting magnets and eliminating the scan tube.

The concept could also be applied in photonics communications, according to Taylor. One popular quantum information system design uses light to transfer information among qubits, entangled particles that will exploit the inherent weirdness of quantum phenomena to perform certain calculations impossible for current computers. The ‘nanospeaker’ could be used to translate low-energy signals from a quantum processor to optical photons, where they can be detected and transmitted from one qubit to another.

According to the team’s calculations, translating the mechanical motion of the "loudspeaker" device into photons will siphon a considerable amount of heat out of the system (from room temperature to 3 kelvin or -270C), reducing noise during signal detection.

The concept is reported at: J. M. Taylor, A. S. Sørensen, C. M. Marcus and E. S. Polzik. Laser cooling and optical detection of excitations in a LC electrical circuit. Phys. Rev. Lett. 107, 273601. Published online Dec. 27, 2011. Access it here: http://link.aps.org/doi/10.1103/PhysRevLett.107.273601

The JQI is a collaborative venture of the National Institute of Standards and Technology (NIST) and the University of Maryland, College Park.

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January 25, 2012 — Heidelberg Instruments launched the µPG 501 table-top direct-write lithography system for prototyping micro electro mechanical system (MEMS), integrated optics, microfluidic/lab-on-a-chip, and other devices as well as mask production.

The µPG 501 can write structures down to 1μm 50mm²/min, offering an exposure time of less than one hour for a 2" x 2" pattern. μPG 501 is equipped with a high power LED light source; standard available wavelengths are 390 or 405nm (others on request). The light engine features the Digital Micromirror Device (DMD) as the imaging device. The μPG 501 can expose standard positive and negative photo resists as well as UV-resists such as SU8. Since the intensity dose is not limited, the system is suitable for applications which require thick resists. Utilizing sophisticated Gray Scale Exposure technology, the μPG 501 has the ability to create 3 dimensional structures such as blazed gratings or micro-lenses.

The system occupies a 60 x 75cm² footprint. It uses data conversion software to provide basic design operations, and features a viewer for the design data as well as for the converted pixel data. The software supports multiple data formats such as GDSII, DXF, GERBER, CIF, BMP, and STL.

The integrated metrology system enables the μPG 501 to do overlay exposures either by manual or automatic alignment to multiple targets on the substrate. Heidelberg Instruments’ Autofocus System compensates for flatness variation of the substrate in real-time. Custom made vacuum chucks can hold substrates up to 5" diameter. The stage is driven by linear motors and controlled by encoders at a resolution of 20nm.

Heidelberg Instruments produces high-precision maskless lithography systems for direct writing and photomask production. Learn more at http://www.himt.de/en/home/.

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January 25, 2012 — SCHOTT North America Inc. introduced MEMpax borosilicate glass for use in micro electro mechanical systems (MEMS) manufacturing, available in thicknesses from 1.1 to 0.1mm.

MEMpax glass is produced in the same way as the company’s AF32 and D 263, then finished with a fire-polished surface, for the needs of MEMS and related ultra-thin borosilicate glass applications. Fire polishing gives the glass a high-quality, pristine surface and can help reduce processing costs.

The new glass shares physical, thermal, and chemical properties with the company’s Borofloat 33. The material properties of MEMpax allow anodic bonding with silicon wafers: Under the influence of temperature and pressure, ions diffuse between silicon and glass, which results in a hermetic bond, protecting the silicon wafer elements or connecting various components. The glass boasts a coefficient of thermal expansion (CTE) corresponding to silicon’s CTE to avoid warpage in bonding.

The glass is a high-quality insulator with low alkali content. It maintains good dielectric properties up to 450°C.
 
SCHOTT North America can be found at www.us.schott.com.

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January 24, 2012 – PRWEB — Si-Ware Systems (SWS) debuted the Silicon integrated Micro Optical System (SiMOST) platform to fab and package single-chip optical systems with validated micro electro mechanical system (MEMS) components. Multiple optical MEMS (MOEMS) structures can be patterned and etched on silicon on insulator (SOI) wafers using deep reactive ion etching (DRIE). The structures are then wafer-level packaged and diced to create a one-chip optical system.

SiMOST eliminates alignment for optics by lithographically aligning optics on-chip. Si-Ware claims this method reduces costs and package size, and improves chip reliability under shock and vibration.

“For the first time an optical designer has the freedom to design very complex systems with as many components as necessary with no impact on cost of assembly and bill of materials,” said Bassam Saadany, Division Manager for MEMS at SWS. “With SiMOST, optical systems can achieve economies of scale that are similar to the micro-electronics industry in terms of size and cost, which opens up a range of applications and market opportunities.”

SWS has created a library of building blocks for its SiMOST platform that designers can use in creating their optical systems. Optical components include flat, cylindrical and spherical collimating mirrors; wide bandwidth beamsplitters; optical filters; and moving corner cube reflectors. MEMS components include long travel range micro-actuators and micro-motors.

SiMOST has been demonstrated, manufacturing a fully monolithic FT-IR spectrometer and a swept laser source.

The SiMOST platform is complemented by SWS’s ASIC solutions division, which provides interfacing and control circuits. These interface and control ASICs handle the MEMS control, current, voltage and capacitive sensing, data conversion via ADC/DAC, and data processing.

SWS is presenting more details on its SiMOST set of solutions at Photonics West 2012 in San Francisco bJanuary 24-26, Moscone Center, North Hall, Booth #4004. SWS will present on SiMOST technology, January 25 at 12:30PM in the North Hall.

Si-Ware Systems (SWS) is an independent fabless semiconductor company providing a wide spectrum of product design and development solutions, custom ASIC development and supply as well as standard products.

SWS leverages its highly talented teams in MEMS design and development as well as Analog/Mixed-Signal and Radio Frequency (RF) Integrated Circuits (ICs) to provide highly innovative solutions and products in different areas ranging from PLL based timing circuits, sensor interfaces, frequency synthesis, data converters, RF front-ends, and MEMS based sensor systems. For more information, please visit http://www.si-ware.com.

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January 24, 2012 – PRNewswire-USNewswire — 4Wave Inc., thin film equipment maker, received several orders at the end of 2011 for its 200mm Ion Beam Sputtering systems, to be used in micro electro mechanical systems (MEMS) manufacture at semiconductor foundries.

4Wave’s Ion Beam Sputtering system can atomically deposit dielectric material for MEMS devices, allowing the user to select the optical characteristics of the film deposited. 4Wave’s system is designed to process 200mm wafers in a 24/7 manufacturing environment.

Also read: Semiconductor sputtering targets headed for 2012 market peak

4Wave provides ion beam thin film processing equipment and coatings services to meet challenging thin film processing requirements. Using its atomic layer processing capabilities, 4Wave also offers multilayer device fabrication and miniature optical components. Learn more at www.4waveinc.com.

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January 23, 2012 – PRNewswire via COMTEX — Pure-play MEMS foundry Silex Microsystems joined "Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices," or EPAMO, which is a European Union funded program developing new technologies for high performance RF systems, energy-efficient mobile communication systems, highly miniaturized and integrated RF components, and cost-efficient mobile phone component technologies.

Silex will develop high-performance metal through-silicon vias (TSV) for RF applications, PZT piezoelectric thin film technologies for actuator manufacture, and advanced integrated passive devices (IPD) using through-wafer processing and advanced materials development. This program leverages Silex’ expertise in 3D through-wafer processing to develop new micro electro mechanical system (MEMS) capabilities, says Dr Thorbjorn Ebefors, chief technologist at Silex Microsystems. "These new techniques will be used to fabricate high-density integrated inductors, resistors and capacitors for new classes of devices," Ebefors added.

RF MEMS have gained a great deal of interest from mobile electronics followers recently, when a WiSpry RF MEMS component was identified in a major Samsung smartphone. WiSpry confirmed the design win.

EPAMO will develop new advanced wafer materials and RF component designs, combining new thin film materials and thin film technologies with CMOS solutions and advanced 3D packaging technologies. Silex is the only pure-play foundry involved in EPAMO.

EPAMO is coordinated by Dr. Thomas Metzger of EPCOS AG (RF filters and module solutions provider for the RF front-end of mobile phones). For more information see www.epamo.eu.

ENIAC JU (European Technology Platform on Nanoelectronics Joint Undertaking), a public-private partnership between the European Commission, 21 European countries and various nanoelectronics actors funds euro 2.2 M of EPAMO budget. National public funding from the participating nations covers euro 5.5 M, and euro 5.6 M comes from EPAMO partners. For more information see www.eniac.eu.

Silex Microsystems a pure-play MEMS foundry with production operations totaling 25,000 square feet and dedicated lines for both 6" and 8" wafers. For more information see www.silexmicrosystems.com

January 23, 2012 — Texas Instruments (TI, NASDAQ:TXN) DLP Products released DLP LightCrafter, an advanced, compact evaluation module for TI’s spatial light steering DLP technology. Designers can use the evaluation module to create industrial, medical, security and scientific products, among others.

The evaluation kit is built around the reference design for Texas Instruments’ 0.3" WVGA resolution DLP chipset for high-speed spatial light modulation. The chipset comprises the DLP3000 micro electro mechanical system (MEMS) device with 415,872 microscopic mirrors, and the DLPC300 controller for high-speed operation of the micromirror array. DLP LightCrafter integrates the 0.3 WVGA chipset with an RGB LED light engine that is capable of producing more than 20 lumens of light output. DLP LightCrafter also includes Texas Instruments’ TMS320DM365 embedded processor; 128MB of NAND flash memory for pattern storage; an embedded Linux OS; and a configurable I/O trigger for integrating cameras, sensors, and other peripheral devices.

THe 0.3" WVGA chipset displays up to 4000 binary patterns per second, and is commonly used in pico projectors.

DLP LightCrafter offers enhanced processing speed and power for developers to create, store, and display high-speed pattern sequences through DLP LightCrafter’s USB-based application programming interface (API) and graphical user interface (GUI). It joins TI’s development kit platform, targeting reduced development time and greater creativity.

"Over the past few years, our company has had great success in using DLP’s development tools to build out our designs for contactless, 3D fingerprint scanners, among other biometrics products," said Mike Troy, CEO, FlashScan3D. "DLP technology allows us to capture greater detail in fingerprints with higher accuracy, thus cutting down on the possibilities of technician error and fraud, and with the new DLP LightCrafter development module, we can scan prints faster, store data internally versus on a laptop or separate storage device and, because of its size, create even smaller, portable products."

Texas Instruments will show DLP LightCrafter at SPIE Photonics West, January 24-26 in San Francisco, CA at booth #2415.

Texas Instruments (NASDAQ: TXN) is a global semiconductor company. Texas Instruments’ award-winning DLP MEMS display technology has powered the world’s top projectors and displays, delivering pictures rich with color, contrast, clarity and brightness to screens of all sizes. DLP’s technology spans movie theaters (DLP Cinema) and large-scale, professional venues; in conference rooms, classrooms, and home theaters; and with DLP Pico-enabled mobile devices, the ability to project images from the palm of your hand. Learn more at www.TI.com/DLPLightCrafter.

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January 20, 2012 — MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live and Mediplas, a show focused on design and manufacture of plastic parts for the medical industry, as well as Sensing Technology 2012. The 5 shows showcase engineering and manufacturing technology in the UK with a projected attendance of 6,000.
 
To present at MM, MEMS & NANO Live, submit an abstract on:

  • Micro Molding of Plastics
  • Powder (PIM), Ceramic (CIM), Metal (MIM) Micro Molding
  • Conventional Micro Machining Techniques
  • New/Emerging Micro Machining Techniques
  • Micro Fabrication, Welding, Assembly
  • Micro Metrology: Optical, Tactile, CMMs
  • Advances in MEMS & Nano Manufacturing Processes
  • The Path to Commercialization for NANO and MEMS Technologies

All submissions must be non-promotional in content and presented by companies or institutions that are utilizing and/or researching technologies for an industrial application. Exhibitors are welcome to submit practical application-based case studies.

Interested parties should submit an abstract by February 28. This should include the working title, all authors/contributors and their affiliations. All submissions will be reviewed to ensure that they meet the necessary and exacting requirements of the Micro Manufacturing Conference. Anyone submitting a presentation must be available to present on either day. Submit abstracts to Aleksandra Wisniewska via email: [email protected]. Learn more at www.mmliveuk.com.

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