11/14/2011 

Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.

11/11/2011 

Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.

11/11/2011 

Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality is significant. Researchers at imec experimented with different wafer fab technologies to make a record BSI sensor. They also consider new architectures/packaging techniques for this technology.

11/09/2011 

Deca Technologies, a new company backed by Cypress Semiconductor and SunPower, will combine solar wafer manufacturing methods with semiconductor manufacturing support to create wafer-level chipscale packaging (WLCSP) derivatives.

11/08/2011 

The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.

11/04/2011  Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.

11/04/2011 

Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson's name with the IMAPS Educational Foundation.

11/04/2011 

Multitest's Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.

11/02/2011 

MOSAID launched the 256Gb HLNAND2 semiconductor memory device, operating at up to 800MB/s per channel for mass storage applications. Winpac will package and distribute HLNAND devices for MOSAID.

10/31/2011 

ON Semi believes that its SANYO Semiconductor division's Thai operations in the Rojana Industrial Park have been severely damaged by Thailand's flood. Another facility in Bang Pa In, previously unaffected, is now flooded. ONNN says none of its employees in Thailand have been endangered by flood waters on-site.

10/31/2011 

Spansion Inc. (NYSE:CODE) will consolidate its 2 semiconductor assembly and test services (SATS) operations, closing its facility in Kuala Lumpur, Malaysia, to reduce costs by about $30 million annually.

10/28/2011 

Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.

10/28/2011 

Global Unichip Corp. (GUC; TW:3443) refined its business and technology model to become a full-service, flexible ASIC company. President Jim Lai refers to the model as GUC's branded Flexible ASIC Model, covering SoC integration, implementation methodologies, and integrated manufacturing.

10/27/2011 

Levi & Korsinsky is bringing a class action lawsuit against OmniVision Technologies Inc. (NASDAQ:OVTI) on behalf of stockholders that allege that OmniVision failed to disclose properly the loss of an exclusive contract with Apple for image sensors, in-house production delays, as well as other counts.

10/26/2011 

North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.

10/21/2011 

Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.

10/19/2011 

NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and RDL advanced packaging applications.

10/17/2011 

IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is the first IHS has encountered in a smartphone.

10/14/2011 

At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization

10/14/2011 

Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.