10/11/2011 

Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50

10/05/2011 

Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensure safe operation in high-voltage medical and industrial applications.

10/03/2011 

IMAPS 2011, the 44th International Symposium on Microelectronics, will take place in less than one week at the Long Beach Convention Center. Ahead of the show, here are some of the highlights for attendees.

09/30/2011 

Amkor will acquire Toshiba Electronics Malaysia Sdn. Bhd., Toshiba

09/27/2011 

Cascade Microtech (NASDAQ:CSCD) completed the sale of its test socket manufacturing business for $550,000 to R&D Interconnect Solutions. Cascade's board of directors also authorized a stock repurchase program under which up to $2,000,000 of its common stock may be repurchased.

09/26/2011 

Invensas president Simon McElrea explains the company's new wire bond-based multi-die face-down (xFD) packaging technology, demo'd at this year's Intel Developer Forum, and its advantages in terms of performance and manufacturing cost reductions.

09/23/2011 

Research and Markets released "Wafer Packaging Fab Database," providing a global overview over 150 companies' 250+ mid-end semiconductor packaging houses.

09/22/2011 

X-RAY WorX GmbH introduced electronically controlled venting valves for open X-ray tubes. This avoids the manual venting typically performed during X-ray tool maintenance.

09/20/2011 

The first annual Global Interposer Technology Workshop at Georgia Tech will convene students, academics, researchers, and industry to share information on silicon and glass interposers for semiconductor packaging.

09/16/2011 

The Burn-in & Test Socket Workshop (BiTS Workshop) is changing its name to The Burn-in & Test Strategies Workshop to reflect the "evolution of packaged ICs."

09/15/2011 

Honeywell (NYSE:HON) Electronic Materials will more than double refining and casting capacity for high-purity copper and tin at its Spokane, WA, facility, citing increased demand from memory and semiconductor packaging sectors.

09/14/2011 

IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.

09/13/2011 

SEMICON Europa 2011 will take place October 11-13 at Messe Dresden in Dresden, Germany. The event covers new technologies and products for advanced microelectronics manufacturing. This year has more co-located events than ever before.

09/12/2011 

Rudolph Technologies Inc. (NASDAQ:RTEC) shipped the 1000th NSX Inspection System from its Bloomington, MN manufacturing facility. The NSX inspects wafer bumps, WLP, MEMS, and more.

09/08/2011 

Invensas Corporation, a Tessera subsidiary, will demonstrate dual-face down implementation of its new multi-die face-down packaging technology at the Intel Developer's Forum. The multi-die package is wire bonded, mounting ICs upside down and staggering them in a shingle-like configuration.

09/07/2011 

Forget "3D stacking" -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be much faster and more efficient than current chip technology.

08/31/2011 

Amkor Technology's Board of Directors authorized the repurchase of up to $150 million of AMKR common stock, to enhance stockholder value and support its business model.

08/29/2011 

Gold wires are used in electronic devices due to the material's flexiblity and conductive quality. At the nanoscale, however, gold wires (<20nm wide) become "brittle-like" under stress, according to a new study at Rice University.

08/29/2011 

GLOBALFOUNDRIES entered into a strategic partnership with Amkor (NASDAQ:AMKR) to develop integrated semiconductor assembly and test processes for advanced silicon nodes. The aim is integrated fab-bump-probe-assembly-test steps that can be commercialized across multiple customers and end-market applications.

08/26/2011 

Cabot Corp. (NYSE:CBT) will sell its Supermetals business to Global Advanced Metals (GAM), a supplier of tantalum ore to the Supermetals business.