08/03/2011 

Great Lakes Engineering will supply DEK's VectorGuard packaging and surface mount assembly stencil system to customers in 32 states and 3 countries.

08/03/2011 

Agilent and UC Davis established the Davis Millimeter Wave Research Center to develop advanced mm wave and THz systems for radar, sensors, imaging systems, communications and integrated passive devices (IPDs) found in electromagnetic metamaterials and antennae.

08/02/2011 

Data I/O Corporation (NASDAQ: DAIO) debuted the RoadRunner3 in-line programming system, a just-prior-to-placement programming tool with modules to automate processes and eliminate operator interventions.

08/01/2011 

SATS provider Unisem purchased a LTX-Credence PAx RF Test System for its Sunnyvale, CA, test development center, joining other recent test/wafer equipment purchases at the site.

07/28/2011 

Texas Instruments has shipped more than 30 million units of its PowerStack packaging technology, a combination of chip stacking and clip bonding that is designed to improve performance and chip densities in power management devices.

07/26/2011 

3D semiconductor packaging processes involve various groups, and standards are important in the hand-offs between them, explains Mark Berry, sales director at Metryx. He covers how to use metrology to protect wafer yields in 3D packaging.

07/22/2011 

Nippon Micrometal Corporation (NMC) licensed their single-layer-palladium (Pd) coated copper (Cu) bonding wire for LSI packaging to Tanaka Denshi Kogyo K.K., bonding wire manufacturer and traditionally a competitor.

07/21/2011 

OSAT Inari Berhad was listed on the Bursa Malaysia, Stock Code: 0166, in an IPO that will partly be used to fund a new packaging and test facility.

07/13/2011 

Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for scalable, adaptable leadframe packaging.

07/11/2011 

Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.

07/08/2011 

The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.

07/05/2011 

WACKER began operating several silicone-polymer production lines at its Burghausen, Germany, site, expanding production of high-purity specialty silicones, encapsulation and coating compounds, as well as UV-activated silicones.

07/01/2011 

Creative Materials now manufactures electrically conductive and electrically insulating adhesives for quartz oscillator circuits, used for bonding leads and lids. The low-stress adhesives feature good thermal stability with low out-gassing.

06/30/2011 

SEMICON West is a major conference for semiconductor manufacturing professionals. Semiconductor packaging has become a major focus in recent years, and this year, BEOL attendees have ATE Vision 2020, 3D IC standards meetings, a keynote, and multiple sessions dedicated to packaging technologies. Here's your guide to attending SEMICON West on a packaging track.

06/30/2011 

Advanced Semiconductor Engineering Inc. (ASE, TAIEX:2311) predicts that the global IC sector will face inventory adjustments in the near term. ASE will maintain its capital expenditure plan through the correction period.

06/28/2011 

Tien Wu, ASE; Rama K. Shukla, Intel; and Luc Van den hove, imec, are the honored presenters for SEMICON West 2011.

06/28/2011 

NEXX Systems installed 2 300mm Stratus deposition at a Korean IDM for high-volume wafer-level packaging processes.

06/28/2011 

The compact package suits mission-critical applications requiring up to 4GByte memory densities in smaller, faster packages with extended-temperature ranges.

06/27/2011 

Endicott Interconnect Technologies released an update on its defense electronics development and production and sustainment contracts, which totalled $101 million.

06/24/2011 

SEMICON West preview: This year's SEMICON West Advanced Packaging Program is taking a broad approach, encouraging participation from across the supply chain to help keep pace with a rapidly expanding electronics market -- and in markets beyond, from automotive to aerospace and medical.