05/01/2007  a strong technical program, about 70 exhibitors, and approximately 450 attendees checking out booths and listening to detailed keynotes and presentations. The show included a new vendor workshop on the exhibit floor and a Bond, James Bond theme complete with playing cards, tuxedos, and an energetic environment.

04/23/2007  April 23, 2007 - Samsung Electronics Co., Ltd., has developed an all-DRAM stacked-memory package using through-silicon vias (TSVs) housed in aluminum pads to avoid performance slow-downs caused by the redistribution layer.

04/23/2007  April 23, 2007 - Innovative Micro Technology has begun offering getter deposition services of wafer-level packaging (WLP) of MEMS devices and other components requiring a hard vacuum, saying it has demonstrated vacuum levels below 10 mTorr for inorganic devices, equal to or better than industry standard.

04/21/2007  April 20, 2007 -- MCLEAN, VA -- INTERPHEX 2007, in partnership with the International RFID Business Association (RFIDba), announced today that Dr. Paul Rudolph, former FDA senior policy advisor, will launch the RFID conference track at Interphex 2007 with an update on statutory and regulatory oversight of the pharmaceutical supply chain and its effect on RFID tagging of products.

04/21/2007  April 18, 2007 -- /ABI PR/ -- BUFFALO, NY -- Multisorb Technologies International, a leader in active packaging technologies, today announced that it has acquired Silgel Packaging Ltd. (Telford, UK), a subsidiary of AMCOL Minerals Europe Ltd. (AME) and AMCOL International located in Arlington Heights, IL.

04/20/2007  Nan Ya PCB Corporation added an additional line to its flip chip substrate production capacity, increasing output to 30 million units monthly. The line will produce seven million units, reports Taiwan's China Economic News Service (CENS).

04/20/2007  Innovative Micro Technology (IMT) began offering getter deposition services of wafer-level packaging (WLP) of MEMS devices, and other components requiring a hard vacuum. In testing, IMT reportedly demonstrated vacuum levels below 10 mTorr for inorganic devices — equal to or better than industry standard.

04/18/2007  Tronics Microsystems SA expanded its characterization, assembly, packaging, and testing capabilities with additional space and tools. The expansion will support design-to-manufacturing services, and support its MEMS device supply chain.

04/17/2007  By Françoise von Trapp, managing editor

Tessera Technologies, Inc., launched an interconnection platform intended to address technical limitations of current-generation packaging technologies, such as pitch, profile, performance, reliability, and test capacity. The company expects this technology to become a fundamental building block of next-generation mobile, computing, and consumer electronic products.

04/11/2007  NEXX Systems, a provider of processing equipment for advanced wafer-level packaging applications, has named Didier Andre as Director of European Customer Operations. Andre will work closely with NEXX's distributor, TELTEC, to strengthen NEXX's position with existing customers and to establish new opportunities in Europe.

04/04/2007  Infotonics gains MEMS fabrication and packaging flexibility with new SUSS bonding systems

04/02/2007  Wafer-bumping service provider IC Interconnect (ICI) and Jiangyin Changdian Advanced Packaging (JCAP), which produces solder, gold, and pillar bumps, formed an international alliance to transfer ICI technologies to Asia and JCAP bumping services to North America.

04/01/2007  The snow in New England was turning gray. Even skiing had lost its appeal.

03/26/2007  March 26, 2007 - IBM says it has developed a prototype optical transceiver chipset for supercomputing applications that incorporates optical and CMOS components in one system-in-package (SiP).

03/26/2007  Quantum Leap boasts "industry breakthrough" in hermetic packaging

03/21/2007  Sensor Platforms' new SSP1401 six-channel interface is designed for high-volume applications demanding sensor fusion capability. The chip aims to help product designers save on cost, power consumption, and space; and it supports a wide variety of sensors.

03/12/2007  March 12, 2007 - IMEC, the independent research center based in Belgium, has announced that the Flemish Minister of Science and Innovation, Fientje Moerman, signed a new frame agreement between IMEC and the Government of Flanders for the period 2007-2011.

03/06/2007  With the 8^th annual Burn-in Test and Socket Workshop (BiTS) coming up March 11–14 in Mesa, AZ, Advanced Packaging collected news, events, and products around the industry focused on test, sockets, and the BiTS event. Meet the Press at BiTS, March 12, to learn more about editorial submissions, and the variety of publishing opportunities available to the industry.

03/01/2007  March 1, 2007 - Singapore Technologies Semiconductors Pte. Ltd. (STS), a subsidiary of state-owned holding firm Temasek Holdings Ltd., has filed a $1.6 billion cash offer to acquire full ownership in backend services firm Stats ChipPAC.

03/01/2007  This issue of Advanced Packaging stands out for me because I had a chance to get to know more about practical issues that revolve around sockets.