Wafer Level Packaging

WAFER LEVEL PACKAGING ARTICLES



Kulicke & Soffa to Acquire Alphasem

10/12/2006  Kulicke & Soffa Industries, Inc. signed an agreement to acquire Alphasem from Dover Technologies International, Inc., a subsidiary of Dover Corporation. Alphasem supplies die-bonder and MEMS packaging equipment. In 2005, the company generated approximately $60 million in sales of die bonders and related materials, with 260 employees.

Dynamic Summits from Cadence and Microsoft

10/11/2006  huge screens, video demonstrations, special effects — they also tend to bring in dynamic speakers and provide an opportunity for networking among various players in the supply chain.

FlipChip Int. Develops Lead-free Technology

10/11/2006  FlipChip International LLC (FCI) demonstrated a product with an approximately 10× enhancement of reliability compared to standards of JEDEC JESD22-B111 Drop Test Specification for wafer-level chip-scale packaging (WLCSP) products. The company announced that enhanced lead-free (ELF) technology — developed at its Advanced Reliability Laboratory in Phoenix, AZ — combines advanced metallurgy and polymer technologies for reliability improvements.

Gail Flower to Keynote SWEPEX

10/06/2006  Gail Flower, editor-in-chief, Advanced Packaging Magazine, will interpret the progress of SMT as a "dance" spinning "upside down and round" in a keynote address during a November 15th luncheon at the Southwest Electronics Production Exposition (SWEPEX), November 14 – 15, 2006, in Plano, Texas.

Indium Certifies 11 Employees Six Sigma

10/05/2006  Eleven Indium Corporation employees achieved Dartmouth Six Sigma Green Belt Certification, for demonstrated "proficiency in developing and executing design experiments to support continuous process improvements at a competent level."

Chinese firm announces nano-enabled packaging products

10/05/2006  Shanghai Jinkui Packaging Material Company Limited of Ningbo, China, a wholly owned subsidiary of Dragon International Group Corp., announced it has completed the development of two new packaging products by using nanotechnologies.

Packaging Experts Look to the Future

10/02/2006  SMT Magazine's panel at SMTA International focused on the possibilities and trends opening up in the packaging realm. SMT and Advanced Packaging editor-in-chief Gail Flower moderated the panel, with managing editor Michelle Boisvert to co-chair. The main point that could not be emphasized enough was the effect of 3-D packaging on the industry.

Solid-state Memory Growth for Packaging

10/01/2006  The removable solid-state storage (RS3) market posted strong growth in 2005, as consumer demand for flash cards and universal serial bus (USB) flash drives continued.

Taking Care of Business and Working Overtime

10/01/2006  How often have we heard, “Nothing personal; I know it’s not right, but it is good business”? To that I say, “No way.

Tessera and Flextronics Sign Licensing Agreement for Shellcase CF

10/01/2006  SAN JOSE, CA - Further paving the way into the consumer optics arena, Tessera announced the first licensing agreement for their wafer-level image sensor packaging technology, Shellcase CF, to Flextronics International Ltd.

AMD Licenses MTBSolutions Ultra-flat Package Technology

09/27/2006  Advanced Micro Devices (AMD) announced that they have licensed ultra-flat package technology (UFPT) from MTBSolutions (MTBS). UFPT is primarily used for large-scale flip chip packaging structures where package flatness and the corresponding stress transmitted to the Si chip is a concern.

TAP partner Amkor joins IBM/Chartered/Samsung alliance

09/26/2006  September 26, 2006 - The chipmaking manufacturing alliance led by IBM, Chartered Semiconductor Manufacturing, and Samsung Electronics Co. Ltd. has added another supplier to their roster. Amkor Technology Inc. is collaborating with the group to qualify 90nm and 65nm flip-chip packaging and design capabilities for the group's "Common Platform," and has begun 45nm qualifications for next-generation semiconductor applications.

Amkor Joins Common Platform; Partners with IBM, Chartered, and Samsung

09/26/2006  In an effort to optimize silicon/package interaction and leverage a cross-foundry manufacturing model, Amkor Technology, Inc. announced its partnership with the Common Platform Technology Collaboration, whose members include IBM, Chartered Semiconductor Manufacturing, and Samsung Electronics Co., Ltd. Initial efforts will be in qualifying 90-nm and 65-nm flip chip packaging and design capabilities.

STATS ChipPAC's IPD Technology Shifts into High Gear

09/25/2006  STATS ChipPAC Ltd., an independent semiconductor test and advanced packaging service provider, announced the transition of its integrated passive device (IPD) technology from engineering to high-volume production levels.

Qimonda, UTAC Extend Joint Technology Co-operation

09/25/2006  Singapore-based United Test and Assembly Centre (UTAC) announced the completion of its first R&D collaboration on ultra-thin, large die-stacking process development with Qimonda, Infineon Technologies memory spin-off. The companies will expand their collaboration to include advanced stacking and flip chip technology, and will extend the efforts for 18 months.

SMTAI Panel Investigates Packaging Potential

09/19/2006  The mantra of smaller, faster, cheaper has never been so relevant as in today's advanced packaging area. University professors, OEMs, and contract assemblers (EMS providers) will discuss packaging methods in a lively and informative panel hosted by SMT Magazine at SMTA International. "Future Directions in Packaging," will conclude with questions for and from the audience, and copies of the presentations.

Flextronics adds Tessera's WLP for camera modules

09/07/2006  September 7, 2006 - Flextronics International Ltd., an electronics manufacturing services (EMS) provider and the world's largest manufacturer of camera modules, has signed a deal with Tessera Technologies Inc. to incorporate wafer-level packaging technology in its entire camera module line.

Advanced Packaging Celebrates the APAs in Style

09/01/2006  On July 12, 2006, Advanced Packaging celebrated the 6th Annual APA Awards ceremony with style and panache.

Advanced Packaging: On the Move

09/01/2006  This Roadshow thing is taking on a life of its own. Our latest trip literally took us from coast-to-coast and back again.

Chip-package Co-optimization

09/01/2006  The packaging engineer’s long-time lament is the challenge of an over-designed or too large chip.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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