11/10/2004 

11/04/2004  (November 4, 2004) Singapore—Advanced Interconnect Technologies (AIT) announces the availability of a new family of etched leadless packages (ELP) that delivers design flexibility, increased density, and a reduced footprint.

11/04/2004  (November 4, 2004) San Jose, Calif.—Worldwide silicon wafer area shipments in the third quarter increased 1% sequentially and 25% from the third quarter of 2003, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. Silicon wafer area shipments totaled 1,629 million sq. in. during the most recent quarter, compared to the 1,619 million sq. in. in shipments reported during the previous quarter.

11/01/2004  (November 1, 2004) Troy, N.Y.—GlobalSpec, the specialized search engine and online resource for engineers and technical buyers, announces an expanded partnership with PennWell Corporation, a business-to-business media company providing print and online publications across multiple industries.

11/01/2004  At Amkor, we are addressing opportunities to expand the outsourced semiconductor assembly and test (OSAT) industry.

11/01/2004  Scientists at the Fermi National Accelerator Laboratory (Fermilab) are working on a new major high-energy physics project, the BTeV (B physics at the Tevatron) experiment.

10/15/2004  (October 15, 2004) Willow Grove, Pa.—Kulicke & Soffa Industries will hold a grand opening event on October 15, 2004 at its new state-of-the-art probe card manufacturing facility located in Hsin Chu, Taiwan.

10/15/2004  (October 15, 2004) Scharding and Radfeld, Austria—EV Group, a supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, a supplier of flip chip and die bonding equipment, announces a development agreement in the field of advanced-chip-to-wafer (AC2W) technology. The two companies also have agreed on joint strategic marketing and sales activities to promote the cooperation.

10/13/2004  (October 13, 2004) Des Plaines, Ill.—As the WEEE and RoHS directives take effect in Europe, and with the increased production of lead-free products in Asia, lead-free assembly in North America is gaining momentum.

10/08/2004  (October 8, 2004) San Jose, Calif.—MEPTEC, the MicroElectronics Packaging and Test Engineering Council, plans to shake things up a bit with its next technical symposium, titled "Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration," on November 11, 2004 at the Hyatt San Jose.

10/05/2004  (October 5, 2004) Singapore and Fremont, Calif.—STATS ChipPAC announces reaching a milestone in its scale-up of full turnkey wafer-level chip scale package (WLCSP) wafer bumping, probe, and back-end processing services, with production run rates exceeding 4 million packaged units per month.

10/04/2004  (October 4, 2004) Taipei—China-based Jiangyin Changdian Advanced Packaging (JCAP) is setting up chip-scale packaging lines and wafer-bumping lines, slated for mass production next year.

10/01/2004  Chronically implantable retinal prostheses currently are under development to restore useful vision to blind patients with degenerative retinal diseases such as age-related macular degeneration and retinitis pigmentosa.

09/23/2004  (September 23, 2004) Singapore and Fremont, Calif.— STATS ChipPAC Ltd.'s Singapore operation has achieved ISO/TS 16949:2002 certification by PSB Certification Pte Ltd. This certification marks the fifth STATS ChipPAC operation to do so.

09/13/2004  September 13, 2004 - IBM and SUSS MicroTec AG have signed an agreement to develop and commercialize IBM's next-generation, 100% lead-free semiconductor packaging technology.

09/13/2004  (September 13, 2004) Munich, Germany and East Fishkill, N.Y.—IBM and SUSS MicroTec AG are working together to commercialize IBM's next-generation, lead-free semiconductor packaging technology, known as C4NP.

09/13/2004  (September 13, 2004) Danbury, Conn.—ATMI, Inc., a materials packaging supplier to semiconductor manufacturers, announced the sale of its Emosyn smart card business to Silicon Storage Technology, Inc. (SST) through a newly formed subsidiary, Emosyn International. Emosyn International will be held jointly by SST and ATMI.

09/10/2004  (September 10, 2004) San Jose, Calif.—Ultratech, Inc., a supplier of lithography and laser-processing systems used to manufacture semiconductors, announced that it received 300 mm advanced packaging lithography-system orders from three of Japan's top five semiconductor manufacturers. These companies will use the Ultratech tools—expected to ship by the end of 2004—for solder-bump applications.

09/08/2004  (September 8, 2004) Mountain View, Calif.—The MicroElectronics Packaging and Test Engineering Council (MEPTEC) will host a technical symposium titled "Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration," on November 11, 2004 at the Hyatt San Jose in San Jose, Calif.

09/01/2004  SUPPORT FOR TODAY'S EMERGING APPLICATIONS