10/01/2003  Chip scale packaging (CSP) has been driven primarily by the small form factors required for portable electronics and other high-density semiconductor applications. It has been shown that reliability requirements can be met in spite of the design constraints imposed by these applications. Even when the form factor dictates a stacked approach, ultra-thin CSPs can be stacked and still meet — and exceed — the physical and reliability requirements.

10/01/2003  Though markets tend to go in and out of fashion, it's important for those covering the industry to keep in touch. The optoelectronics market, for instance, has always been a bit elusive, just tantalizing us with possibilities.

09/01/2003  The potential of 90 nm application-specific integrated circuit (ASIC) designs is introducing new packaging challenges that threaten the IC designer's ability to take full advantage of this advanced process technology.

09/01/2003 

09/01/2003  Innovation again took center stage at Advanced Packaging's 2003 Advanced Packaging Awards Ceremony, held July 16 in conjunction with SEMI and the back-end portion of SEMICON West.

08/19/2003  Phoseon Technology Inc. has launched an automated optical inspection system for advanced packaging applications in MEMS, according to a news release.

08/11/2003  Palomar Technologies began life as a small assembly and test division of a major aerospace company. Two decades later, the company went out on its own, switched its focus from manufacturing assembly equipment to providing complete assembly-line products for high-end MEMS that require customized precision.

08/07/2003  August 5, 2005 - Polymer Assembly Technology, Billerica, MA, has opened up shop to offer flip-chip technology using polymer conductive adhesives. Founder and president Jim Clayton is the former director of R&D at Polymer Flip Chip Corp.

08/01/2003  It appears that past history again may be an indicator that growth is returning to the semiconductor industry. In our cyclic world of semiconductors, an increase in sales for the outsourcing of packaging and test services usually has been an early indicator that the industry has bottomed and a return to growth is on the way.

07/22/2003  Tessera 3-D Symposium Demonstrates Greater Supply Chain Cooperation, Advanced Packaging Media Sponsor SAN JOSE, CALIF. Driven largely by the wireless handset market and emerging high-performance computing requirements, the semiconductor industry is increasingly looking to advanced packaging solutions ... (July 17, 2003)

07/22/2003  Semiconductor Companies Take Center Stage at Advanced Packaging Award Program SAN JOSE, CALIF. On Wednesday, July 16, Advanced Packaging magazine honored top supplier companies and their staffs with the 2003 Advanced Packaging Awards at a ceremony held here at the McEnery Convention Center. (July 22, 2003)

07/17/2003  (July 18, 2003) K&S Announces a Volume Purchase Agreement with National Semiconductor; Semiconductor Companies Take Center Stage at AP Award Program; Tessera Presents 3-D Packaging Symposium

07/17/2003  The following is a selection of new products that you will see on the exhibitor floor at SEMICON West in San Jose, Wednesday, July 16, to Friday, July 18. See the SEMICON WEST EXHIBITOR LIST for booth numbers.

07/16/2003  (July 17, 2003) Asymtek Awarded Patents for Underfill Dispensing and Conformal Coating Techniques; BTU Debuts Integrated Line for Reflow Processing; Carsem Receives ISO/TS 16949:2002 Quality Management Systems Certification; Future Growth in Semiconductor Manufacturing will Rely on International Co-operation, Not Regional Rivalries; Camstar and Pilgrim Software Announce Partnership

07/11/2003  (July 16, 2003) Welcome to Day 1 of From the SEMICON West Tradeshow Floor, your e-show daily for the backend of SEMICON West in San Jose. For the Final Manufacturing (San Jose) portion...

07/11/2003  SEMI WEST NEW PRODUCTS (PART 1 OF 3) The following is a selection of new products that you will see on the exhibitor floor at SEMICON West in San Jose, Wednesday, July 16, to Friday, July 18. See the SEMICON WEST EXHIBITOR LIST in the next section of this newsletter for booth numbers.

07/08/2003  July 8, 2003 - IC stepper suppliers fell victim to the same market downswing as the rest of the industry in 2002, according to new research from VLSI.

07/01/2003  Liquid dispensers have long played an essential role in printed circuit board (PCB) assembly.

07/01/2003  The need for faster devices and smaller form factor has resulted in a prolific adoption of advanced packaging techniques. As semiconductor devices continue to migrate to smaller features, higher frequencies, higher power densities and lower voltages, the industry requires an aggressive packaging technology roadmap.

07/01/2003  The proliferation of new packaging families and variations today is more rapid than ever before.