Wafer Processing

WAFER PROCESSING ARTICLES



Micronas buys X-FAB foundry business stake

08/25/2011 

Micronas (SIX Swiss Exchange: MASN) is acquiring a EUR10 million stake in the X-FAB Silicon Foundries Group, which is also supporting Micronas with 0.18um high-voltage CMOS process with embedded flash manufacturing.

IC market to top $300 billion in 2013

08/24/2011 

The IC industry, which had a phenomenal growth year in 2010, is in a cautious mode under greater macro-economic uncertainty and hesitancy. Some positive milestones are on the horizon, however, shows data within IC Insight's Mid-Year Update, such as the 200 billion IC shipment milestone in 2011, and the $300 billion mark expected in 2013.

Camtek wins patent appeal against Rudolph

08/23/2011 

The U.S. Court of Appeals for the Federal Circuit issued an opinion yesterday vacating the adverse judgment against Camtek in a patent infringement case brought against it by August Technology Corp., now Rudolph Technologies Inc.

300mm wafer fab set to double within 5 years

08/23/2011 

Semiconductor manufacturing using 12" (300mm) wafers enables scalability for high-volume wafer fab. 300mm production will nearly double from 2010 to 2015 as IDMs and foundries recognize the value of 300mm wafers for mature products, according to IHS.

RBCN upgrages to larger sapphire wafer furnaces company-wide

08/18/2011 

Rubicon Technology (RBCN) completed company-wide enhancements to its proprietary crystal growth furnaces, upgrading to Rubicon Furnace Version ES2-XLG3.0, which produces large-diameter sapphire material with greater automation and higher yields.

MOCVD shipments stall, but restart in 2012

08/18/2011 

A rising LED surplus, slowed LED adoption, tighter credit in China, and other factors are converging to stall out MOCVD equipment installs in 2011. Once the LED oversupply is drained off, LED manufacturers will kickstart capacity expansions, likely in 2012, according to IMS Research.

Freescale, ATREG finally unload Scottish site

08/17/2011 

Three years after shuttering its East Kilbride operation, Freescale sloughs off the operation to a real estate developer, though it's leasing back some of the site for R&D.

Compact workcell kits 600 wafers in cleanroom conditions

08/17/2011 

CHAD Industries launched the WaferMate300-2SS sorter/stocker workcell with multiple customer installations. The compact wafer buffer modules each hold 150 wafers.

Taiwan's SAS climbs wafer ranks with Japan's Covalent

08/16/2011 

Taiwan's Sino-American Silicon Products (SAS) is acquiring Japan's Covalent Materials' (n

KLAC debuts 20nm-node defect inspection system

08/16/2011 

KLA-Tencor Corporation (NASDAQ:KLAC) launched the eDR-7000 electron-beam (e-beam) wafer defect review system for chip manufacturing at the 20nm device nodes and below.

Model-based mask data prep using overlapping shots for 20nm devices

08/16/2011 

OPC technologies use aggressive assist features with sub-80nm features on the mask to offer improved process window, and therefore yield. MB-MDP, coupled with new-generation mask-writing equipment, produces overlapping e-beam shots that result in lower shot count.

GaN-on-Si advances from Translucent and Bridgelux

08/15/2011 

Translucent launched its Si wafer templates commerically for GaN growth, and Bridgelux set a new Lumens/W record for Gan-on-Si LEDs.

AMAT buying VSEA, extends WFE, solar inroads

08/15/2011 

Applied Materials said it will acquire Varian Semi in a $4.9B deal. VSEA stockholders have now approved the buy.

Ultratech's market/technology strategies support revenue growth

08/11/2011 

Scott Zafiropoulo explains Ultratech's business and positioning strategies in an interview at SEMICON West, including how the company weathers market cyclicality and prepares for a 450mm wafer-size transition.

Ultratech to expand the time/temperature space of LSA for 20nm-14nm

08/09/2011 

IC manufacturers are becoming more aggressive with strain engineering as they go from 28nm to more advanced nodes, explains Jeff Hebb, VP of laser product marketing at Ultratech. The company is working on a dual-beam laser-spike annealing to address requirements for 20nm and 14nm.

Nonvisual semiconductor defect metrology today, at 22nm, and below

08/09/2011 

Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.

Silicon wafer shipments ride out Japan disaster

08/03/2011 

While silicon semiconductor wafer growth was nearly flat year-over-year -- up 1% in Q2 2011 over Q2 2010 -- the unbroken supply chain is impressive in the immediate aftermath of the earthquake and ensuing tsunami in Japan.

Unisem adds LTX-Credence tester to US test dev center

08/01/2011 

SATS provider Unisem purchased a LTX-Credence PAx RF Test System for its Sunnyvale, CA, test development center, joining other recent test/wafer equipment purchases at the site.

Silicon carbide fab parts benefit from restocking, increased adoption

08/01/2011 

Silicon carbide parts for semiconductor applications rose sharply in 2010, up 38% year-over-year to $200 million, according to Techcet. SiC fell 5% shy of the 2008 peak, and will see continued growth.

TI on analog IC platforms, fab expansions

07/29/2011 

Ricky Jackson, Texas Instruments (TI), discusses analog IC developments, and how analog and digital semiconductors are pursuing Moore's Law and More than Moore in different ways. He also touches on TI's new fab capacity.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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