Intel's Paul Otellini spoke at the International CES in Las Vegas, providing information on Intel's smartphone moves and ultrabook momentum, and debuting the 32nm Intel Atom SoC for tablets and hybrids.
Ramtron International Corporation shipped 50,000 initial low-energy, custom, nonvolatile ferroelectric random access memory (F-RAM) devices built on its new IBM manufacturing line in Burlington, VT.
WiSpry Inc. confirmed that its technology is used in the first mass-produced RF-MEMS-enabled handset. WiSpry's antenna tuner extends usable bandwidth for small form-factor antennas, dynamically compensates for user interference, and lowers energy usage.
Worldwide LED manufacturing capacity will reach 2M wafers in 2012, up 27%. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18%, shows SEMI.
Former SEMI president and CEO Stanley T. Myers was named a director emeritus of the association by itsl Board of Directors. Myers led SEMI for 15 years, was a board member for 24, and has been part of the semiconductor industry for more than 50.
The LCD TV Association, a global, not-for-profit marketing trade association for the LCD TV supply chain, added two new sustaining members: IC maker ATMEL Corporation and gas supplier Linde.
Increased I/O density, power/performance reqs, and other factors are increasing use of flip chip, 2.5D and 3D technologies, a boon to packaging subcontractors. But they face a challenge from foundries, and must navigate under-utilization of wire bonding capacity.
Lumiotec will use phosphorescent and other organic light emitting diode (OLED) technologies from Universal Display Corporation (NASDAQ:PANL), under an OLED technology license agreement.
The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company's first CEO Michael C. Holt. Lesaicherre spent 2 decades in the semiconductor and components industry.
Teledyne Microelectronic Technologies will expand its optical packaging portfolio in a partnership with Zephyr Photonics, which makes a proprietary high-temp vertical-cavity surface-emitting laser (VCSEL).
NXP Semiconductors unveiled an ultra-compact, high-precision MEMS-based frequency synthesizer, which challenges quartz-crystal-based devices for the timing market. The die is packaged with IC components in a standard, low-cost plastic package.
Packaging house Inari Berhad signed an MOU to acquire Amertron Global, which operates in the Philippines and China providing microelectronics and optoelectronics manufacturing services.
The new Samsung Focus Flash Windows smartphone includes a WiSpry RF MEMS device, starting off a 200x expansion of the RF MEMS industry through 2015, the analyst firm predicts.
Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.
