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Entering the optoelectronics industry has been an up-and-down affair for many. A few years ago in the late 1990s, assembly equipment suppliers for the semiconductor back-end industry became involved in optoelectronics

Four prominent trees grew on the perimeter of the city's Circular Park. The path due south from the cypress tree to the dogwood tree intersected the path due west from the baobab tree to the acacia tree at the Lion Fountain

Advanced Semiconductor Engineering Inc. (ASE) has launched its new multi-package ball grid array technology (MPBGA), a member of the multi-chip module (MCM) package family

The exhibit floor at the IMAPS Symposium was not exactly packed, but most conference attendees thought that the turnout and content made it worthwhile

At the IMAPS Advanced Technology Workshop on Optoelectronics Packaging (October 11-14, 2001, in Bethlehem, Pa.) the mood was upbeat and the technology quite innovative

Intel Corp. recently announced that it has demonstrated a new packaging technology that could enable the development of 20-GHz microprocessors by 2006 or 2007

SIPs at forefront of KGD Packaging and Test Workshop

LSI Logic Corp. and Advanced Interconnect Technologies have signed a licensing agreement under which AIT will license LSI Logic's organic laminate flip chip FPBGA technology

Vishay Intertechnology Inc. has begun sampling solid capacitors that use niobium as the anode material.

Texas Instruments (TI) has recently introduced a new logic family, the advanced ultra-low voltage CMOS (AUC); the products in this family are optimized at 1.8 V but are operational to sub-1-V levels

One of the clichés that you hear during slow times in the electronics industry is that a lull gives manufacturers the chance to develop new products rather than focusing on getting more of the same old products out the door

The supplies used to protect and transport critical materials in the semiconductor industry are becoming more consequential in the current business and technical environment

Increasing board-level solder joint reliability

Solutions for wafer edge processing

A simplified technique for modeling heat pipe assisted heat sinks